Solstice Advanced Materials Inc. · NASDAQ:SOLS
Solstice Advanced Materials — Merger or Acquisition (July 2026)
21 slides from Solstice Advanced Materials's merger presentation, Jul 6, 2026
Slide 1: Creating an Industry-Leading Advanced Materials Platform
July 6 th , 2026 Creating an Industry - Leading Advanced Materials Platform Aligned to Serving Attractive Secular Growth Markets 1
Slide 2: Today's Presenters
+ Today’s Presenters David Sewell President & Chief Executive Office r, Solstice Advanced Materials Tina Pierce Chief Financial Officer , Solstice Advanced Materials Ben Gliklich Chief Executive Officer , Element Solutions 2 +
Slide 3: Cautionary Statement Regarding Forward-Looking Statements
+ Cautionary Statement Regarding Forward - Looking Statements This communication contains certain forward - looking statements within the meaning of the federal securities laws made pursuant t o the safe harbor provisions of the Private Securities Litigation Reform Act of 1995 with respect to the pr
Slide 4: Creating An Industry-Leading Advanced Materials Platform
+ Creating An Industry - Leading Advanced Materials Platform 4 Highly - Synergistic Combination Expected ability to unlock potential substantive growth & profitability through streamlined operations, combined efficiencies, and enhanced co - innovation pipeline; estimated $180M+ 1 in identified syner
Slide 5: Transaction Overview
+ 5 Transaction Overview Timing Governance Capital Structure Financial Impact • Solstice to acquire Element Solutions (NYSE: ESI) in a cash and stock transaction valued at approximately $14.5 billion • Element shareholders to receive $10.00 in cash and 0.500 shares of Solstice common stock for each
Slide 6: Element Solutions at a Glance
+ Source: Element Solutions 2026 Investor Day presentation; Adj. EBITDA and Adj. EBITDA margin include, pro forma adjustment of $61m from the impact of t he for acquisitions of Micromax and EFC Gases. 1 N on - GAAP measure; see slide 3 for more information. 2 FCF number per 2025 FY 2025 earnings rel
Slide 7: Combined Company Aligned to Attractive End-Markets
+ Combined Company Aligned to Attractive End - Markets 7 Net Sales $6.8B Adj. EBITDA 1 $1.7B Combined Solstice By Geography 2 Patents owned / pending / licenses 8,300+ Advanced Packaging Thermal Chip Management Uranium Conversion Data Center Cooling Copper Interconnects Nuclear Services Unique Combi
Slide 8: Acquisition Aligned with Strategic Pillars
+ Acquisition Aligned with Strategic Pillars 8 Growth of Advanced Computing Environmental & Energy Evolution Improving Health Outcomes Personal Safety & Defense • Denser, higher power chips require new materials and next generation thermal management technologies • Regulatory and policy goals requir
Slide 9: Advanced Computing Driving Demand for Integrated Solutions
+ Advanced Computing Driving Demand for Integrated Solutions Thermal Management Advanced Packaging Connect Industry Trend AI driven leading edge semiconductor growth outpacing overall industry Impact Need for high performance & reliability Industry Trend High density multi - chip Advance Packaging H
Slide 10: Combined Company to Capture End-to-End Value Chain
+ Combined Company to Capture End - to - End Value Chain Patterning Planarization Doping Etching Cleaning Blank wafer Via Formation Inner Layer Circuit Formation Electroless plating Cu E tching RDL, TSV Micro - Pillar Wafer Bumping Die A ttach Chip Protection Flip C hip A ttach Element Exposure Sols
Slide 11: Combined Portfolio Provides End-to-End Solutions
+ Combined Portfolio Provides End - to - End Solutions 11 Synergy Opportunity Atmospheric & Specialty Gases Photoresist & Ancillary Chemicals CMP Slurries, Pads & Conditioners Wet Processing Chemicals Deposition Technologies 1 Advanced Nodes Chip Fabrication DD Growth Advanced Packaging DD Growth PC
Slide 12: Copper Expertise to Improve Connection & Signal Strength
+ 12 Copper Expertise to Improve Connection & Signal Strength x Higher yield and reliability: Co - optimized materials reduce defects and lowers variability. x Compatibility assurance: Seed and fill are qualified together, with tighter purity. x Lower customer burden: One single - source set cuts ma
Slide 13: Combined Complementary Thermal Management Solutions
+ Combined 13 Complementary Thermal Management Solutions End - to - End Offerings to Better Solve Our Customers’ Complex Challenges 1 2 3 4 5 6 Heat Sink 1 Thermal Interface Material (TIM2) 2 Heat Spreader 3 Thermal Interface Material (TIM1) 4 Die (Cu) 1 5 Packaging Substrate 6
Slide 14: Thermal Management Leader from the Die to Data Center
+ Thermal Management Leader from the Die to Data Center 14 Combined Portfolio Expected to Meet the Growing Demand for High Performing Thermal Solutions … through the Data Center… Thermal Management from the Chip Level… Server Rack Density (kW/Rack) Chip Power (W) Air Cooling LGWP refrigerants for us
Slide 15: Enabling Next Generation Electronics Innovation
+ Enabling Next Generation Electronics Innovation 15 Product Description Example ActiveCopper TM • Nano - copper material technology • Improved advanced packaging yield and throughput • Delivers unmatched thermal and power performance At the Forefront of Industry Innovation Targets for Advanced Pack
Slide 16: Complementary Go-to-Market Capabilities
+ Innovation Technical Service Product Complementary Go - to - Market Capabilities 16 Complementary portfolios expected to create a stronger, more differentiated partner, bringing together end - to - end solutions that help customers build a future - ready value chain Synthetic & Fine Chemical Exper
Slide 17: Significant Potential Value Creation from Synergies
+ Other Cost Opportunities $35M Significant Potential Value Creation from Synergies $180M+ Operational S avings $100M Footprint Optimization $20M Supply Chain Improvements $25M Note: 1 Refers to EBITDA uplift $180M+ in Expected Annualized Net Synergies 1 By Year 3 Strong Customer Collaboration • Enh
Slide 18: Strong Combined Financial Profile
+ Note: For illustrative purposes; ¹ Solstice and Element Solutions Adj. EBITDA and Adj. EBITDA margin are n on - GAAP measures , Element Solutions Adj. EBITDA includes a pro - forma adjustment of $61m from the impact of the acquisitions of Micromax and EFC Gases. 2 Refers to Solstice Adjusted stand
Slide 19: Commitment to Capital Discipline
+ Commitment to Capital Discipline 19 ■ Funding the $ 14.5 B cash - and - stock acquisition through a mix of Solstice equity issued to Element Solutions shareholders, new debt, and cash on hand. Fully committed bridge financing from Goldman Sachs ■ Expect net leverage 1 of approximately 3.5x at clos
Slide 20: Delivering Sustainable Value by Driving Customer Success
+ Delivering Sustainable Value by Driving Customer Success 20 Comprehensive, integrated electronics platform End - to - end offerings for the manufacturing of semiconductors Attractive combined company financial profile Expected enhanced growth, margins, and cash flow conversion Industry - leading s
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