Diodes Incorporated · NASDAQ:DIOD
Diodes — Diodes Inc /Del/ — Non-Deal Roadshow (June 2016)
35 slides from Diodes's roadshow presentation, Jun 21, 2016
Slide 1: June 2016 Investor Meetings
June 2016 Investor Meetings Exhibit 99.1
Slide 2: Safe Harbor Statement
Page 2 Safe Harbor Statement Any statements set forth herein that are not historical facts are forward-looking statements that involve risks and uncertainties that could cause actual results to differ materially from those in the forward-looking statements. Such forward-looking statements include, b
Slide 3: Management Representative
Page 3 Management Representative Dr. Keh-Shew Lu President and CEO Diodes Incorporated Since 2005 Texas Instruments 27 years Experience: Senior Vice President of TI Worldwide Analog and Logic President of Texas Instruments – Asia Education: Master's Degree and Doctorate in Electrical Engineering Tex
Slide 4: Company Representative
Page 4 Company Representative Laura Mehrl Director of Investor Relations Since May 2010 Experience: Director of Investor Relations, Diodes Incorporated, Plano, Texas Senior Business Development Manager, STMicroelectronics, Carrollton, Texas Sales Director for Analog Devices Inc., Shanghai, China Pro
Slide 5: About Diodes Incorporated
Page 5 A leading global manufacturer and supplier of high-quality application specific, standard products within the broad discrete, logic and analog markets, serving the consumer, computing, communications, Industrial and automotive segments. About Diodes Incorporated
Slide 6: Business Objective
Page 6 Business Objective To consistently achieve above-market profitable growth , utilizing our innovative and cost-effective packaging and silicon technology, suited for high volume, high growth markets by leveraging process expertise and design excellence to deliver high quality semiconductor pro
Slide 7: Significant Market Opportunity
Page 7 $140 bn $33 bn $77 bn $45 bn $21 bn $19 bn Opto Discrete Micro/Special Std Logic Analog Memory 2015 Total Semiconductor Market ($335 bn) Significant Market Opportunity Diodes’ SAM: $10 - $12 bn Diodes’ SAM: $14 - $16 bn Diodes’ SAM: $1 - $3 bn
Slide 8: Diodes Growth Strategy
Page 8 Diodes Growth Strategy Many Paths for Growth: Product Portfolio Product arena Product line expansion Performance enhancement Application Space Targeted end equipment Broad customer base Increased product coverage Packaging Breadth Broad packaging portfolio Increased power density Small form f
Slide 9: Pericom Fits Diodes' M&A Strategy
9 Synergistic with Diodes’ packaging capabilities and capacity Accretive in 1 year Enter new product area Access to new markets / new customers Gain access to process and/or packaging technology Strengthen regional sales potential Page 9 Pericom Fits Diodes’ M&A Strategy SYNERGISTIC FACTORS Degree o
Slide 10: A Strong Global Partnership
10 High volume Discrete, Analog and Logic products Cost efficient manufacturing capabilities Strong global presence Broad product and customer base 3 C's and industrial with emerging focus on Automotive Broader Analog and added mixed-signal product lines Expanded platform content in applications whe
Slide 11: Broad Consolidated Product Offering
Page 11 Standard Products Diodes Rectifiers Standard Linear Power Management ICs Connectivity MOSFETs Protection Devices Sensors Bipolar Transistors Function Specific Arrays Digital Broadcast by Satellite Standard Logic ICs Audio Discrete ASSP Broad Consolidated Product Offering IntelliFET and SBR a
Slide 12: Pericom Total Timing Solutions
Page 12 Pericom Total Timing Solutions Comprehensive portfolio for complete clock tree solutions Highest frequency clock buffers Low voltage, low power clock generators Real time clock (RTC) generators Programmable crystal oscillators Ultra low jitter crystal oscillators Temperature compensated crys
Slide 13: USB Type C: Highly Attractive Market Opportunity
Page 13 DisplayPort USB Type A USB Type B USB Micro B Power USB Type C All-in-One Connector USB Type C Connector Highly Attractive Market Opportunity 10Gbps reversible connector: single USB cable for data, audio, video and power Driven by next generation mobility platforms: notebook, smart phone, ta
Slide 14: USB Type C Power Delivery
Discrete • TVS for USB3.0/3.1 • High Voltage Power Switch • Load Switch • MOSFET Analog & Power • Type C Charger CC Detection • PD Adaptor Controller • High Voltage LDO • High Voltage USB Power Switch • DCDC Converter • ACDC Power Solutions High-Speed Serial Connectivit y • USB3.0/3.1 and DP/HDMI MU
Slide 15: Complete Platform Solutions: Notebooks
Timing Signal Integrity Switching Connectivity High-Speed Serial Connectivity Complete Platform Solutions: Notebooks
Slide 16: Performance Enhancement
Page 16 SKY Rectifiers MOSFETs Bipolar LDO DC-DC (Asynchronous) AC-DC (Secondary side controllers) LED Drivers (DC Input) Performance Enhancement Diodes’ product upgrade has expanded our SAM. SBR ® (Super Barrier Rectifiers) ( Vb < 400v) DIOFET TM (Low R DS(on) , Vb < 100V) CMOS LDO (Low power) DC-D
Slide 17: Efficiency, Functionality and Control for Smartphones
Page 17 Efficiency, Functionality and Control for Smartphones LED Backlighting LED Drivers Boost Converters Schottky Diodes LCD / OLED Display Bias LCD Bias ICs OLED Bias ICs Schottky Diodes LED Flash Module Camera Flash Drivers ZXMN series MOSFETs Keypad Backlighting LED Drivers Boost Converters Sc
Slide 18: Strong Relationships Drive LCD/LED TV Product Roadmaps
Page 18 Strong Relationships Drive LCD/LED TV Product Roadmaps LCD Display Buffer 40V High-gain BJT System Power Conversion Low Dropout Regulators DC-DC Converters Voltage References Synchronous MOSFET Controllers 40V/100V SBR and Schottkys Bridge Rectifier Diodes LCD LED Backlighting Current Monito
Slide 19: Product Breadth and Performance for Computing Platforms
Page 19 Product Breadth and Performance for Computing Platforms LCD / LED Backlighting LED Drivers Boost Converters Schottky Diodes Battery Power Management Current Monitors Load Switches Low-Saturation BJT ZXMP series MOSFETs System Voltage Conversion Low Dropout Regulators DC-DC Converters Schottk
Slide 20: Automotive Quality for Demanding Automotive Applications
Page 20 Automotive Networking ESD Protection TVS Protection Seat Control Module Hall Sensor SBR IntelliFET ® Voltage Reference Body Control Module Bipolar Transistors Shunt Regulator Voltage Reference IntelliFET MOSFETs Hall Sensor Braking Control Unit Voltage Reference IntelliFETs MOSFETs Hall Sens
Slide 21: Power and Signal Management for the Broad Industrial Market
Page 21 Power and Signal Management for the Broad Industrial Market Power Management AC-DC Converters DC-DC Converters LDO Regulators HV Regulators Shunt Regulators Gate Drivers Synchronous Rectifiers HV Rectifiers and Bridges SBRs HV Switches Signal Conditioning Op Amps Comparators Linear Hall Volt
Slide 22: Complete Charger and Power Adapter Solution and Trend
Page 22 Primary Rectifiers Primary Rectifiers Bridges Bridges Diodes Diodes PSR Controllers PSR Controllers AP3775/6 AP3775/6 Secondary Rectifiers Secondary Rectifiers Schottky Diodes Schottky Diodes SBR ® SBR ® Sync. Rectifiers Sync. Rectifiers PSR Accelerator AP434X PSR Accelerator AP434X Standby
Slide 23: Packaging Focus: Miniaturization and Power Efficiency
Page 23 TSSOP-8/14/16L SOT89 SC59 SOT353/363 SOT143/SC82 SOT543/553 /563/666 SOT223 ~ 2015 SOT953/963 QSOP-16/20L TSOT23-5/6 DFN0603 Power5060-8L ITO220AC-S DFN1114-3 DFN5060-4 Power3333-8L DFN0808-4 DFN0806-3 PD-123/323 PowerDI3030 MSOP-8/10L TO263-2/3/5L TO220-3L SOP-8/14/16L-EP MSOP-8/EP TO252-2/
Slide 24: Packaging Focus: Miniaturization and Power Efficiency
Page 24 Packaging Focus: Miniaturization and Power Efficiency Power Efficiency Miniaturization DDFN0402 Possibly the smallest Discrete semiconductor package. Compared to a TO252 , the PowerDI ® package delivers twice the power density from a 55% smaller footprint. PowerDI ® TO252
Slide 25: Packaging Wafer Fabs
Page 25 Packaging Wafer Fabs Shanghai-based packaging with capacity approximately 30 billion units The new packaging facility in Chengdu has a potential capacity of 5X that of Shanghai Additional packaging facilities in Neuhaus, Germany and in Chengdu, China Two discrete fabs, two analog fabs in Kan
Slide 26: Collaborative Customer Relationships
Page 26 Collaborative Customer Relationships
Slide 27: Annual Revenue Growth Rates Outperforming the Industry
Page 27 Annual Revenue Growth Rates Outperforming the Industry Industry (Discrete + Analog + Logic) 2005 to 2015 Growth Diodes Inc.: 14.7% 15.6% 59.9% 16.9% 8.0% 4.0% 41.1% 3.6% -0.20% 30.5% 7.7% -3.5% -3.3% 13.5% -0.5% -1.3% -12.2% 34.4% -6.2% -7.1% 6.8% 11.4% -4.9% -20% -10% 0% 10% 20% 30% 40% 50%
Slide 28: Revenue Growth
Page 28 Revenue Growth ( In millions ) +41% +3.6% -0.2% +7.7% ( Acquisition Years ) * * * * * +30.5% - 4.7% 826.8 890.7 848.9 1000 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015
Slide 29: Revenue Profile – 1Q2016
Page 29 Asia Pacific Europe North America Distribution OEM / EMS Industrial Consumer Communications Automotive Computing 9% 80% 11% 68% 32% 19% 21% 24% 30% 6% Revenue Profile – 1Q2016 By Channel By Region By End Market
Slide 30: First Quarter 2016 Financial Performance
Page 30 In millions, except per share 1Q15 4Q15 1Q16 First Quarter 2016 Financial Performance Revenue $206.2 $214.4 $222.7 Revenue Growth 8.0% 3.9% Gross Profit (GAAP) $63.9 $53.6 $64.2 Gross Profit Margin % (GAAP) 31.0% 25.0% 28.8% Net Income (GAAP) $11.1 -$4.8 -$1.7 Net Income (non-GAAP) $12.7 $6.
Slide 31: Balance Sheet
Page 31 Balance Sheet Dec 31, 2015 Cash $243 $218 $237 Short-term Investments $12 $65 $43 Inventory $182 $203 $205 Current Assets $676 $751 $745 Total Assets $1179 $1599 $1580 Long-term Debt $141 $454 $440 Total Liabilities $369 $756 $734 Total Equity $810 $843 $846 Mar 31, 2016 In millions Dec 31,
Slide 32: 2Q 2016 Business Outlook
Page 32 Expect revenue to range between $230 million and $240 million, or up 3.3 to 7.7 percent sequentially; Expect GAAP and non-GAAP gross margin to be 31.5 percent, plus or minus 2 percent; Non-GAAP operating expenses are expected to be approximately 25 percent of revenue, plus or minus 1 percent
Slide 33: Global Manufacturing Infrastructure
2 1 5 3 4 1 1 1 6 2 Page 33 Kansas City, MO Wafer Fab Shanghai, China Packaging Neuhaus, Germany Packaging Oldham, UK Wafer Fab Chengdu, China Packaging Shanghai, China Wafer Fab Global Manufacturing Infrastructure Jinan, China Crystal Fab, Packaging Jhongli, Taiwan Oscillator Module Packaging
Slide 34: Strategy: Profitable Growth
Page 34 Diodes Strategy: Profitable Growth
Slide 35: Thank you
Diodes was named one of the 10 Best Stocks of the Past 20 Years March 2012 Thank you Company Contact: Diodes Incorporated Laura Mehrl Director of Investor Relations P: 972-987-3959 E: laura_mehrl@diodes.com Investor Relations Contact: Shelton Group Leanne K. Sievers EVP, Investor Relations P: 949-22