Nano Dimension Ltd · NASDAQ:NNDM

Nano Dimension — Investor Presentation (February 2020)

39 slides from Nano Dimension's investor presentation, Feb 3, 2020

  1. Slide 1: Electrifying Additive Manufacturing

    NODIMENSION Electrifying Additive Manufacturing® Intelligent Machines Consumable Conductive Dielectric Materials (Inks) A M E AME www.nano-di.com

  2. Slide 2: Forward Looking Statements

    Forward Looking Statements This presentation of Nano Dimension Ltd. (the “Company”) contains “forward-looking statements” within the meaning of the Private Securities Litigation Reform Act and other securities laws. Words such as “expects,” “anticipates,” “intends,” “plans,” “believes,” “seeks,” “es

  3. Slide 3: AME Machines and Consumable Materials (Polymers & Silver)

    Nano Dimension — AME Machines and Consumable Materials (Polymers & Silver) https://www.youtube.com/watch?v=UFaWbO0aUjPk&list=PLW7YOiIWnWhTShewSmy657p-0GnD2lotVr aS RAKISDINENSION High Performance Electronic Devices: Hi-PEDs rasona/ OM Fabricated the AME Machines (“3D-Printers”) AME Machines (Printer

  4. Slide 4: Financial Data

    Financial Data Nasdaq / TASE NNDM ADS ratio: 1:50 Shares outstanding 212.5M 4.25M ADS* * As of January 30, 2020 BIS NNANODIMENSION - - _ _ —_ Revenues 2017: $0.8M 2018: $5.1M 2019: $7.1M Revenue growth of *39% compared to previous year 8,000,000 7,000,000 6,000,000 5,000,000 4,000,000 3,000,000 2,00

  5. Slide 5: Business Model: Recurring Revenue Model that Scales

    BUSINESS MODEL: Recurring Revenue Model that Scales Consumables Revenues USD Thousands Razor and blades model: As the installed base of systems grows, the recurring revenues from consumables increases. 300 250 200 Positive trend of increased ink 150 consumption by customers is a io validation to our

  6. Slide 6: New USA Management for Nano Dimension

    New USA Management for Nano Dimension Yoav Stern — Incoming President & CEO Investor and Chairman Cyber, Fintec and Mobile/Visual Tech (USA). President & CEO DVTEL Inc. (Sold to FLIR Systems) (NJ, London, Tel Aviv, New Delhi, Adelaide, Singapore, Hong Kong, Taiwan). A turn-around executive in the Ho

  7. Slide 7: Management — Industry Background (1)

    Management — Industry Background (1) ¢ Ofir Baharav — Chairman. A Leader of HW and SW companies in Semiconductors, 3D Printing, PC Security, Healthcare Informatics and Digital Print. Lived and conducted business in Shanghai. Partner Stratus Venture Group, VP Product Portfolio Stratasys, Founder And

  8. Slide 8: Management — Industry Background (2)

    Management — Industry Background (2) ¢ Amit Dror —CCSO, Co-Founder. ECI Telecom Ltd., Comverse Technology, Inc., Eternegy Ltd. ¢ Dr. Ram - VP R&D. Physical Chemist, Post Doctoral in Chemistry and Biochemistry, and an MBA. Head of R&D in Medinol, developing in vivo medica! equipment. ¢ Yael Sandler —

  9. Slide 9: Market for High Performance Electronic Devices

    Soot! "Market for High Performance lectronic Devices “Hi-PEDs” | Hi-PEDs Necessitate ¢ Fast time-to-market ; ¢ IP safety (in-house rapid prototyping and production) ¢ Iterative development. ¢ Device performance gains Control of fabrication facilities (Defense & Homeland _ Security Industries) PEDs.

  10. Slide 10: The Challenge: Bridging The Gap

    The Challenge: Bridging The Gap Nano Dimension’s AME Machines & Inks: Design >> Proof of Concepts >> Prototype & Short-Run Fabrication of in ated-PCB Additive : e ircuit B : Traditional: Integrated Circuits (JC, Chips, CPU, | ASICs) > DIMENSION NASDAQ /TASE:NNDM. 10

  11. Slide 11: Cutting-Edge Applications

    Cutting-Edge Applications Breakthrough innovations enable applications never additively manufactured before: Built-in battery DC to DC PCB side- Sensors: Packaging socket converter contact touch, torque, ey . strain gauge integrated circuits Produced in a single step, by converting ej _—_ digital fi

  12. Slide 12: Typical High-Performance Electronic Devices (Hi-PED)

    Typical High-Performance Electronic Devices (“Hi-PED”) NASDAQ TASE:NNDM. 12 RF antennas Applications: Communications, cell phones, radar, loT Market size: $21B in 2019, 6.9% CAGR by 2025 Segment leaders: Murata, Cobham, Antcom Their challenge: Weight BGA component support Specialized Technological c

  13. Slide 13: The Problem: New Electronic Applications Create The Gap

    The Problem: New Electronic Applications Create “The Gap” Between: Integrated Circuits Printed Circuits Boards High performance miniaturized Electrical-Circuits- Lower performance Printed circuit boards (“PCB”) that Devices (“Chips”, “IC”) that are extremely costly to are costly to develop through p

  14. Slide 14: Economic Models of Present Fabrication Technologies Fail to Meet Market Needs

    Economic Models of Present Fabrication Technologies Fail to Meet Market Needs be Integrated Circuit (IC, “Chips”) Printed Circuit Boards (PCB) Fabrication renders high performance Fabrication renders lower cost than IC devices but at an extreme and often but also lower performance devices that prohi

  15. Slide 15: The Challenge: Bridging The Gap

    The Challenge: Bridging The Gap Traditional: Integrated Circuits (/C, Chips, CPU, | ASICs) DIMENSION a

  16. Slide 16: A Rapidly Growing Market for High Performance Electronic Devices

    A Rapidly Growing Market for High Performance Electronic Devices (Hi-PEDs) High Performance Electronic Devices (Hi-PEDs) are integral enablers of: ;woustry RESEARCH ADDITIVE institutes VERTICALS SERVICES f * Defense ¢ Academic ¢ Additive ¢ Aerospace institutions ad Intelligent drones service univers

  17. Slide 17: 2019 Vs. 2018 Sales Breakdown - per Industry

    2019 Vs. 2018 Sales Breakdown - per Industry 2018 2019 Resellers _ 15% | _Defense Reseters 30% Defense o\ / 41% Research/Univ. y, J Health 26% =~ 6% Research/Univ- \Tech/PCB CB 17% 7% 18% ak

  18. Slide 18: 2019 Vs. 2018 Sales Breakdown - per Region

    2019 Vs. 2018 Sales Breakdown - per Region 2018 2019 DD = 30 systems in 2018 27 systems in 2019 aes

  19. Slide 19: Worldwide Reach and Expansion

    Worldwide Reach and Expansion eo) Distributors (e] Customers 9 Headquarters aes NANODIMENSION

  20. Slide 20: First Mover, Advantage and Timing

    Nano Dimension: First Mover, Advantage and Timing 3D Printed Electronics Market: Growth Forecast* Analysts predict 3D printed electronics (USD Millions) will be the next high-growth 3000 application for product innovation: 2500 2000 2017 3D printed electronics market size is estimated at $176 millio

  21. Slide 21: Evolution of Nano Dimension

    Evolution of Nano Dimension Add materials with new applications Functional Electronic Deliver hybridized capabilities that combine mechanical functionality within electrified geometries DragonFly™ LDM DragonFly™ ai | r Materials Pro — DragonFly™ Fast Prototyping and LowVolume re-g Production Additiv

  22. Slide 22: Nano Dimension's Solutions

    Nano Dimension’s Solutions A AME Machines (controlled by Al algorithms) produce electronic ‘ devices by simultaneous 3D-injection of polymer dielectric and silver conductive materials to fabricate, within hours: _ High Performance Electronic Devices: Hi-PEDs (including sensors, antennas, capacitors,

  23. Slide 23: DragonFly LDM System — Introduced Only Since July 2019

    DragonFly LDM™ System — Introduced Only Since July 2019 July 2019: DragonFly Lights-Out Digital Manufacturing (LDM) Machines using 3D printing technology ¢ The only Prototyping & Fabrication Machine; ¢ Around-the-clock 3D-printing of electronic circuitry (AME); = = = * Cost effective for small-mediu

  24. Slide 24: In Summary: The Technological Edge

    In Summary: The Technological Edge High precision inkjet technology Rei Sees NANODIMENSION NASDAQ /TASE :NNOM Multi- material 3D printing Combining conductive Nano-silver & dielectric polymers First additive manufacturing for functional 3D electronics

  25. Slide 25: Compelling Value Proposition

    Compelling Value Proposition @ TIME Reduces development cycles times. Enables on-site prototyping in a matter of hours instead of weeks, even for complex designs. e; COMPONENT CONSOLIDATION Multi-material additive manufacturing enables functional, compact, denser, non-planar electronics parts. Riww

  26. Slide 26: Case Study: Harris Corporation: RF Amplifier to Space

    Case Study: Harris Corporation: RF Amplifier to Space Joint project for space systems communication satellites: 3D printed RF antenna designed to operate at 5.2 GHz and an RF amplifier with operation up to 6 GHz. Received a 2" grant approval from the Israel Innovation Authority, in cooperation with

  27. Slide 27: Growth: 2020-2021

    Growth: 2020-2021 2nd priority id Asia sales, engineering id customer support force to fit market scale Re-design and implement APAC Go-To-Market strategy 1st priority ¢ Build USA headqu * — Re-build USA sales, engineering and custo} support force & knowledge toa full scale * — Re-design and impleme

  28. Slide 28: Key Highlights

    Key Highlights Growth company with significant technology and first mover advantage. Successfully transitioned from an R&D company to commercial sales. Rapidly increasing customer’s base and established global presence. Recognized by industry leaders, won prestigious awards and national grants. 57 s

  29. Slide 29: Slide 29

  30. Slide 30: Nano Dimension's Solutions

    Nano Dimension’s Solutions Nano Dimension systems concurrently integrate in-situ — ; capacitors, antennas, coils, transformers and electromechanical mponents, to function at unprecedented performance. Dimension BRIDGES THE GAP between PCB and ~ tegrated circuits. A revolution at the click of a i \Dt

  31. Slide 31: DIMENSION,

    DIMENSION, NASDAQ /TASE :NNOM 3 1

  32. Slide 32: Open-Ended Revenue Growth Potential

    Open-Ended Revenue Growth Potential RESEARCH INSTITUTES INDUSTRY VERTICALS ADDITIVE SERVICES *Academic institutions and *Defense * Additive service bureaus universities ¢ Aerospace °PCB service bureaus ¢Research & innovation centers Autonomous Automotive ¢In-house print services Development * Medica

  33. Slide 33: Appendix

    NASDAQ TASE:NNOM DIMENSION 33 Hi-PEDs

  34. Slide 34: Case Study: The Next Generation in Additive Manufacturing

    Case Study: The Next Generation in Additive Manufacturing First tested by HENSOLDT, global defense & security pioneer: The DragonFly LDM™ Lights-Out Digital Manufacturing system is the industry's only comprehensive additive manufacturing platform for round-the-clock 3D printing of electronic circuit

  35. Slide 35: Strategic Growth Plan

    Strategic Growth Plan Growth by monetizing commercially available products for additive electronics design & prototyping Deliver manufacturing-grade machines for low volume of Hi-PEDs using AME ¢ Add materials with new applications * Deliver hybridized capabilities that combine mechanical functional

  36. Slide 36: Company Timeline

    Company Timeline Be * 2014: Listed on TASE TEL STOCK EXCHANGE * 2016: Listed on Nasdaq * 2019 revenues: $7.1m fe Nasdaq * 2018 revenues: $5.1m 57 systems sold WW until 12/2019 FORTUNE * 2016-2017: Early access * Built global sales and * Increased revenues trials with Fortune 500 operations infrastru

  37. Slide 37: 2019 Highlights

    2019 Highlights 57 systems sold to leading companies and organizations worldwide until 12/2019 Further expansion in the U.S. defense industry. In Q3- four additional sales to leading defense organizations SS Increased ink consumption validates the company's recurring revenue model Leading technology

  38. Slide 38: Experienced Leadership Team

    Experienced Leadership Team ecco eco eco Yoav Stern Yael Sandler Jaim Nulman Ofir Baharav President & CEO CFO cTo Chairman of the Board di A eco eee eee coo Amit Dror Sela Chen Gilad Reshef Dan Abraham Customer Success Officer VP Customer Support VP Sales VP Operations " Co-Founder aD

  39. Slide 39: Thank You

    THANK YOU Follow us:

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