Tainergy Tech Co., Ltd. · TWSE:4934

Tainergy Tech — Investor Presentation (November 2020)

36 slides from Tainergy Tech's investor presentation, Nov 18, 2020

  1. Slide 1: Trend and Prospect of 3rd Gen. Semiconductor Materials

    Trend and Prospect of 3rd Gen. Semiconductor Materials Tainergy Tech Co., Ltd.

  2. Slide 2: Safe Harbor Notice

    Safe Harbor Notice The information provided in this presentation contains forward-looking statements. This forward-looking statement will be affected by risks, uncertainties and inferences, some beyond our control, and actual results may differ materially from these forward-looking statements. As a

  3. Slide 3: Outline

    Outline 1. Company Profile 2. Introduction & Application of 3rd Gen. Semiconductor Materials 3. Overview of SiC Market 4. SiC Substrate Process 5. Conclusions 3

  4. Slide 4: Outline: Company Profile

    Outline 1. Company Profile 2. Introduction & Application of 3rd Gen. Semiconductor Materials 3. Overview of SiC Market 4. SiC Substrate Process 5. Conclusions 4

  5. Slide 5: Company Profile

    Company Profile • Tainergy Tech Co., Ltd. • IPO:Aug. 2011 (TSEC:4934) • Established : 2007/5/14 • Capital: NTD 2 Bill. • President :Hsieh, Ching-Fu • General Manager :Vincent Hsieh • Operating Base:Zhongli/Taiwan、Kunshan/China、 Hanoi/Vietnam • Major Investor:Kenmec Shareholding %:28.83% • Major Prod

  6. Slide 6: Organizational Chart

    Organizational Chart Tainergy(4934) NTD2 Bill. Zhongli/Taiwan 64% | Taisic || Tainergy! | Vinergy MATERIALS || Samoa | ! NTD10 Mill. | | | | usp42 Mil. Zhongli/Taiwan | | USD70 Mill. || ysnoi/Vietnam | eee | StarSolar NTD5 Mill. Zhongli/Taiwan a Tainergy Kunshan USD70 Mill. Kunshan SENSIC Kunshan Ji

  7. Slide 7: SiC BU

    SiC BU Subsidiary: TAISIC Materials Corp. Founded:Jun. 2020 Representative:Kevin Hsieh Main Product:SiC Substrates Investors:Tainergy 64% Kenmec 10% 7

  8. Slide 8: Outline: Introduction & Application of 3rd Gen. Semiconductor Materials

    Outline 1. Company Profile 2. Introduction & Application of 3rd Gen. Semiconductor Materials 3. Overview of SiC Market 4. SiC Substrate Process 5. Conclusions 8

  9. Slide 9: Category of Semiconductor Materials

    Category of Semiconductor Materials Materials Applications Properties • Abundant Si element in nature • Mature purification & crystal growth technology • Excellent isolation properties of 1st Gen. Ge、Si Microelectronics, IE SiO2 • Restrictions on optoelectronic and HF applications due to Si physical

  10. Slide 10: Advantages of SiC Devices

    Advantages of SiC Devices High Power Applications Ultra High Working Voltage Ultra High Frequencies More Stable at High Temp. Excellent Radiation Resistance Smaller Module Size 10

  11. Slide 11: Physical Properties of SiC

    Physical Properties of SiC Properties Si SiC GaN Bandgap eV 1.12 3.26 3.39 Electron Mobility cm2/V-s 1450 900 2000 Electron Field for MV/cm 0.3 3.5 3.5 Breakdown Saturated Drift Velocity x 106 cm/s 10 22 25 Thermal Conductivity W/cm/K 1.5 4.5 1.3 11

  12. Slide 12: Comparison of Physical Characteristics

    Comparison of Physical Characteristics 12

  13. Slide 13: Comparison of SiC Substrates

    Comparison of 2 SiC Substrates N-type Semi-insulating Resistivity Ohm-c 0.015-0.028 > 1E6 m Range Orientation 4° Off On-axis 350µm 500µm Thickness +/-25µm +/-25µm Epitaxy SiC GaN Applications Electronic Power RF 13

  14. Slide 14: Comparison of Substrates for GaN Epitaxy

    Comparison of Substrates for GaN Epitaxy Sapphire Si SiC GaN Lattice Constant (Å ) 2.75 5.43 3.08 3.19 Lattice mismatch with GaN (%) 16 17 3.4 - Coefficient of thermal expansion (10-6K-1) 7.5 2.6 4.2 5.6 Thermal conductivity 0.2 1.5 4.5 1.3 (W/cm/K) Maximum substrate 8” 12” 6” commercially available

  15. Slide 15: GaN-on-SiC in PA Applications

    GaN-on-SiC in PA Applications 15

  16. Slide 16: SiC Device Applications

    SiC Device Applications SiC Substrates N-type SI Power Devices MW Devices LED (SBD、MOSFET…) (HEMT) LED UPS xEV PV 5G small cells Wind Power Satellite RADAR HSR 16

  17. Slide 17: GaN-on-Si vs GaN-on-SiC

    GaN-on-Si vs GaN-on-SiC GaN-on-Silicon + ; : GaN-on-SiC will be dedicated in : ; improving performance and an : Mobile : acceptable price would be satisfying. : handset? : GaN-on-SiC : RF Energy : Cost Performance driven driven: GaN-on-Silicon will be a good amelioration. Device Cost 17

  18. Slide 18: Applications of High Power SiC & GaN Modules

    Applications of High Power SiC & GaN Modules Low-Voltage Medium-Voltage High-Voltage PFC/Power supply PV Inverter Motor Ship&Vessels Smart Power Grid Control Wind Rail EV/HEV UPS Audio Amplifer Mills Transport <200V 600V 900V 1.2kV 1.7kV 3.3kV 6.5kV+ SiC diodes GaN-on-Si Transistors Battle fields Si

  19. Slide 19: Outline: Overview of SiC Market

    Outline 1. Company Profile 2. Introduction & Application of 3rd Gen. Semiconductor Materials 3. Overview of SiC Market 4. SiC Substrate Process 5. Conclusions 19

  20. Slide 20: Power vs Frequency for Various Materials

    Power vs Frequency for Various Materials Source: Analog Devices 20

  21. Slide 21: Prediction of RF GaN Device Market

    Prediction of RF GaN Device Market 21

  22. Slide 22: Prediction of RF GaN Device Market

    Prediction of RF GaN Device Market 22

  23. Slide 23: Global Demands for 5G small cells

    Global Demands for 5G small cells Global Demands for 5G small cells will be up to 10.25 millions 23

  24. Slide 24: Industrial Chain of SiC

    Industrial Chain of SiC Material Ingot Wafer Epi-wafer IC Devices Modules In House Crystal Finishing Growth Epitaxy Foundry Package ACME、 USIO 4934Tainergy (Taisic) Cree、Ⅱ-Ⅵ、GTAT、Rohm Wolfspeed、Rohm、Infineon、ON Semi、 SK Siltron(DuPont)、NSC Qorvo、Mitsubishi、STMicroelectronics、 TenkeBlue、SICC、Semicore

  25. Slide 25: Prediction of SiC Communication Device Market

    Prediction of SiC Communication Device market It is estimated that the market growth will exceed 3 times in the next five years →$1.3 billion in 2023 25 Ref. : Yole Report 2018.

  26. Slide 26: Outline: SiC Substrate Process

    Outline 1. Company Profile 2. Introduction & Application of 3rd Gen. Semiconductor Materials 3. Overview of SiC Market 4. SiC Substrate Process 5. Conclusions 26

  27. Slide 27: Crystal Growth of SiC

    Crystal Growth of SiC 方法 LPE HTCVD PVT 圖示 LPE: Liquid Phase Epitaxial HTCVD: High Temperature Chemical Vapor Deposition PVT: Physical Vapor Transport 27

  28. Slide 28: Schematic of SiC PVT Crystal Growth

    Schematic of SiC PVT Crystal Growth 1. it is impossible to in-situ observe the crystal growth in the black box of graphite crucible. The SiC crystal seeds, graphite crucible and high-purity SiC raw materials can not be used again. It has to destroy the crucible to confirm the success or failure of t

  29. Slide 29: Growth Process of SiC Crystal by PVT Method

    Growth Process of SiC Crystal by PVT Method 1. T > 1800℃,sublimation- decomposition reaction: 2. Gas phase transmission; 3. Recrystallization in supersaturated state: 29 29

  30. Slide 30: Features of SiC Crystal Growth

    Features of SiC Crystal Growth Long Time Short Length High Purity Si:3~4 days Si:200 cm Raw materials SiC:7 days SiC:2 cm and Seed 30

  31. Slide 31: Summary of SI-SiC Crystal Growth

    Summary of SI-SiC Crystal Growth High purity Crystal Growth Vanadium Doping  The resistance of SI-SiC substrate is required to be more than 1e6 Ω· cm. There are two technologies to meet requirements: 氮 硼 1. By doping vanadium to modify the electrical properties of the substrate. It will cause 釩 cry

  32. Slide 32: Process Flow of SiC Ingot

    Process Flow of SiC Ingot crystal head and surface orientation growth tail cut grinding ingot check edge cut orientation rounding 32

  33. Slide 33: Process Flow of SiC Wafer

    Process Flow of SiC Wafer orientation cutting annealing grinding QC cleaning polishing chamfering 33

  34. Slide 34: Outline: Conclusions

    Outline 1. Company Profile 2. Introduction & Application of 3rd Gen. Semiconductor Materials 3. Overview of SiC Market 4. SiC Substrate Process 5. Conclusions 34

  35. Slide 35: Conclusions

    Conclusions • There will be explosively market growth in SiC applied in both power devices and HF communications in the near future. • It is the prime time to invest in SiC substrate business, as the technology barriers and demand more than supply. • Tainergy and the subsidiary TASIC have actively s

  36. Slide 36: Tainergy 4934: Into The New Semiconductor Era

    Tainergy 4934 Into The New Semiconductor Era

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