Fujitsu Limited · TSE:6702
Fujitsu — Technical Presentation (November 2004)
42 slides from Fujitsu's technical presentation, Nov 5, 2004
Slide 1: Agenda
Agenda • Overview – Fujitsu’s 10Gbps Ethernet Product Offerings Keith Horn, VP Marketing (FMA) • 10Gbps Ethernet Switch Chip Asif Hazarika, Senior System Architect (FMA) • microGiGaCN™ Bob Thornton, Director Marketing (FCAI) • Eudyna and New Optical Communications Plans Jane Li, VP Marketing (Eudyna
Slide 2: Fujitsu's 10Gbps Ethernet Product Offerings Overview
Fujitsu’s 10Gbps Ethernet Product Offerings Overview Keith Horn Vice President, Marketing Fujitsu Microelectronics America, Inc. Fujitsu Microelectronics America, Inc. / Fujitsu Laboratories of America, Inc. / Fujitsu Components America, Inc. / Eudyna Devices USA Inc. 05/11/04 3
Slide 3: Full Suite of 10Gbps Ethernet Product Offerings
Full Suite of 10Gbps Ethernet Product Offerings • ASICs • XAUI, eXAUI, 10Gbps SERDES (2 channels) • 10Gbps Ethernet Switch Chip – ASSP • The industry’s first 12-port 10Gbps Ethernet switch chip with 10GBASE-CX4, 10GbE over copper interface • Lower cost, power and size • microGiGaCN™ • Offering 10G E
Slide 4: Fujitsu Booth #1853
Fujitsu Booth #1853 Full Suite of 10Gbps Ethernet Product Offerings X2 10GE SW Chip CX4 XENPAK Fujitsu 30m 20m cable cable XAUI Monitor Fiber IXIA 400T Fujitsu Microelectronics America, Inc. / Fujitsu Laboratories of America, Inc. / Fujitsu Components America, Inc. / Eudyna Devices USA Inc. 05/11//0
Slide 5: Fujitsu ASIC to Greenfield Networks
Fujitsu ASIC to Greenfield Networks • Fujitsu Delivered three ASICs to Greenfield Networks • Applications • Traffic management and packet processing for the enterprise market • Used in G525 Packet Engine, G750 Memory Fabric, and G120 Intelligent Multiplexer just introduced by Greenfield Networks • F
Slide 6: 10Gbps Ethernet Switch Chip
10Gbps Ethernet Switch Chip Asif Hazarika Senior System Architect Fujitsu Microelectronics America, Inc. Fujitsu Microelectronics America, Inc. / Fujitsu Laboratories of America, Inc. / Fujitsu Components America, Inc. / Eudyna Devices USA Inc. 05/11/04 7
Slide 7: Introducing MB87Q3070
Introducing MB87Q3070 • Introducing the Industry’s First 12-Port 10Gbps Ethernet Switch Chip with 10GBASE-CX4, 10GbE over CU Interface • Enables server and storage systems to be connected through 10GbE over cables and backplanes without an expensive optical Interface • Realizes higher density, and l
Slide 8: 10G Ethernet Switch Chip MB87Q3070
10G Ethernet Switch Chip MB87Q3070 Single-chip Solution for 10Gbps Ethernet Switches • Key Features • 12-port 10Gbps Ethernet switch chip • Layer-2 switch with VLAN and QoS • On-chip high-throughput buffer memory • Support CX4 (up to 25m) and XAUI interface • Benefits 10Gbps SW Box Single-chip 10Gbp
Slide 9: MB87Q3070 as a Managed Switch
MB87Q3070 as a Managed Switch PPC-8060T CPU-BUS Copper Cable Copper Cable XAUI (CX4) XAUI (CX4) XAUI (CX4) XAUI (CX4) XAUI (CX4) XAUI (CX4) 3070 XAUI (CX4) 12-port Switch XAUI (CX4) XAUI (CX4) XAUI (CX4) XAUI (CX4) XAUI (CX4) XENPAK PORTS (0-5) PORTS (6-11) XENPAK Transponder Transponder Fujitsu Mic
Slide 10: Lower Cost and Power
Lower Cost and Power 10GbE Switch Chip 10GbE Switch Chip + with Optical Modules CX4 Interface Integrated eXAUI Macro COST $20,000 < $1,000 POWER 85 W 25 W Approximate power and cost for 12 optical Approximate power and cost for modules and switch switch Fujitsu Microelectronics America, Inc. / Fujit
Slide 11: Impact on Equipment Size
Impact on Equipment Size Size 20U 1U 1/20 12-port, 10GbE Switch Equipment Current 12-port, 10GbE Switch Equipment Using MB87Q3070 Fujitsu Microelectronics America, Inc. / Fujitsu Laboratories of America, Inc. / Fujitsu Components America, Inc. / Eudyna Devices USA Inc. 05/11//04 12
Slide 12: Applications: Compute and Server Clusters
Applications: Compute and Server Clusters Clustering using Scalable Switches 10GbE PIPE 10GbE PIPE Cluster Compute or File Servers Fujitsu Microelectronics America, Inc. / Fujitsu Laboratories of America, Inc. / Fujitsu Components America, Inc. / Eudyna Devices USA Inc. 05/11//04 13
Slide 13: Applications
Applications Modular Servers Server / Storage Connection • Blade server • Telecom server WAN WAN 10G Ethernet iSCSi Backbone for IDC / ISP / IX and Enterprise / Campus ISP ISP … ISP … Edge Router L2 SW ・・・ Core Router L2 Switch ・・・ L2/L3 SW Router Housing Housing Fujitsu Microelectronics America, In
Slide 14: 10GbE Switch Chip Roadmap
10GbE Switch Chip Roadmap June 25, 2003 March 25, 2004 Q1 2005 Q4 2005 Release 10GbE Switch with Enhanced Enhanced Version 10GbE Switch CX-4, eXAUI Version 90nm SW Core II SW Core SW Core SW Core (16+ ports) Layer 2+ Layer 2-7 Layer 2 SW Layer 2 SW SW SW XAUI eXAUI eXAUI eXAUI / XFI Feature Enhancem
Slide 15: Summary
Summary • Enhanced Single-Chip, 12-port, 10Gbps Ethernet Switch • 10Gbps Ethernet over copper cable • Value Proposition • Enables building cheaper, low-power, small form-factor, high-performance 10GbE equipment • Lowers the total system cost of the high-performance IT infrastructure • Provides suppo
Slide 16: microGiGaCN
microGiGaCN™ Bob Thornton Director, Marketing Fujitsu Components America, Inc. Fujitsu Microelectronics America, Inc. / Fujitsu Laboratories of America, Inc. / Fujitsu Components America, Inc. / Eudyna Devices USA Inc. 05/11/04 17
Slide 17: microGiGaCN Lineup: Series Expansion
microGiGaCN™ Lineup: Series Expansion Transmission Distance (m) Type Applications 1 5 10 20 100 300 microGiGaCNTM InfiniBand™ 4X, 2.5Gbps 12X 0.5 to 6 10G FC, CX4, XAUI 0.5 to 4 3.1875Gbps e-MGC InfiniBand™ 4X, 5 to 20 12X 10G FC, CX4, XAUI 5 to 20 x-MGC CX4 0.5 to 20 o-MGC InfiniBand™ 20 to 300 10G
Slide 18: 10Gbps Ethernet PHY
10Gbps Ethernet PHY Media Access Control (MAC) Full Duplex 10 Gigabit Media Independent Interface (XGMII) or 10 Gigabit Attachment Unit Interface (XAUI) CWDM LAN PHY Serial LAN PHY Serial WAN PHY (8B / 10B) (64B / 66B) (64B / 66B + WIS) CX4 CWDM Serial Serial Serial Serial Serial Serial IB FC PMD PM
Slide 19: 10Gbps Ethernet PHY
10Gbps Ethernet PHY 10GBASE-ER (LAN), -EW (WAN) 1550nm, SM 10GbE 10GBASE-LR (LAN), -LW (WAN) 1310nm, SM 10GBASE-SR (LAN), -SW (WAN) 1310nm, GI 10GBASE-LX4 10GBASE-LX4 1310nm (WDM), GI 1310nm (WDM), SM 10Gb/s on FDDI-Grade Working group started Nov. 2003 MM Fiber Study Group 10GBASE-T Under standardi
Slide 20: x-MGC Applications
x-MGC Applications City – City WAN Server Storage Data Center Building-Building LAN Distance 2m 25 m 300m 40 km x-MGC XENPAK/X2 (Optic) • Network equipment, 10Gbps Ethernet routers and switches • Interconnects inside a data center, where short distances are required • In place of optical module Fuji
Slide 21: x-MGC (X2-CX4) Structure
x-MGC (X2-CX4) Structure microGiGaCN™ Cable (20m) System x-MGC or o-MGC (300m) XAUI CX4 Media MAC PHY-IC Detect Circuit (MDC) Signal data rate: 3.125Gbps Operating case temperature: 0 to 70 degree C UI: 320ps Supply voltage: 3.3V / 1.5V Total jitter: 0.35UIp-p max. Power consumption: 3W max. (2.1W P
Slide 22: x-MGC (X2-CX4) Overview
x-MGC (X2-CX4) Overview x-MGC x-MGC XENPAK type X2 type (Mid Standard) P/N: FCU-010M001 P/N: FCU-022M101 I/F: microGiGaCN™ I/F: microGiGaCN™ Fujitsu Microelectronics America, Inc. / Fujitsu Laboratories of America, Inc. / Fujitsu Components America, Inc. / Eudyna Devices USA Inc. 05/11//04 23
Slide 23: x-MGC (X2-CX4) Latch Release Process
x-MGC (X2-CX4) Latch Release Process Pull Latch release Latch lock mode Latch release mode The module is easily installed simply by inserting it into the X2 card slot Fujitsu Microelectronics America, Inc. / Fujitsu Laboratories of America, Inc. / Fujitsu Components America, Inc. / Eudyna Devices US
Slide 24: x-MGC
x-MGC 10GBase-CX4: X2 Module Low / PCI Mid / Standard High / Standard Fujitsu Microelectronics America, Inc. / Fujitsu Laboratories of America, Inc. / Fujitsu Components America, Inc. / Eudyna Devices USA Inc. 05/11//04 25
Slide 25: x-MGC (X2-CX4) Variations
x-MGC (X2-CX4) Variations mm Variations A B C Low MSA 11.00 12.00 0.31 PCI FCL 11.00 14.00 0.31 Mid MSA 13.46 19.46 0.31 On-board FCL 11.00 19.46 0.31 Mid MSA 13.46 19.46 2.69 Standard FCL 11.00 19.46 2.69 High MSA 22.86 28.86 0.31 On-board FCL 11.00 28.86 0.31 MSA 22.86 28.86 2.69 A High B C Standa
Slide 26: x-MGC Features
x-MGC Features • 10GbE (IEEE802.3ak,10GBASE-CX4) compliant • High-speed I/F is microGiGaCN™ • Low-cost solution compared to optics transceiver • Single PCB structure • 3.125 Gbps x 4 pairs bi-directional, 8B/10B in differential • With a media converter (o-MGC), up to 300m@2.5Gbps, 100m@3Gbps over mu
Slide 27: o-MGC
o-MGC Outer Connection View microGiGaCNTM & e-MGC o-MGC microGiGaCN + o-MGC MPO fiber cable • Optical converter module, with built-in microGiGaCN™, can extend high- speed transmission up to 300m • With Media Detect Circuit (CN detect and power supply) on the host, provides flexibility for transmissi
Slide 28: Loop-back microGiGaCN
Loop-back MICRO GIGACN View Loop-back pattern / layout on the PCB Features Schedule • System / port testing for CX4 Available now • Terminating plug embedded in module • Mating with CX4 standard I/O socket Fujitsu Microelectronics America, Inc. / Fujitsu Laboratories of America, Inc. / Fujitsu Compo
Slide 29: Summary
Summary • Inventor of copper connector technology that has allowed the use of low-cost copper in the 10Gbps Ethernet arena (CX4) • Standard connector has been adopted by multiple standards bodies (InfiniBand, SAS, sATA2, 10G Fiber Channel, and 10G Ethernet CX4) • Offering both XENPAK and X2 CX4 copp
Slide 30: Introducing Eudyna and New Optical Communications Plans
Introducing Eudyna and New Optical Communications Plans Jane Li Vice President, Marketing / Sales Eudyna Devices USA Inc. Fujitsu Microelectronics America, Inc. / Fujitsu Laboratories of America, Inc. / Fujitsu Components America, Inc. / Eudyna Devices USA Inc. 05/11/04 31
Slide 31: What is Eudyna?
What is Eudyna? Is to broaden, to expand Is dynamic, speedy A Fujitsu-Sumitomo Joint Venture Fujitsu Microelectronics America, Inc. / Fujitsu Laboratories of America, Inc. / Fujitsu Components America, Inc. / Eudyna Devices USA Inc. 05/11//04 32
Slide 32: Optical Network Supply Chain is Evolving
Optical Network Supply Chain is Evolving The market is evolving. Players and business models are changing. Optical networks value chain Systems/ Components Modules Service equipment Early 1990s- Component players Long distance integrated Integrated equipment players Local Expanding component players
Slide 33: What System Houses Want
What System Houses Want • Low cost • Shorter lead time • Focus on service and integrated solutions for service providers • Let suppliers handle more of the “hardware” Fujitsu Microelectronics America, Inc. / Fujitsu Laboratories of America, Inc. / Fujitsu Components America, Inc. / Eudyna Devices US
Slide 34: History
History 1970 Compound Semiconductor R&D Started at Fujitsu Laboratory 1973 World’s First High-Power GaAs-FET Announced 1979 HEMT Invention 1980 World’s First Ge-APD Product 1981 Development of New Device Structure for GaAs-LSI 1982 Long Wavelength Laser Diode for Long Haul Fiber Communication 1984 F
Slide 35: Broadening Product Line
Broadening Product Line (“Eu” is Broaden) More to Come • We have continuously Transceivers (SFPs, XFPs, X2s) broadened our product portfolios Transponders (300 Pins, Tunable) • The Fujitsu-Sumitomo JV gives us more opportunity Laser Products (EML, DFB, FP) to look “outside the box” PIN / APD / Recei
Slide 36: Vertical Integration
Vertical Integration Active Components Active Modules LN Mod TXO Module Controller CW-LD Md LD Module LD Md LD Module w/ LDD Driver IC w/ LDD MUX MUX TX TRP PD/TIA Md PD/Amp Controller TRX AGC/LIA IC Module PD/Amp Md CDR/DEMUX CDR/DEMUX RX Eudyna/Fujitsu Component Products Module Products Fujitsu Mi
Slide 37: Full Suite of Transponders / Transceivers
Full Suite of Transponders / Transceivers • 300 Pin • SR-1, IR-2, LR-2, DWDM • SFF • SFP • SR-1, IR-2, LR-2, DWDM, CWDM • Extended temperature range • XFP • SR-1, IR-2, LR-2, DWDM • Low power consumption • X2 • LX4 • SR, LR, ER Fujitsu Microelectronics America, Inc. / Fujitsu Laboratories of America
Slide 38: 10Gbs X2 MSA Transponder
10Gbs X2 MSA Transponder • 10G Ethernet-specific transponder • 1310nm (10km), 1550nm (40km) • 70-pin connector • XAUI data interface (Integrated SerDes 4-bit interface) • Management diagnostic interface X2 MSA module • MDIO management interface • Hot pluggable module MUX LD Module 4×3.125Gbps (4:1)
Slide 39: Eudyna Devices USA Inc.
Eudyna Eudyna Devices USA Inc.
Slide 40: Fujitsu Booth #1853
Fujitsu Booth #1853 Full Suite of 10Gbps Ethernet Product Offerings X2 10GE SW Chip CX4 XENPAK Fujitsu 30m 20m cable cable XAUI Monitor Fiber IXIA 400T Fujitsu Microelectronics America, Inc. / Fujitsu Laboratories of America, Inc. / Fujitsu Components America, Inc. / Eudyna Devices USA Inc. 05/11//0
Slide 41: Summary
Summary • Fujitsu’s Full Suite of 10Gbps Ethernet Product Offerings • ASICs • XAUI, eXAUI, 10Gbps SERDES (2 channels) • 10Gbps Ethernet Switch Chip – ASSP • The industry’s first 12-port 10Gbps Ethernet switch chip with 10GBASE-CX4, 10GbE over copper interface • Lower cost, power and size • microGiGa
Slide 42: Fujitsu Microelectronics America, Inc. / Fujitsu Laboratories of America, Inc. / Fujitsu Components America,
Fujitsu Microelectronics America, Inc. / Fujitsu Laboratories of America, Inc. / Fujitsu Components America, Inc. / Eudyna Devices USA Inc. 05/11//04 43