Wah Hong Industrial Corp. · TPEX:8240

Wah Hong Industrial — Technical Presentation

12 slides from Wah Hong Industrial's technical presentation

  1. Slide 1: MID for LDS 技術

    M I D for LDS 技術 „ MID 即為 Molded Interconnect Device 的簡稱。 „ 塑膠射出成形的元件，表面作出有三次元立體電線回路。主要取其 節省空間、組裝容易、高良率的優點。 „ 一個塑膠元件同時也是電路板，很明顯的， MID 成品零件少，體 積小，免除某些組合步驟，而材料需求也相對減少。 „ LDS技術 - Laser-Direct-Structuring 華宏新技股份有限公司 WAH HONG INDUSTRIAL CORP. 劉高佑 Johnny Liu Tel.: 886-3-270-9955 ext: 63150 Mobile: 886-925

  2. Slide 2: LDS MID技術優點-(1)

    LDS MID技術優點-(1) „ Full Additive Process: Selective metallization of thermoplastic injection molded parts by Laser-Direct-Structuring „ in only three Process Steps: „ Injection Moulding „ Laser Processing / Activation „ Metallization 2

  3. Slide 3: LDS MID技術優點-(2)

    LDS MID技術優點-(2) Flexibility by Laser Processing „ Flexible Process „ no extra tool, no mask „ processing directly from the CAD data „ Fast 3-D Structuring „ high dynamic laser beam deflection „ contactless processing „ High Resolution „ laser spot size < 100 µm 3

  4. Slide 4: LDS MID技術優點-(3)

    LDS MID技術優點-(3) ¾只需開塑膠模具，且打樣成本低. ¾可因應天線開發過程中多次修改需求. ¾採塑件電鍍，不影響天線之電氣特性與穩定度. ¾微小化程度佳，最小線路可達0.1mm, 最小間格達0.15mm. ¾天線體積較小，符合手機薄型化的趨勢. ¾設計&開發時間較短. 4

  5. Slide 5: MID for LDS製程

    MID for LDS製程 only three Process Steps „ Injection Molding „ Laser Processing „ Plating 5

  6. Slide 6: Injection Molding

    Injection Molding „ Injection Molding of LDS-Polymers: 6

  7. Slide 7: Laser Processing

    Laser Processing „ LDS MicroLine 3D Industrial 7

  8. Slide 8: Chemical Metallization of the Laser-activated parts

    Chemical Metallization of the Laser-activated parts „ Plating Line: 8

  9. Slide 9: Principle – Generation of a micro-rough Surface

    Principle – Generation of a micro-rough Surface Sketch: modified polymer Laser Activated additive by laser ablation 9

  10. Slide 10: Principle – Adhesive Metallization

    Principle – Adhesive Metallization laser processed area partly embedded tracks Bild mit strukturierter Oberfläche und Cu un-processed unstrukturierter Oberfläche area modified polymer Adhesive „anchoring“ of plated Cu 10

  11. Slide 11: Summary

    Summary „ More flexibility in product design. „ Only three process steps (1Kshot molding, surface processing, metallization). „ Maximum function integration in minimum space. „ Cost savings in production. 11

  12. Slide 12: Thanks & Comments

    Thanks & Comments 12

Wah Hong Industrial — Technical Presentation on 6ix