Element Solutions Inc. · NYSE:ESI
Element Solutions — Solstice Advanced Materials — Merger or Acquisition (July 2026)
21 slides from Element Solutions's merger presentation, Jul 6, 2026
Slide 1: Creating an Industry-Leading Advanced Materials Platform Aligned to Serving Attractive Secular Growth Markets
Creating an Industry - Leading Advanced Materials Platform Aligned to Serving Attractive Secular Growth Markets July 6 th , 2026 1
Slide 2: Today's Presenters
Today’s Presenters Today’s Presenters David Sewell Tina Pierce President & Chief Executive Office r, Solstice Chief Financial Officer , Solstice Advanced Materials Advanced Materials Ben Gliklich Chief Executive Officer , Element Solutions + 2
Slide 3: Forward-Looking Statements & Other Disclaimers
Forward - Looking Statements & Other Disclaimers Cautionary Statement Regarding Forward-Looking Statements This communication contains certain forward-looking statements within the meaning of the federal securities laws made pursuant to the safe harbor provisions Investors and security holders may o
Slide 4: Creating An Industry-Leading Advanced Materials Platform
Creating An Industry-Leading Advanced Materials Platform Creating An Industry - Leading Advanced Materials Platform Global Advanced Materials Leader 1 Transaction that results in combined FY’25 net sales of approximately $6.8B, Adj. EBITDA of $1.7B 1, Adj. EBITDA margin of 26% 1, 8,300+ patents, and
Slide 5: Transaction Overview
Transaction Overview Transaction Overview • Solstice to acquire Element Solutions (NYSE: ESI) in a cash and stock transaction valued at approximately $14.5 billion Transaction • Element shareholders to receive $10.00 in cash and 0.500 shares of Solstice common stock for each Element share Structure
Slide 6: Element Solutions at a Glance
Element Solutions at a Glance Element Solutions at a Glance Key Business Drivers Exposure to Secular Tailwinds Key Metrics (2025) Specification - Driven, Mission - Scaling AI Infrastructure Critical Capabilities ~$2.9B $ 609 M 5,200+ 2,600 + 2025 Net Sales 2025 Adj. EBITDA 1 Employees Patents owned
Slide 7: Combined Company Aligned to Attractive End-Markets
Combined Company Aligned to Attractive End-Markets Combined Company Aligned to Attractive End - Markets Combined 1 Combined Sosltice Combined Sosltice By End - Market By Geography 2 (2025) ESM (Ex - Electronics) EMEA 11% 14% $6.8B Net Sales $1.7B Adj. EBITDA 1 Specialties 12% RAS 43% U.S. 43% Patent
Slide 8: Acquisition Aligned with Strategic Pillars
Acquisition Aligned with Strategic Pillars Acquisition Aligned with Strategic Pillars Growth of Advanced Environmental & Improving Health Personal Safety & Computing Energy Evolution Outcomes Defense • Denser, higher power chips • Regulatory and policy goals • Next - gen medical • Protective equipme
Slide 9: Advanced Computing Driving Demand for Integrated Solutions
Advanced Computing Driving Demand for Integrated Solutions Advanced Computing Driving Demand for Integrated Solutions Connect Advanced Packaging Thermal Management Leading Edge Nodes (< 7nm) 300mm High - End Packaging Revenue ($Bn) 3500 90 wafer starts/month in millions Liquid Heat Density W/cm 2 80
Slide 10: Combined Company to Capture End-to-End Value Chain
Combined Company to Capture End-to-End Value Chain Combined Company to Capture End - to - End Value Chain Advanced Nodes Advanced PCB & Advanced Packaging Chip Fabrication Assembly DD Growth DD Growth LSD – MSD Growth Complementary Inner - Layer Offerings Flip C hip Via Deposition Bonding / Formatio
Slide 11: Combined Portfolio Provides End-to-End Solutions
Combined Portfolio Provides End-to-End Solutions Combined Portfolio Provides End - to - End Solutions Combined Atmospheric & Specialty Gases Synergy Opportunity Advanced Photoresist & Ancillary Chemicals Nodes Chip CMP Slurries, Pads & Conditioners Fabrication Wet Processing Chemicals DD Growth 1 De
Slide 12: Copper Expertise to Improve Connection & Signal Strength
Copper Expertise to Improve Connection & Signal Strength ✓ Higher yield and reliability: Co - optimized materials reduce Copper/ Dielectric Capping Lithography Metal Dielectric defects and lowers variability. ✓ Compatibility assurance: Seed and fill are qualified together, Semiconductor Ta Barrier w
Slide 13: Complementary Thermal Management Solutions
Complementary Thermal Management Solutions Combined 1 Heat Sink 1 Thermal 2 Interface Material (TIM2) 2 3 3 Heat Spreader Thermal 4 4 Interface Material (TIM1) 5 5 Die (Cu) 1 6 6 Packaging Substrate End - to - End Offerings to Better Solve Our Customers’ Complex Challenges 1Rep
Slide 14: Thermal Management Leader from the Die to Data Center
Thermal Management Leader from the Die to Data Center Thermal Management Leader from the Die to Data Center … through the Data Center… Discovery program to Immersion develop proprietary immersion cooling fluid Actively developing a 2 - phase direct - to - Direct to Chip chip fluid using a blend of e
Slide 15: Enabling Next Generation Electronics Innovation
Enabling Next Generation Electronics Innovation Enabling Next Generation Electronics Innovation Example Product Description ActiveCopper TM • Nano - copper material technology • Improved advanced packaging yield and throughput • Delivers unmatched thermal and power performance Power Trenches Cu Coin
Slide 16: Complementary Go-to-Market Capabilities
Complementary Go-to-Market Capabilities Complementary Go - to - Market Capabilities Synthetic & Fine Chemical Expertise Formulation Expertise Product • Turn conceptual designs into functional new • Broad formulation capabilities across material platforms multiple end markets; 2,600+ patents Deep Con
Slide 17: Significant Potential Value Creation from Synergies
Significant Potential Value Creation from Synergies Significant Potential Value Creation from Synergies $180M+ in Expected Annualized Net Synergies 1 Plus Significant Potential Revenue Synergy By Year 3 Upside Footprint Optimization $20M Strong Customer Collaboration Supply Chain • Enhanced end - to
Slide 18: Strong Combined Financial Profile
Strong Combined Financial Profile Strong Combined Financial Profile FY’25 Adj. EBITDA ($M) 1 Solstice Prior Combined $180 + $1,746 Guidance Financial (Medium Term) Profile $609 Revenue CAGR LSD – MSD - MSD% HSD% $957 2 Adj. EBITDA CAGR HSD – MSD% LDD% Cash Conversion* >70% ~75% Solstice Element Solu
Slide 19: Commitment to Capital Discipline
Commitment to Capital Discipline Commitment to Capital Discipline Capital Structure and Allocation ■ Funding the $ 14.5B cash - and - stock acquisition through a mix of Solstice equity issued to Element Solutions shareholders, new debt, and cash on hand. Fully committed bridge financing from Goldman
Slide 20: Accelerating Value Creation for All Shareholders
Accelerating Value Creation for All Shareholders Accelerating Value Creation for All Shareholders Attractive combined company financial profile Expected enhanced growth, margins, and cash flow conversion Highly synergistic combination Anticipated net synergies of $180M+ with additional upside opport
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