Slide 1: ST Cloud AI update
ST Cloud AI update Remi El-Ouazzane President, Microcontrollers, Digital ICs and RF products Group March 9, 2026
Slide 2: Forward looking information
Forward looking information Some of the statements contained in this document that are not historical facts are statements of future expectations and other forward-looking statements (within the meaning of Section 27A of the Securities Act of 1933 or Section 21E of the Securities Exchange Act of 193
Slide 3: Global AI infrastructure expansion: a multi-year Capex catalyst
Global AI infrastructure expansion: a multi-year Capex catalyst Hyperscalers Capex spending ($B) 1300 +27% CAGR 2024 to 2030 1100 950 850 784 As AI data centers deployments scale, +18% CAGR ST is positioned for 500 2013 to 2023 strong, multi-year 312 growth 173 32 2013 2023 2024 2025 2026e 2027e 202
Slide 4: ST SAM Content per 1 GW AI data center ∼ $230M
ST SAM Content per 1 GW AI data center IT Rack IT Rack with PSU + Side-car ST SAM $M OPTICAL Transceiver with fibers PSU ∼ $230M Power the full rack HVDC For 1GW AI data center Power the server DC DC Power the GPUs Leveraging a broad AI data center portfolio to accelerate revenue growth. Compute tra
Slide 5: Power: challenges and architecture (r)evolution
Power: challenges and architecture (r)evolution Today – 2025 / 2026 Challenges Evolution – 2027 and beyond Power: 130 kW – 288 kW Power: 500 kW – 1 MW+ HV Grid HV Grid SST* : High Frequency Transformer Low Frequency Transformer + AC/DC Growing xPU compute Solid State Circuit Breaker 400V AC 800V DC
Slide 6: ST offering from grid to core power delivery
ST offering from grid to core power delivery 800V AC-DC 800V to 54V 54V to 12V 12V to 0.8V PSU for power shelf 12 kW High density 2 kW GaN-based Digital multiphase controller applications converter “HV Buck” and SPS High-efficiency and density High-efficiency and density High-efficiency and density
Slide 7: Cloud-optical interconnect in AI servers: Scale-X
Cloud-optical interconnect in AI servers: Scale-X Interconnect in an AI data center enables high-speed, reliable, and lossless interaction between compute resources, maximizing efficiency and minimizing job DCI completion time of the AI factory. A scale-up network connects GPUs to switches in a sing
Slide 8: A more detailed view of cloud-optical interconnect products
A more detailed view of cloud-optical interconnect products Near-packaged optics (NPO) Pluggable Co-packaged optics (CPO) Courtesy Innolight EIC Micro- optics Optical Engine MCU TSV PIC Substrate Microcontroller (MCU) Control transceiver operation Photonic IC (PIC) Substrate Socket Convert light to
Slide 9: ST technology integrated in advanced packaging
ST technology integrated in advanced packaging Silicon photonics for PIC BiCMOS B55X for EIC STM32 for MCU Unique silicon-only 300mm The high-performing 300mm BiCMOS The world’s leading technology supporting 200G/lane leading RF & optical markets MCU platform Optical Engine in Advanced Packaging tec
Slide 10: ST's industry-leading silicon photonics platform supports AI infrastructure demand
ST’s industry-leading silicon photonics platform supports AI infrastructure demand PIC100 in 300mm high-volume production for leading hyperscalers, 4x capacity expansion by 2027 High-volume production for silicon photonics-based PIC100 platform for optical interconnects for data centers and AI clust
Slide 11: Strategic collaboration with AWS
Strategic collaboration with AWS Multi-year, multi-billion $ commercial engagement with AWS serving several product categories A major milestone to position ST in the AI revolution. This collaboration establishes ST as a strategic supplier of advanced semiconductor technologies and products that AWS
Slide 12: ST AI data center revenue growth expected to further accelerate
ST AI data center revenue growth expected to further accelerate With the current market dynamics, we believe we can achieve revenue nicely above $500 million in 2026. And we believe we can achieve revenue well above $1 billion in 2027. 12
Slide 13: Takeaways
Takeaways ST optical technologies critical for AI infrastructure Mostly pluggable today but NPO/CPO ramping fast AI data centers driving need for: ST has the power technologies (wide bandgap and silicon based, Higher bandwidth & lower galvanic isolation and smart power) for next-generation AI data c
Slide 14: Find out more at www.st.com
Find out more at www.st.com © STMicroelectronics - All rights reserved. ST logo is a trademark or a registered trademark of STMicroelectronics International NV or its affiliates in the EU and/or other countries. For additional information about ST trademarks, please refer to www.st.com/trademarks. A