Canon Inc. · TSE:7751
Canon — 2024 Corporate Strategy Conference
13 slides from Canon's conference presentation, Mar 8, 2024
Slide 1: Industrial Group
Canon Inc. 2024 Corporate Strategy Conference Industrial Group March 8, 2024 Hiroaki Takeishi Senior Managing Executive Officer Head of Industrial Group This presentation contains forward-looking statements with respect to future results, performance and achievements that are subject to risk and unc
Slide 2: Performance Targets
Performance Targets Industrial Group Consolidated Performance (Billions of yen) Net sales Op. profit ratio 500 40% 430 or more Net sales and Op. profit 35% 383 400 Op. profit ratio 338 30% 329 315 300 25% 19% 19% 19% or more 18% 20% 200 13% 15% 10% 100 5% 0 0% 2020 2021 2022 2023 2024 2025 Maintain
Slide 3: Semiconductor and Display Market Trend
Semiconductor and Display Market Trend US＄B Semiconductor Market M [Units] Display Market $1,000 3,500 $900 O-S-D 3,000 $800 OLED $700 Analog 2,500 $600 2,000 Logic $500 1,500 $400 Micro $300 1,000 LCD $200 Memory 500 $100 $0 0 2023 2024 2025 2026 2027 2023 2024 2025 2026 2027 ※O-S-D Optical Sensor
Slide 4: Results up to 2023 & Challenges, Strategies & Measures Over Next Two Years
Results up to 2023 & Challenges, Strategies & Measures Over Next Two Years Results up to 2023 & Challenges • In strong semiconductor market, expanded lineup of competitive products, achieved significant growth in unit sales • Launched equipment for cutting-edge device market, including nanoimprint a
Slide 5: Business Strategy
Business Strategy ◼ Respond to expansion in scale, scope, and application of semiconductor manufacturing ◼ Raise Competitiveness of manufacturing equipment for OLED displays ◼ Strengthen and expand data solutions business ◼ Cultivate new business domains through integration of core technologies 4
Slide 6: Industrial Group Expanding Lineup of Semiconductor Manufacturing Equipment
Industrial Group Expanding Lineup of Semiconductor Manufacturing Equipment Semiconductor device manufacturing process (Abstract) Wafer Expose Expose Deposit Coat Develop Etch Cut Bond Inspect (Front-end) (Back-end) Semiconductor device Canon ANELVA Optical Products Operations Optical Products Canon
Slide 7: Respond to expansion in scale, scope, and application of semiconductor manufacturing
Respond to expansion in scale, scope, and application of semiconductor manufacturing More Moore：Miniaturization More than Moore：Diversification Logic CPU Memory Image sensor RF/MEMS Power/LED Packaging Nanoimprint Semiconductor Manufacturing Equip. High Productivity KrF Litho. Equip. High Productivi
Slide 8: Expansion of Nanoimprint Semiconductor Mfg. Equip.
Expansion of Nanoimprint Semiconductor Mfg. Equip. ◼ Low Cost and Low Energy Consumption in Mfg. of Circuit Patterns in the Range of 10nm Patterning Performance & Application FPA-1200NZ2C Energy Consumption & Mfg. Cost Meet need for miniaturization in 10nm range and for Nanoimprint semiconductor Ver
Slide 9: Expand Product Lineup for Advanced Packaging
Expand Product Lineup for Advanced Packaging Sphere Evolution of integration tech. of Wafer heterogeneous devices Level US$B Package Litho. Equip. for WLP Atomic Diffusion Bonding Equip. Atomic Diffusion Bonding Equip. FPA-5520iV BC7000 BC7300 (Optical Products Operations) (Canon Anelva) (Canon Anel
Slide 10: Enhance Production Capacity, Constructing New Facility at Utsunomiya site
Enhance Production Capacity, Constructing New Facility at Utsunomiya site Semiconductor Litho. Equip. Sales New factory image Site area: Approx. 70,000㎡ 247 Units 187 Units 176 Units 140 Units New factory (Concept) Construction started Dec. 2023 Automation On-site logistics, skilled work Optimizatio
Slide 11: Display Mfg. Equip. Developed by the Industrial Group
Display Mfg. Equip. Developed by the Industrial Group Display manufacturing process (Abstract) Vapor deposition TFT Process process Back-end process Glass substrate Display Deposit Coat Expose Develop Etch Vapor deposition Encapsu- lation Cut Product Optical Products Operations Canon Tokki Weight: 2
Slide 12: Strengthen & Expand Data Solutions Business
Strengthen & Expand Data Solutions Business Expand “Lithography Plus,” platform for industrial equipment data solutions Integrate digital technology and equipment know-how to achieve high utilization rates and yield Big data analysis of MIF Remote support solutions Training that uses MREAL Using AI
Slide 13: Cultivate New Business Domains through Integration of Core Technologies
Cultivate New Business Domains through Integration of Core Technologies Core Technologies New Domains Advanced Logic Thin film Die Handling Advance Packaging Automation Vapor Deposition Integration of Core Technologies Atomic Diffusion Bonding Alignment XR Displays Metalenses Sputtering Nanoimprint