Nanoveu Ltd. · ASX:NVU

Nanoveu — Investor Presentation (July 2025)

26 slides from Nanoveu's investor presentation, Jul 9, 2025

  1. Slide 1: Investor Webinar Presentation

    Nanoveu Limited ACN 624 421 085 Level 45, 108 St Georges Terrace Perth WA, 6000 Australia +61 8 6244 9095 www.nanoveu.com ASX RELEASE 9 July 2025 ASX: NVU Investor Webinar Presentation Nanoveu Limited (ASX: NVU) (“Nanoveu” or the “Company”), a technology innovator across advanced semiconductor, visu

  2. Slide 2: About Nanoveu Limited

    About Nanoveu Limited Further details on the Company can be found at https://nanoveu.com/. EMASS is a pioneering technology company specialising in the design and development of advanced systems-on-chip (SoC) solutions. These SoCs enable ultra-low-power, AI-driven processing for smart devices, IoT a

  3. Slide 3: Investor Webinar

    Investor Webinar July 9, 2025

  4. Slide 4: Disclaimer

    Disclaimer IMPORTANT INFORMATION These presentation materials and any accompanying verbal presentation (together, the Presentation Materials) have been prepared by Nanoveu Limited (Company, NVU, Nanoveu) as at 9 July 2025 and statements are current only as at that date. Information in the Presentati

  5. Slide 5: EMASS Introduction

    EMASS Introduction Fabless Semiconductor Innovator in Edge AI Processing • Ultra-low-power Edge AI SoCs for always-on intelligence in battery constrained devices Established Global Operations • Founded in 2020, Singapore headquartered • 100% of EMASS acquired by Nanoveu Limited (ASX:NVU), March 2025

  6. Slide 6: Leadership Team

    Leadership Team Mark Goranson Dr. Mohamed Sabry Scott Smyser CEO of Semiconductor Technology CTO, Founder of EMASS VP, Sales & Marketing • VP of Global Ops, TE Connectivity • Associate Professor, NTU Singapore • EVP Marketing & BD, Si-Ware Systems • SVP of Fab Ops, ON Semi • Postdoc, Stanford • VP &

  7. Slide 7: Semiconductor & SoC Market Opportunity

    Semiconductor & SoC Market Opportunity System On Chip Market Size SoC Market Growth: Applications demanding continuous By Type 2020-2030 (USD Billion) sensing, context awareness, and real-time decision-making Source: Grand View Research www.nanoveu.com 5

  8. Slide 8: Demand for Edge AI is Growing Fast

    Demand for Edge AI is Growing Fast Edge AI Market Size Edge AI Growth: Billions of connected devices require intelligence at the edge - not in the cloud Source: Fortune Business Insights www.nanoveu.com 6

  9. Slide 9: Edge AI Market Opportunity

    Edge AI Market Opportunity Core Challenges Our Solution Enable meaningful AI processing High power consumption drains directly at the sensor/edge batteries fast Deliver orders-of-magnitude Complex system architectures lead improvements in power, size, cost, to higher cost and larger size and integra

  10. Slide 10: Atoms to Apps—at the Edge, on Sub-milliwatts

    Atoms to Apps—at the Edge, on Sub-milliwatts Silicon Modules Applications Drones Wearables © 2025 Nanoveu All Rights Reserved www.nanoveu.com 8

  11. Slide 11: ECS-DoT

    ECS-DoT Redefining What’s Possible in Ultra-Low-Power Edge AI • Fully Programmable System on Chip • Processor • AI engines • IPs for compressed AI • Local decision-making at the Edge • Always-on AI Inference • Sensor Fusion • Support CNNs, ML, Data Processing etc. • Key Architecture Features • <1 to

  12. Slide 12: ECS-DoT Differentiation

    ECS-DoT Differentiation Full AI capability, true always-on operation Key Attribute ECS-DoT Typical Alternatives Compute Architecture RISC-V + Dual Deep Learning Accelerators General MCU, DSP, or fixed-function NNs Memory Architecture Fully on-chip (up to 8MB) — No external DRAM External DRAM often r

  13. Slide 13: ECS-DoT

    ECS-DoT Superior Performance, Low Power, Small Form Factor © 2025 Nanoveu All Rights Reserved www.nanoveu.com 11

  14. Slide 14: Leading Industry Peers in AI Computation Tasks

    Leading Industry Peers in AI Computation Tasks Company Software AI Performance Power AI Performance Max AI Optimization per Watt (Avg/Peak) Parameters (Avg/Peak) EMASS Yes 3/15 TOPs 0.1mW/10mW 30 GOPs 13 million Syntiant No 0.1/1 TOPs 7mW/30mW 6.4 GOPs 7 million Himax No 40/320 GOPS 2.5mW/20mW 0.8 G

  15. Slide 15: Exceptional AI Computation

    Exceptional AI Computation 20X Lower Energy MLCommons, 2025 © 2025 Nanoveu All Rights Reserved www.nanoveu.com 13

  16. Slide 16: Exceptional AI Computation

    Exceptional AI Computation At least 20X Lower Energy EMASS ECS-DoT at 50MHz Image Classification • Compared to current best in class chips Execution Time Power Efficiency from Syntiant and STMicroelectronics 0.8x 20x • Running at least 2.5x to 3x faster* Visual Wake Words Execution Time Power Effici

  17. Slide 17: Ideal Solution for Battery-Constrained Devices

    Ideal Solution for Battery-Constrained Devices Continuous sensing for voice Continuous activity tracking, control, anomaly detection, and gesture detection, and health environmental monitoring in monitoring always-on connected devices Wearables IoT Devices Always-on voice triggers, gesture Always-on

  18. Slide 18: Next Generation ECS-DoT

    Next Generation ECS-DoT Advanced 16nm Architecture Built on TSMC’s 16nm Fin Field Effect Integrating Wireless Connectivity Transistor (FinFET) • Higher Perf. & Lower Power • Smaller Die Size • Production Ready Bluetooth 5.x + Wi-fi Lora for low-power, Bluetooth Mesh long-range (optional) Key archite

  19. Slide 19: Strategic R&D Collaboration

    Strategic R&D Collaboration Key Partnership Center of Nanoelectronics and Devices (CND), American University in Cairo • One of the region’s leading research institutions for advanced semiconductor design • Deep expertise in low-power architecture, AI acceleration, and SoC optimization Strategic Advi

  20. Slide 20: ECS-DoT Dev Kit and Modules

    ECS-DoT Dev Kit and Modules • Current: Small 8cm x 6.5 cm Eval Board • ECS-DoT chip + dedicated JTAG & UART-USB Interfaces • Pins to attach all sensors via standard interfaces (I2C, SPI, etc) • Next-Gen: 5 cm x 2 cm Modular board • Base Board with ECS-DoT and debug ports • Pins to mount daughter boa

  21. Slide 21: Wearables (Fall Detection)

    Wearables (Fall Detection) © 2025 Nanoveu All Rights Reserved www.nanoveu.com 19

  22. Slide 22: ECS-DoT Unlocks Breakthrough in Drone Flight Efficiency

    ECS-DoT Unlocks Breakthrough in Drone Flight Efficiency Longer Flight Times AI Ready Platform Minimal Overhead +33% simulated flight time Enables onboard intelligence AI logic uses minimal battery, without any hardware changes for mission-critical use cases. preserving power for propulsion. • Precis

  23. Slide 23: Positioning ECS-DoT for Autonomous Drone Markets

    Positioning ECS-DoT for Autonomous Drone Markets Minimal Overhead, Maximum Intelligence Addressable Market ECS-DoT consumes <1mW total AI power, preserving battery USD$73B Market USD$163B Market Precision Landing Autonomous Inspection Model Refinement (2024) (2030)* Next Steps Toward Market Readines

  24. Slide 24: Strategic Collaboration on Edge AI Modules

    Strategic Collaboration on Edge AI Modules Accelerating ECS-DoT Adoption Phase 1 Phase 2 Phase 3 Industrial predictive Wearable module Accelerating real- maintenance world adoption • USD$60 Billion • USD$186.14 Billion • De-risks integration for Opportunity by 20301 Opportunity by 2030 OEMs and solu

  25. Slide 25: Building Commercial Momentum

    Building Commercial Momentum Engaging with Tier 1 OEMs • Actively engaging with leading wearables and drone manufacturers • Strong interest driven by ECS-DoT’s differentiated architecture and capabilities • Potential customers see clear advantages over incumbent solutions from Syntiant and Ambiq Dro

  26. Slide 26: Thank You

    Thank You Head Office Singapore Office Level 45, 108 St Georges Terrace 20 Ayer Rajah Crescent Perth WA, 6000 Australia # 08-09 Singapore 139964 +61 8 6244 9095 www.nanoveu.com +65 6557 0155

Nanoveu — Investor Presentation (July 2025) on 6ix