Amkor Technology, Inc. · NASDAQ:AMKR

Amkor Technology — Investor Presentation (June 2012)

27 slides from Amkor Technology's investor presentation, Jun 6, 2012

  1. Slide 1: Amkor Technology Investor Presentation June 2012

    Exhibit 99.1 Amkor Investor June Enabling World® Microelectronic 2012 Technology, Presentation a Inc.

  2. Slide 2: Forward-Looking Statements Disclaimer

    © 2012 Forward-Looking Disclaimer All constitute statements future results information, in filings subsequent reflect Policy From statements. date financial made presentation guidance these information given. to time results events with Regarding and Amkor statements any guidance or forward-looking

  3. Slide 3: Key Business Highlights

    Key One Semiconductor Industry Driving In Strong Favorable © 2012 theof Business Right Competitive the Amkor Innovation Pioneer OSAT World’s Markets Highlights Technology, Packaging and Industry Leading for Position with Technology Over Trends the and Outsourced Inc. 40 Right Test Years Amkor Leader

  4. Slide 4: Key Financial Highlights

    Key 4 C Net (1) Amkor (2) (3) Financial Managing Strong Industry-Leading Well $2.77 $514 $78 EBITDA(1,2) ontinued Sales(1) Income(1) Million Positioned Million Billion Cash Balance LTM calculation financial © 2012 EBITDA Return Focus Highlights Profitability Flow is1Q12 Sheet Confidential Amkor on t

  5. Slide 5: Semiconductor Industry Growth Drivers

    Growth Note: © Markets End Technology and Packaging Industry _ 5 N Wafer-Level In Significant Deep Strong Flip Fine 3D MEMS Copper Semiconductor IDM Growth Collaboration 2012 Test R&D the ote: Packaging Chip Pitch Outsourcing Ties Amkor Right Drivers OEM Wirebonding ofGrowth Siliconwith Copper Fab-L

  6. Slide 6: Mobile Electronics Growth Markets

    In © Smartphone 2012-2016 Tablet 2012- Mobile Electronics Consumer Networking per _ Exabytes 6 (vs ©1)2016 55% Cumulative Gaming “Always Digital 2015 (2) 2012 the 2011)(2) Month 2012Right 2016 of Tablet Global Network Amkor Home per Handsets Consoles (Equal (32% Connected” (22% (41% Markets Month 5.

  7. Slide 7: End Market Summary

    End Communications Smartphone Note: © 7 2012 Market Percentages AmkorSummary Technology, Consumer represent Inc. share Computing Amkor of LTM Networking Confidential 1Q12 Net Other Sales. Information 43% 24% 12% 12% 9% Hard Wireless Set PC Automotive Peripherals Television Industrial Gaming Switch R

  8. Slide 8: Significant Applications and Device Penetration

    Significant Applications Digital Memory Audio Touch © 2012Screen Processor Baseband Amkor Memory Penetration Processor Controller Technology, Video GPU MemorySignal in CPU Controller Key Memory Inc. CPU /Devices Image Amkor Digital CPUProcessor Confidential Tuner Decoder ASIC WiFi, Information / PLD

  9. Slide 9: Deep Customer Ties

    Deep Customer Top (1) © 10—61%(1) Ties 2012 TopShare with Amkor10 customers the of/ Top 2011 Right 25—83% Net Technology,Customers represent Sales Inc. 62%Confidential Amkor of Net Sales Information for LTM 1Q12 9

  10. Slide 10: Flip Chip & Advanced Packaging Leader

    Flip Chip & Advanced Packaging Leader 3 Migration to Flip Chip, 3D and Advanced Packaging Continues to Accelerate 3 Driven by Strong Demand for Smartphones, Tablets, Gaming Devices, Network Infrastructure 3 Enhances Device Performance, Reduces Power Consumption and Form Factors 3 2012 LTM Advanced (

  11. Slide 11: Fine Pitch Copper Pillar Technology

    Fine Provides Small high Handheld, Applications Networking Launched Industry-Leading Multiple Enabling with © 11 2012 Through Pitch thermal and Amkor Customers Significant Technology in fine Copper High ASICs, 2010, and Processors, Silicon pitch Technology, Performance, electrical Platform Pillar Ov

  12. Slide 12: 2.5D and 3D Packaging Advantages

    Through interposer 3D advantages 2.5D Fine _ stacking Die-to-Substrate, © Substrate Attached Applications Active Vertical Short Electrical, Multiple Small Passive High Large Network, Integration Higher Reduced Lower Faster Interconnect Die-to-Die, 2012 Vertical Pitch Silicon & density length, Amkor

  13. Slide 13: Research and Development Collaboration

    Research Focus Collaboration Supply 3D Interposers, Fine Wafer Copper Manufacturing MEMS Cost Test Reductions Material Thermal Electrical Mechanical Optimization Process Reliability Faster System Integration, Performance and Suppliers: Materials Key ver Solutions © 2012 Packaging: 400 Roadmaps Custo

  14. Slide 14: Outsourcing Growth Drivers

    Packaging Source: $35B $24B 14 Outsourced Test technologies _ – Semiconductor 8% IDM “Fab-Lite” Some Growth $65 25% Up Collaboration OSATs $19B (1) 14 Market from CAGR Source: © 2006 55% 50% 45% 40% 35% 54% OSAT billion of Outsourcing Packaging 2012 not shedding Gartner no total The 2011 Shareofand

  15. Slide 15: World-Class Manufacturing Infrastructure

    World-Class LTM cJby C 210k 1.4M Philippines 850k Taiwan 1.0M China 2.3M 5.8 5% 8% 10% 4% 11% 55% 20% 30% 54% Net Korea ©apan 2012 Factory Million 3% Sales sf 1Q12 sfPhilippines Amkor Units Location Net Sq. Manufacturing Technology, Ft. Sales Taiwan Manufacturing and Packaged China Inc. Infrastructu

  16. Slide 16: K5 Facility Korea Investment

    New Art Near – talent Services _ 46 K5 Investment 4 Attract Advanced Tax Seoul, Flagship Improved First 108 K4 3 K3 © Acres Facility R&D Factory Incheon Incentives class Acres 2012 Korea Focus top K1 Center Site Acres Amkortransportation Packaging site engineering and Airport Metropolitan in for Ava

  17. Slide 17: Strong Return on Invested Capital

    Strong 17 _ Return ROIC Capital * 8%Industry-Leading 10% Consistent Disciplined 11% 12% 24% 9% 14% STATS 23% 18% 26% 19% 2010 30% 25% 20% 15% 10% 5% 0% 17% 16% © isROIC 2012 7% 8% 18%Competitive on Intensity 2011defined Invested SPIL Ability AmkorAbove LTM r Confidential Capital ASE as isAmkor based

  18. Slide 18: Utilization and Gross Margin Drivers

    Utilization Packages Higher Than Sync Over _ – 25% 15% 5% 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% Packaging Q112 Q411 Q311 Q211 Q111 Q410 Q310 Q210 Q110 Q409 Q309 Q209 Q109 Q408 Q308 Q208 Q108 Q407 Q307 Gross © ASPs Flip Manage Other F/X Gold 2012Q207 Cycles with Wirebond Margin Chip Prices Gros

  19. Slide 19: First Quarter 2012 Summary

    (First © (1) 19 (2) (In2012 Gross Net Quarter Earnings Free EBITDA(2) PackagingFree Amkor millions, EBITDA Sales Income Cash Margin Per cash $6652012 Technology, Flow(1) flow Summary Utilization $25 $133 except is Diluted 19% defined $684 $25 $130 $6 16% per $12is $655 Share 71% ($1) as defined shar

  20. Slide 20: Profitability, SG&A and R&D Trends

    Profitability Selling, Research ($ $2,776 $2,939 $2,179 $491 $664 $480 22% 18% $3,500 $3,000 $2,500 $2,000 $1,500 $1,000 $500 Revenue $242 $211 $44 $239 11% 12% 2009 $300 $250 $200 $150 $100 $50 $- 30% 25% 20% 15% 10% 5% 0% SG&A © 2012 in$48 11% 23% 17% millions) $469 $247 2010 R&D $2,766 Amkor Gene

  21. Slide 21: EBITDA and Free Cash Flow

    Free (1) (2) (3) ($ EBITDA(2) $148 ($21) $50 $97 $88 $236 $521 $676 $547 2009 © 2012 inExcludes Free EBITDA Cash millions) (3)Amkor $514 2010 cash Flow Flow(1) 2011 is payments flow defined Technology, and LTM is EBITDA defined 1Q12 relating as netInc. as income to operating Amkor Korean before Conf

  22. Slide 22: Operating Infrastructure and Capital Additions

    LTM Operating ($ Infrastructure Test Packaging 27% 56% $471.5 $467 $446 $174 $517 $543 $262 R&D -0 1.1 1.6 1.4 1.2 1.0 0.8 0.6 0.4 Oper. $453 $505 $198 2009 $600 $500 $400 $300 $200 $100 $- 20% 15% 10% 5% 0% 16% 17% 9% Capital Guidance (1) $550(1) Around © .2Operations in millions) Million Second Ta

  23. Slide 23: Credit Profile

    Credit _ – ($ $1.4 $395 $2.0 $1.5 $1.0 $0.5 $500 $381 $435 Cash Debt Total 2.6 1.8 1.4 1.9 Debt/EBITDA $186 $352 $242 $87 $101 $115 -0 2.1 2009 $400 $300 $200 $100 $- 4.0 3.5 3.0 2.5 2.0 1.5 1.0 EBIT/Interest EBIT © .5 Total Debt Net 2012 in2.6 $88 $1.4 $0.9 millions) ($ $405 $173 2010 Balance Debt,

  24. Slide 24: Debt Maturity Profile

    $25022 Debt Maturity ($ Balance Callable 7.375% 6.625% © $382 2012 $250 $400 $345 $2 $126 $132 $78 $22 Term 24 2012 in millions) Maturities 2013 Loans Amkor Senior First Notes Profile 2014 Senior Call Due Notes Technology, as 2015 Call of Notes ($M) May June March 2016 Date Convertible 2018 2021 201

  25. Slide 25: Appendix

    © 2012 Amkor Technology, Inc. Amkor Confidential Information 25 Appendix

  26. Slide 26: Financial Reconciliation Tables

    Financial * ($ Free Property, (Capital Less: Payable Purchases Net EBIT* Plus: EBITDA* © 2012 inIncome Cash Cash Reconciliation millions) Interest Income Depreciation Purchases Net 242 See Amkor and Additions) Plant Provided Change of Flow* $547 352 discussion $156 Deposits Property, Tax Expense 200

  27. Slide 27: Financial Reconciliation Tables: ROIC

    © 2012 Financial cash results. limitations, service, in operating by additional ability measures titled We ROIC generating ($ Operating Income Net Plus: Less: Average Return (NOPAT addition in generally define Operating flow millions) Average measures Average is to on Our Amkor Tax are not Debt Inve

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