ASML Holding NV · EURONEXT:ASML
ASML Holding NV — Investor Day (September 2021)
27 slides from ASML Holding NV's investor day presentation, Sep 29, 2021
Slide 1: DUV Products and Business Opportunity
DUV Products and Business Opportunity Ron Kool Executive Vice President Business Line DUV Public
Slide 2: DUV products and business opportunity: Key messages
DUV products and business opportunity Key messages Slide 2 29 Sept. 2021 DUV demand is at a record high and expected to remain strong for the foreseeable future driven by both the Advanced and the Mature market segments Innovation in technology for the Advanced Logic and Memory market will continue;
Slide 3: Markets
• Markets Advanced Logic and Memory Mature Logic and Analog nodes, and More than Moore markets Installed base Public
Slide 4: DUV business outlook improved significantly
DUV business outlook improved significantly Driven by strong markets, increased process complexity and installed base growth Slide 4 29 Sept. 2021 2018 DUV installed base DUV installed base 20% 50% 50% 2025 2018 80% DUV systems DUV systems In 2018 our forecast assumed a reduction in immersion demand
Slide 5: DUV business outlook improved significantly
DUV business outlook improved significantly Driven by strong markets, increased process complexity and installed base growth Slide 5 29 Sept. 2021 2021 DUV installed base DUV installed base 30% 25% 2025 2021 75% 70% DUV systems DUV systems Drivers include technology innovation, increase in process c
Slide 6: DUV addresses numerous market segments
DUV addresses numerous market segments SPECIALTY MEMORY Slide 6 MATURE LOGIC 29 Sept. 2021 300 mm 300 mm 200 mm LOGIC Sub - segmentation 300 mm ANALOG Front-End Applications “More Moore” 300 mm Special Applications Mature “More than Moore” segments 200 mm POWER 300 mm Advanced (≥ 40nm) MPU segments
Slide 7: Projection of lithography layers by technology
Projection of lithography layers by technology Lithography layer count grows, driven by DUV and EUV Slide 7 IR Sep 2021 KrF Logic Layer stack 5 nm 3 nm 2 nm ~1.5 nm 1 nm KrF DRAM Layer stack EUV – High-NA EUV 1A 1B 1C 0A 0B DUV KrF 3D-NAND Layer stack 176L 2xxL 3xxL 4xxL 5xxL 2021 ~2030 Source: ASML
Slide 8: Our end markets are increasingly interdependent
Our end markets are increasingly interdependent Requiring an integral portfolio of solutions Slide 8 29 Sept. 2021 EUV 150 mm ArFi LNA diversity low ANALOG 130 nm 200 mm 180 nm Mid/High 200 mm ArF band diversity LNA POWER diversity Mid/High 55 nm OPTICAL 180 nm SENSORS 130 nm 300 mm 180 nm 5G mmWave
Slide 9: DUV product portfolio to support all market segments
DUV product portfolio to support all market segments Slide 9 29 Sept. 2021 Wavelength NA, Half pitch 2020 2021 2022 2023 2024 2025 NXT:2000i NXT:2050i NXT:2100i NEXT critical 2.0 nm | 275wph 1.5 nm | 295wph 1.3 nm | 295wph ArFi 1.35 NA, 38 nm mid - critical NXT:1980Di NXT:1980Ei NXT:1980Fi 2.5 nm |
Slide 10: NXT transition improves KrF and ArF productivity significantly
NXT transition improves KrF and ArF productivity significantly Slide 10 29 Sept. 2021 27% Wafers per hour 330 260 KrF XT:860N NXT:870 2021 2022 46% Wafers per hour 300 205 ArF NXT:1470 first litho system XT:1460 NXT:1470 to show >300wph 2019 2021 Public
Slide 11: We will support our customers' wafer demand
We will support our customers’ wafer demand By increasing factory output and scanner productivity Slide 11 29 Sept. 2021 Yearly system capability x system productivity (wph) ~1.7X growth t c apabilit y fer outpu a c turing w fa ML manu AS 2019 2020 2021 2022 ArFi ArF KrF I-Line Public
Slide 12: Markets
Markets • Advanced Logic and Memory Mature Logic and Analog nodes, and More than Moore markets Installed base Public
Slide 13: NXT:2050i in volume manufacturing at customers
NXT:2050i in volume manufacturing at customers 20% overlay improvement, faster reliability and productivity ramp-up Slide 13 29 Sept. 2021 NXT:2050i Matched machine Dedicated chuck overlay ~1.2 nm overlay ~0.8 nm 6000 5,000 wafers per day in 18 days 200 180 hours reliability in 13 weeks 180 5000 NXT
Slide 14: NXT:2100i makes a 20% step in on product overlay
NXT:2100i makes a 20% step in on product overlay vs the NXT:2050i for a typical DRAM application Slide 14 29 Sept. 2021 Reticle handler Faster conditioning and lower reticle- to-reticle temperature variation Projection optics Improved lens and cross matching Wafer table control Improved overlay & li
Slide 15: NXT platform reduces capital investment, fab space
NXT platform reduces capital investment, fab space NXT brings 17% footprint reduction with 100k wafer starts per month Slide 15 29 Sept. 2021 Use case: 100 kwspm 5 ArF (dry) layers 20 KrF layers Fab pattern area Fab pattern area 172m² 5 x XT:1460K (205wph) 140m² 4 x NXT:1470 (300wph) ArF(dry) ArF(dr
Slide 16: Markets
Markets Advanced logic and memory • Mature logic and analog nodes, and More than Moore markets Installed base Public
Slide 17: We support the growth in mature Logic and Analog nodes
We support the growth in mature Logic and Analog nodes delivering ~30% improved productivity for the same process capability Slide 17 29 Sept. 2021 350 NXT:1980Fi 300 XT:860N XT:400M 250 XT:1460K Wafers per hour NXT:1960Bi 200 XT:860H XT:400H XT:1450H 150 100 50 0 NXT XT 2013 2023 2013 2023 2013 202
Slide 18: Mature Markets: differentiated application space
Mature Markets: differentiated application space Strong growth expected short- and long-term driven by existing and new Slide 18 29 Sept. 2021 applications Substrate Substrate ANALOG MATURE OPTICAL NON - OPTICAL POWER Size [mm] Thickness [µm] LOGIC SENSORS SENSORS Thick 300 mm Standard (775) Si Si S
Slide 19: More than Moore market supported by the XT platform
More than Moore market supported by the XT platform with application specific alignment and wafer handling options Slide 19 29 Sept. 2021 XT platform: ArF, KrF, i-line Wafer handling options Alignment options Wafer size: 150/200/300 mm Alignment through glass Wafer thickness: 0.3 - 1.5 mm Backside a
Slide 20: Markets
Markets Advanced Logic and Memory Mature Logic and Analog nodes, and More than Moore markets • Installed base Public
Slide 21: Over 1,000 systems exposed more than 1 million wafers in 2020
Over 1,000 systems exposed more than 1 Million wafers in 2020 16 systems exposing more than 2 million 300 mm wafers per year Slide 21 29 Sept. 2021 341 > 1.000.000 971 1.057 > 1.500.000 > 2.000.000 Wafers per year 862 Wafers per year Wafers per year 16 738 235 579 178 494 380 126 316 268 74 147 45 3
Slide 22: Opportunities for the installed base productivity
Opportunities for the installed base productivity Wafer per day products Slide 22 29 Sept. 2021 Enhancement packages Wafer per day services Expand fab capacity at minimal lead time and investment Public
Slide 23: DUV immersion – upgrade roadmap
DUV immersion – upgrade roadmap System Node extension package Productivity package System modularity creates fab flexibility customers Under study Slide 23 29 Sept. 2021 330wph Matched 190wph 230wph 250wph 275wph 295wph Machine Overlay NXT:1950i 5.5 nm NXT:1960Bi 4.5 nm NXT:1965Ci 4.5 nm NXT:1970Ci
Slide 24: Services and upgrades extend value and life of tool
Services and upgrades extend value and life of tool Main upgrades over NXT scanner life Slide 24 29 Sept. 2021 System Service Upgrades PEP Software Example: NXT:1960Bi SNEP UVLS Upgrades revenue Service revenue System revenue 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023
Slide 25: DUV products and business opportunity: Key messages
DUV products and business opportunity Key messages Slide 25 29 Sept. 2021 DUV demand is at a record high and expected to remain strong for the foreseeable future driven by both the Advanced and the Mature market segments Innovation in technology for the Advanced Logic and Memory market will continue
Slide 26: Forward Looking Statements
Forward Looking Statements Slide 26 29 Sept. 2021 This presentation contains statements that are forward-looking, including statements with respect to expected industry and business environment trends including expected growth, outlook and expected financial results, including expected net sales, gr
Slide 27: Investor Day Virtual
C—O Pita Investor Day Virtual