Nan Ya Printed Circuit Board Corporation · TWSE:8046

Nan Ya Printed Circuit Board — CLSA Taiwan Access Days 2010

16 slides from Nan Ya Printed Circuit Board's conference presentation, March 2010

  1. Slide 1: Company Briefing

    NAN YA PCB CORPORATION COMPANY BRIEFING March 2010 2010 NYPCB, All Rights Reserved. PAGE 1

  2. Slide 2: Safe Harbor Notice

    NAN YA PCB CORPORATION Safe Harbor Notice Nan Ya PCB’s statements of its current expectations are forward-looking statements subject to significant risks and uncertainties and actual results may differ materially from those contained in the forward-looking statements. Except as required by law, we u

  3. Slide 3: Vertical Integration within FPG

    NAN YA PCB CORPORATION FPG Introduction Vertical Integration within FPG Copper CopperOre Ore Crude CrudeOil Oil Sand Sand Copper Oil OilRefinery Refinery Glass Outside- Copper Naphtha GlassYarn Yarn Wafer Wafer Refinery NaphthaCrake Crake 1991 1998 Buying Refinery 1998 1998 1991 1998 Copper CopperFo

  4. Slide 4: Milestone

    NAN YA PCB CORPORATION Company Introduction Milestone Year 1985 Start up PCB mass production Year 1997 Establish Na Ya PCB Corporation Year 2000 Start up Wire-bond Substrate mass production Year 2001 Start up Flip-chip Substrate mass production Year 2002 Start up Kunshan PCB mass production Year 200

  5. Slide 5: Production Allocation and Monthly Capacity

    NAN YA PCB CORPORATION Company Introduction Production Allocation and Monthly Capacity + + + Flip Chip P6 8M Units P7 7M Units P8 (Potential 15M Units) P1+P5 15M Units Wire Bond + P2 320KSF KS P2 225KSF PCB, HDI + + P3 160KSF KS P1 1.2MSF KS P2 600KSF Note: KS=Kunshan China manufacturing campus 2010

  6. Slide 6: Structure of Shareholders

    NAN YA PCB CORPORATION Company Introduction Structure of Shareholders ABP 0.5% Others GIC 0.5% 24.7% Fidelity Greater China Fund 0.5% Capital High Tech Fund 0.6% Nan Ya Plastics Shin Kong Life Insurance 0.7% 65.3% Standard Chartered Emerging Market 0.7% Citi Asia Fund 1.9% Nan Shan Life Insurance 1.

  7. Slide 7: 2009~2010 Monthly Revenue in Taiwan

    NAN YA PCB CORPORATION Company Current Status 2009~2010 Monthly Revenue in Taiwan NT$ M 4,500 2009 2010 4,000 3,500 3,000 2,671 2,574 2620 2702 2683 2,646 2,696 2,364 2,334 2,500 2,201 2,179 1,967 2,000 1,507 1,500 967 1,000 500 0 Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec 2010 February Sales =

  8. Slide 8: 2010 Sales Breakdown by Application

    NAN YA PCB CORPORATION Company Current Status 2010 Sales Breakdown by Application Automotive 1% Networking 5% Consumer 5% PC&Peripheral 13% IC Substrate 76% 2010 NYPCB, All Rights Reserved. PAGE 8

  9. Slide 9: Products & Applications - PC

    NAN YA PCB CORPORATION Company Current Status Products & Applications-PC GPU CPU FC-BGA FC-PGA Conventional PCB PC Motherboard North Bridge FC-BGA South Bridge WB-BGA DDRⅡ ⅡDRAM Module 2010 NYPCB, All Rights Reserved. PAGE 9

  10. Slide 10: Products & Applications - Game Console

    NAN YA PCB CORPORATION Company Current Status Products & Applications-Game Console A B MPU FC-BGA 27mm2 2/2/2 C Integrated Chipset Integrated Chipset MPU FC-BGA FC-BGA FC-BGA 35mm2 42.5mm2 33mm2 3/2/3 3/2/3 2/2/2 MPU Integrated Chipset FC-BGA FC-BGA 21mm2 31mm2 2/2/2 2/2/2 2010 NYPCB, All Rights Res

  11. Slide 11: Products & Applications - Others

    NAN YA PCB CORPORATION Company Current Status Products & Applications-Others Set-Top Box HDTV Chipset 37.5mm2 35mm2 2/2/2 2/2/2 Set-Top Box and HDTV started to migrate to flip-chip design in 2007, and annual demand has been expected to increase dramatically in 2010 . 2010 NYPCB, All Rights Reserved.

  12. Slide 12: Thank You Q & A

    NAN YA PCB CORPORATION Thank You Q&A 2010 NYPCB, All Rights Reserved. PAGE 12

  13. Slide 13: IC Substrate Introduction

    NAN YA PCB CORPORATION Appendix 1 IC Substrate Introduction Wire Bonding Substrate Outline： ： By using gold wires to connect electrical pads with the so-call wire bonding substrate which plays the function as the buffer between chips and motherboard. Wire Bond Substrate Motherboard Flip Chip Substra

  14. Slide 14: Types of Wire Bonding Substrates

    NAN YA PCB CORPORATION Appendix 2 Types of Wire Bonding Substrates •Ball Grid Array (BGA) Plastic Ball Grid Array (PBGA) Window BGA •Chip Scale Package (CSP) Wire Bonding CSP (WB-CSP) Flip Chip CSP (FC-CSP) 2010 NYPCB, All Rights Reserved. PAGE 14

  15. Slide 15: Types of Flip Chip Substrates

    NAN YA PCB CORPORATION Appendix 3 Types of Flip Chip Substrates •FC-Pin Grid Array (FC-PGA) •FC-Land Grid Array (FC-LGA) •FC-Ball Grid Array (FC-BGA) 2010 NYPCB, All Rights Reserved. PAGE 15

  16. Slide 16: FC Substrate Development Trend

    NAN YA PCB CORPORATION Appendix 4 FC Substrate Development Trend CPU Development Integrated-Chipset Packaging Status 2 (GHz) Multi-Chipset Packaging Status 1 3.33 4+4+4 37.5x37.5mm Multi-Core 2.66 Dual-Core 5+4+5 37.5x37.5mm 2.33 Pentium 4 (Mainly for high-end product) 2+4+2 2+4+2 37.5mmSQ Chip on B

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