Slide 1: Innodisk Corporate Investor Conference (Symbol: 5289)
© COPYRIGHT INNODISK CORPORATION Innodisk Corporate Investor Conference (Symbol: 5289) Randy Chien, Chairman 2026.08.27
Slide 2: Disclaimer
© COPYRIGHT INNODISK CORPORATION P1 DISCLAIMER This file and the financial information and forecast information are based on information obtained by the company from internal and external sources. The actual operating results and financial conditions of the company may differ from these predictive s
Slide 3: Agenda
© COPYRIGHT INNODISK CORPORATION P2 ▪ Company Profile and Overview ▪ Market Trend and Product Strategy AGENDA ▪ AI in Action Global Campaign ▪ ESG Commitment ▪ Financial Information ▪ Q&A
Slide 4: Company Profile & Overview
© COPYRIGHT INNODISK CORPORATION P3 COMPANY PROFILE & OVERVIEW
Slide 5: Corporate Overview
CORPORATE OVERVIEW © COPYRIGHT INNODISK CORPORATION P4 REVENUE CAPITAL EPS NT$ 35.62B NT$964M NT$166.45 (2026 1H) (2026 1H) PATENTS CUSTOMERS 211 4,000+
Slide 6: Global Business Operations
© COPYRIGHT INNODISK CORPORATION P5 GLOBAL BUSINESS OPERATIONS California Beijing Netherlands New Jersey Tokyo Jinan/ Hangzhou/ France Germany Suzhou/ Boston Shanghai Korea Chengdu Texas Guangzhou Taiwan Shenzhen Vietnam Innodisk HQ / R&D and Production Center / Research Center Locations Employees 2
Slide 7: R&D & Manufacturing Center
© COPYRIGHT INNODISK CORPORATION P6 Lot Size Floor Area: Floor Area: 2026 Capacity Maximum Capacity (Sq. Meter) 1st building (Sq. Meter) 2nd building (Sq. Meter) (SMT x 6) (SMT x 8) Edge AI System and Solution 27,000 12,000 15,000 Edge AI Embedded Peripheral Edge AI Camera Module 1,080K 1,440K YILAN
Slide 8: Innodisk Headquarters
© COPYRIGHT INNODISK CORPORATION P7 SPACE Total :19,800 m² 17F 1,650 m² / Aetina 16F 3,300 m² / R&D Center, Sports & Activity Center, Training Room 7F 3,300 m² / Aetina 660 m² 5F 3,300 m² 4F 3,300 m² INNODISK 3F 3,300 m² 2F 1,650 m² / Aetina 660 m² HEADQUARTERS
Slide 9: Quality & Sustainability: Our Top Priority
© COPYRIGHT INNODISK CORPORATION P8 PRODUCTION 1,440K / Maximum Capacity (SMT x 8) ISO9001 / ISO14001 / ISO45001 / CERTIFICATIONS QC080000 / ISO14064-1 / ISO27001 / IEC62443-4-1 MANUFACTURING New Taipei City / Yilan County QUALITY & SUSTAINABILITY: OUR TOP PRIORITY
Slide 10: Market Trend & Product Strategy
© COPYRIGHT INNODISK CORPORATION P9 MARKET TREND & PRODUCT STRATEGY
Slide 11: AI Core: Computing, Memory, Storage
© COPYRIGHT INNODISK CORPORATION P10 AI CORE: COMPUTING, MEMORY, STORAGE Innodisk Group: Comprehensive AI Core Architecture ▪ Compute: CPU / GPU / NPU / AI ASIC ▪ Memory: DRAM Module ▪ Storage: Flash Storage ▪ Power: Thermal & Energy Management ▪ Connectivity: Optical Communication
Slide 12: 3 Core Values: Market & Product Technology
© COPYRIGHT INNODISK CORPORATION P11 3 CORE VALUES: Market & Product Technology 01 02 03 Market & Product Technology & Edge AI Integration & Application Value Talent Value Deployment Value Deploying a robust five-layer AI Bridging technology gaps with strong R&D AI redefines value creation across ar
Slide 13: 3 Core Values: Market & Product Technology
© COPYRIGHT INNODISK CORPORATION P12 3 CORE VALUES: Market & Product Technology 01 02 03 Market & Product Technology & Edge AI Integration & Application Value Talent Value Deployment Value Deploying a robust five-layer AI Bridging technology gaps with strong R&D AI redefines value creation across ar
Slide 14: Market & Application Value
© COPYRIGHT INNODISK CORPORATION P13 01 Market & Application Value AI Infrastructure ◼ GPU Server / Networking Switch / Router ◼ Humanoid Robot / Autonomous Global Vertical Leaders ◼ Medical / 5G / Surveillance / Entertainment / Automation ◼ Tier-1 Market Leaders High Value-added Industrial Solution
Slide 15: Market & Application Value: AI Infrastructure
© COPYRIGHT INNODISK CORPORATION P14 01 Market & Application Value AI Infrastructure Core Infrastructure for AI Computation, Smart Storage, Transmission, and Scaled Deployment CSP / Data Center / AI Optical & Network Robotics & Physical AI Enterprise AI Computing Communications Expanding AI training
Slide 16: Market & Application Value: Global Vertical Leaders
© COPYRIGHT INNODISK CORPORATION P15 01 Market & Application Value Global Vertical Leaders Driving Market Standards and Industry Innovation for Scaled Edge AI Deployment Healthcare Networking & Telecom Security & Surveillance Smart Manufacturing AI accelerates smart diagnostics, AI enables real-time
Slide 17: High Value-added Industrial Solution Providers
© COPYRIGHT INNODISK CORPORATION P16 01 Market & Application Value High Value-added Industrial Solution Providers Domain Expertise for 4,000+ Global Customers, Accelerating High-Value AI Deployment Deep Domain Know-How High Customization & High Value-Added Long Lifecycle Integration Complex industri
Slide 18: 3 Core Values: Market & Product Technology
© COPYRIGHT INNODISK CORPORATION P17 3 CORE VALUES: Market & Product Technology 01 02 03 Market & Product Technology & Edge AI Integration & Application Value Talent Value Deployment Value Deploying a robust five-layer AI Bridging technology gaps with strong R&D AI redefines value creation across ar
Slide 19: Product Technology & Talent Value
© COPYRIGHT INNODISK CORPORATION P18 02 Product Technology & Talent Value Stack 5: Software Stack 4: Sensing & Comm. Stack 3: Storage Stack 2: Memory Stack 1: Compute
Slide 20: Five-Layer Stack x Proprietary Tech Across All Layers
© COPYRIGHT INNODISK CORPORATION P19 02 Product Technology & Talent Value Five-Layer Stack × Proprietary Tech Across All Layers Stack 5: Software Stack 4: Sensing & Comm. Stack 3: Storage In-House Rapid Stack 2: Memory Firmware Deployment Industrial Custom Value-Add End-to-end solutions defined by M
Slide 21: Five-Layer Stack x Proprietary Tech Across All Layers
© COPYRIGHT INNODISK CORPORATION P20 02 Product Technology & Talent Value Five-Layer Stack × Proprietary Tech Across All Layers Stack 5: Software Stack 4: Sensing & Comm. Global Rigorous Localized Stack 3: Storage Validation & Support First-to- Testing Industrial Global Services & Resilient High-Gra
Slide 22: Five-Layer Stack x Proprietary Tech Across All Layers
© COPYRIGHT INNODISK CORPORATION P21 02 Product Technology & Talent Value Five-Layer Stack × Proprietary Tech Across All Layers Stack 5: Software Cross-Domain Full Life-Cycle Stack 4: Sensing & Comm. HW/FW Warranty Industrial Integration Tailored engineering support 100% In- R&D Team throughout the
Slide 23: Five-Layer Stack x Proprietary Tech Across All Layers
© COPYRIGHT INNODISK CORPORATION P22 02 Product Technology & Talent Value Five-Layer Stack × Proprietary Tech Across All Layers Multi-Interface & Custom Multi-Form- Stack 5: Software High-Speed Sensor Factor Design Solutions Transmission & Smart Connectivity LAN, Optical, Series, CAN, EtherCAT In-Ho
Slide 24: Five-Layer Stack x Proprietary Tech Across All Layers
© COPYRIGHT INNODISK CORPORATION P23 02 Product Technology & Talent Value AI Model Inference Engine Five-Layer Stack × Proprietary Tech Across All Layers BIOS / BSP / & Training Tools Driver MCP protocol expedite API / SDK Customization Agentic AI Cloud Device Support iVIT-T & iVIT-I Tool Kits Manag
Slide 25: Five-Layer Stack x Proprietary Tech Across All Layers
© COPYRIGHT INNODISK CORPORATION P24 02 Product Technology & Talent Value AI Model Inference Engine Five-Layer Stack × Proprietary Tech Across All Layers BIOS / BSP / & Training Tools Driver MCP protocol expedite API / SDK Customization Agentic AI Cloud Device Support iVIT-T & iVIT-I Tool Kits Multi
Slide 26: Stack 1: Compute
© COPYRIGHT INNODISK CORPORATION P25 Stack 1: Compute Powered by NVIDIA Qualcomm Intel 10,000 TOPS APEX-S100 Enterprise AI Computing APEX-X100 ◼ Enterprise AI Platform ◼ Fine-Tuning ◼ Multi-Agent AI Collab. ◼ 70B+ LLM Deployment APEX-P100 ◼ RAG AIB-AT78/68 1,000 TOPS High-Performance Edge AI Inferen
Slide 27: Stack 2 & 3: Memory & Storage
© COPYRIGHT INNODISK CORPORATION P26 Stack 2 & 3: Memory & Storage ENTERPRISE EDGE AI ENTERPRISE EDGE AI INDUSTRIAL EDGE AI AI Server / CSP Enterprise Private AI Server Industrial Vertical Market On-device SSD On-prem Edge AI / Central Cloud KV Cache SSD Data Center SSD DDR5 ECC SODIMM / DDR5 RDIMM
Slide 28: Stack 2: Memory
© COPYRIGHT INNODISK CORPORATION P27 Stack 2: Memory BREAKING AI ARCHITECTURE BOTTLENECKS EMPOWERING EDGE AI COMPUTING CXL AIC (ADD-IN-CARD) Breaking Edge Computing's Memory Barrier DDR5 8000MT/s RDIMM Edge AI Ultra-High-Speed Computing Engine ◼ Objective: Expand memory capacity for the next-gen AI.
Slide 29: Stack 3: Storage
© COPYRIGHT INNODISK CORPORATION P28 Stack 3: Storage PCIe Gen5 & 218-layer 3D NAND Flash MAXIMIZING SYSTEM BOOT RELIABILITY ACCELERATING LARGE-SCALE DATA THROUGHPUT DATACENTER SSD | BOOT DRIVE DATACENTER SSD | STORAGE DRIVE PCIe Gen5, 5TS4-P Series: E1.S and U.2 PCIe Gen5, 5TS-P Serries: U.2, EDSFF
Slide 30: Stack 4: Sensing & Comm.
© COPYRIGHT INNODISK CORPORATION P29 Stack 4: Sensing & Comm. REVOLUTIONIZING COMPACT SYSTEM BOOTING ENHANCING HIGH-EFFICIENCY DATA EXCHANGE 10GbE / 25GbE OPTICAL LAN MODULES 10GBE RJ45 LAN MODULE ◼ Space-Efficient: World's First M.2 Optical LAN Module Family for compact systems. ◼ Industrial-Grade:
Slide 31: Stack 4: Sensing & Comm. (GMSL2 Camera)
© COPYRIGHT INNODISK CORPORATION P30 Stack 4: Sensing & Comm. RUGGEDIZED LONG-RANGE VISION & CLARITY REDEFINING THE EDGE AI VISION STANDARD GMSL2 CAMERA SERIES INNODISK VISION SOLUTION: BUNDLE PACKAGE High-bandwidth, long-range, and low-latency transmission Seamless Integration. Rapid Deployment. Pr
Slide 32: Innovating in Software. Elevating Value at the Edge.
© COPYRIGHT INNODISK CORPORATION P31 Stack 5: Software INNOVATING IN SOFTWARE. ELEVATING VALUE AT THE EDGE. Enterprise & Building Industrial Automation Retail Intelligence Surveillance Intelligence Intelligence Intelligence Business Logic Layer iCAP iVIT innoPPE AccelBrain Service Communication Laye
Slide 33: 3 Core Values: Market & Product Technology
© COPYRIGHT INNODISK CORPORATION P32 3 CORE VALUES: Market & Product Technology 01 02 03 Market & Product Technology & Edge AI Integration & Application Value Talent Value Deployment Value Deploying a robust five-layer AI Bridging technology gaps with strong R&D AI redefines value creation across ar
Slide 34: Edge AI Integration & Deployment Value
© COPYRIGHT INNODISK CORPORATION P33 03 Edge AI Integration & Deployment Value Bridging Tech Gaps to Minimize Client Integration Effort iCAP Cross-Stack Software Architecture iVIT AccelBrain Self-developed cross-stack architecture integrating OS, BSP, drivers, BIOS, middleware, utilities, AI models,
Slide 35: Edge AI Integration & Deployment Value
© COPYRIGHT INNODISK CORPORATION P34 03 Edge AI Integration & Deployment Value Bridging Tech Gaps to Minimize Client Integration Effort AI System AI Application AI Solution End-use Scenario System End IHV ISV Integrator Customer Computing Equipment AI Model Distributor Power Stability Compatibility
Slide 36: Edge AI Integration & Deployment Value
© COPYRIGHT INNODISK CORPORATION P35 03 Edge AI Integration & Deployment Value Bridging Tech Gaps to Minimize Client Integration Effort AI System AI Application AI Solution End-use Scenario System End IHV ISV Integrator Customer Computing Equipment AI Model Distributor Power Bridging Bridging Bridgi
Slide 37: Innodisk Edge AI Building Blocks
INNODISK EDGE AI BUILDING BLOCKS © COPYRIGHT INNODISK CORPORATION P36 Device Management Cloud AI Platform iCAP Monitoring / OTA / Diagnostics Inference & Tuning AI-Stack SDK AccelBrain, AccelTune, IQ Studio, iVIT SOFTWARE / Model Deployment / Training / Optimization FIRMWARE Software Tools iSeries S
Slide 38: Exponential Growth, Global Market Leader, 4,000+ Customer Base
© COPYRIGHT INNODISK CORPORATION P37 Market & Application Value AI Infrastructure Exponential Growth ◼ GPU Server / Networking Switch / Router ◼ Humanoid Robot / Autonomous Global Vertical Leaders Global Market Leader ◼ Medical / 5G / Surveillance / Entertainment / Automation ◼ Tier-1 Market Leaders
Slide 39: R&D and Production Center Phases
© COPYRIGHT INNODISK CORPORATION P38 Phase 3 2026 Q4 (Scheduled to Break Ground) Phase 2 Phase 1 2024 (In Operation) 2018 (In Operation) Innodisk R&D and Production Center Construction of Phase 3 Building and Dormitory
Slide 40: Construction of Phase 3 Building and Dormitory
© COPYRIGHT INNODISK CORPORATION P39 Innodisk R&D & Manufacturing center Construction of Phase 3 Building and Dormitory Scheduled to Break Ground in 2026 Q4 Phase 3 Phase 2 Phase 1
Slide 41: Phase 3 Building and Dormitory
Phase 3 © COPYRIGHT INNODISK CORPORATION P40 Phase 2 Phase 1 Dormitory Phase 3 Phase 1 Dormitory
Slide 42: AI in Action Global Campaign
© COPYRIGHT INNODISK CORPORATION P41 AI IN ACTION GLOBAL CAMPAIGN
Slide 43: Computex 2026
© COPYRIGHT INNODISK CORPORATION P42 COMPUTEX 2026 @TAIWAN, TAIPEI
Slide 44: Innodisk AI in Action
© COPYRIGHT INNODISK CORPORATION P43 INNODISK AI IN ACTION Promote AI solutions with global partners AI EXPO @Taiwan IT Week @Japan Automate @USA Hardware Pioneer Max @United Kindom
Slide 45: ESG Commitment
© COPYRIGHT INNODISK CORPORATION P44 ESG COMMITMENT
Slide 46: Achievements & Highlights
© COPYRIGHT INNODISK CORPORATION P45 ACHEIVEMENTS & HIGHLIGHTS ECOLOGICAL HARMONY ◼ Maintaining a Corporate Governance Evaluation between 6% to Wuweigang Waterbird reserve: Biodiversity Three-Year Project 20%. ◼ Partner with local organizations on habitat protection, invasive species removal, and ◼
Slide 47: Financial Information
© COPYRIGHT INNODISK CORPORATION P46 FINANCIAL INFORMATION
Slide 48: Revenues and GPM over last 5 quarters
© COPYRIGHT INNODISK CORPORATION P47 Revenues and GPM over last 5 quarters NT$: K GPM 70% 25,000,000 65.0% 22,500,000 59.1% 60% 20,000,000 22,443,411 50% 17,500,000 15,000,000 32.8% 33.4% 13,182,608 40% 12,500,000 25.9% 30% 10,000,000 7,500,000 20% 4,806,689 5,000,000 3,807,401 3,028,429 10% 2,500,0
Slide 49: Net Profits and EPS over last 5 quarters
© COPYRIGHT INNODISK CORPORATION P48 Net Profits and EPS over last 5 quarters NT$: K EPS: NT$ NT$:K 12,000,000 115.00 110.00 108.93 105.00 100.00 10,000,000 95.00 90.00 85.00 80.00 8,000,000 75.00 70.00 57.49 65.00 60.00 6,000,000 55.00 10,368,072 50.00 45.00 4,000,000 40.00 35.00 9.15 30.00 2.02 6.
Slide 50: Revenue Breakdown by Product Lines
© COPYRIGHT INNODISK CORPORATION P49 Revenue Breakdown by Product Lines 2025Q2 2026Q1 2026Q2 6% 1% 2%1% 4% 1% 28% 34% 41% FLASH 52% FLASH FLASH 69% 61% DRAM DRAM DRAM DRAM FLASH AI Solutions Others
Slide 51: Revenue Breakdown by Regions
© COPYRIGHT INNODISK CORPORATION P50 Revenue Breakdown by Regions 100 1 1 90 12 20 22 80 26 70 16 26 60 50 20 20 15 40 16 15 13 30 20 25 24 27 10 0 2025Q2 2026Q1 2026Q2 Taiwan Europe America China Asia Others
Slide 52: 2026Q2 Operating Results
© COPYRIGHT INNODISK CORPORATION P51 2026Q2 Operating Results 2026Q2 2026Q1 QoQ 2025Q2 YoY Revenues 22,443,411 13,182,608 70.3% 3,028,429 641.1% Cost of good sold 7,853,799 5,391,251 45.7% 2,243,340 250.1% Gross profit 14,589,612 7,791,357 87.3% 785,089 1758.3% Operation expenses 1,443,892 941,157 5
Slide 53: Q&A
© COPYRIGHT INNODISK CORPORATION P52 Q&A
Slide 54: © COPYRIGHT INNODISK CORPORATION
© COPYRIGHT INNODISK CORPORATION