ASML Holding NV · EURONEXT:ASML

ASML Holding NV — Investor Day (September 2021)

27 slides from ASML Holding NV's investor day presentation, Sep 29, 2021

  1. Slide 1: EUV Products and Business Opportunity

    EUV Products and Business Opportunity Christophe Fouquet Executive Vice President Business Line EUV Public

  2. Slide 2: EUV products and business opportunity: Key messages

    EUV products and business opportunity Key messages Slide 2 29 Sept. 2021 ASML EUV lithography extends our Logic and DRAM customers roadmap by providing lithography resolution improvement, state of the art overlay performance and year on year cost reduction Our customers are using EUV in Logic node a

  3. Slide 3: EUV 0.33 NA is in production for both Logic and DRAM

    • EUV 0.33 NA is in production for both Logic and DRAM, and its adoption is expected to continue to grow EUV 0.33 NA extension and EUV 0.55 NA introduction is expected to extend EUV values to the next decade Our increased EUV product and service value is expected to continue to drive profitability P

  4. Slide 4: EUV 0.33 NA is in production, for both Logic and DRAM

    EUV 0.33 NA is in production, for both Logic and DRAM All advanced semiconductor manufacturers expected to run EUV in Slide 4 29 Sept. 2021 production by 2024 Fastest, Largest-capacity Mobile Memory Based on today’s most advanced (1z) process node, Samsung’s new 16Gb LPDDR5 is the first memory to be

  5. Slide 5: EUV 0.33 NA adoption enabled by platform maturity in high-volume manufacturing

    EUV 0.33 NA adoption enabled by platform maturity in high-volume manufacturing Slide 5 29 Sept. 2021 100% 3000 System output Max wafers per day (single system, weekly average) 95% 2500 90% Installed base system availability Wafers per day Availability 4 weeks moving average (end of period) 85% 2000

  6. Slide 6: EUV 0.33 NA adoption expected to continue for Logic and DRAM

    EUV 0.33 NA adoption expected to continue for Logic and DRAM to support most advanced device roadmap Slide 6 29 Sept. 2021 Actuals Today Roadmap 30 Number of exposures 20 Logic Memory max min 10 0 700% 600% 500% 400% 600% 500% 400% 700% 2018 2019 2020 2021 2022 2023 2024 2025 Public

  7. Slide 7: EUV increased adoption expected to result in >2x increase of wafer moves

    EUV increased adoption expected to result into >2x increase of EUV wafer moves per year 2025 compared to 2021 Slide 7 29 Sept. 2021 800% Actuals Today Roadmap 30 (ambition) Total EUV wafers exposed per year Memory Number of exposures 20 Logic Memory max min 10 Logic 100% 0 700% 600% 500% 400% 600% 5

  8. Slide 8: ASML to address EUV demand by increasing shipments and system productivity

    ASML to address EUV demand by increasing shipments and system productivity Slide 8 29 Sept. 2021 Actuals Today Roadmap 800% (ambition) 400% Shipments/Capacity per year [#] System Throughput [wph*] 300% 200% |100% 700% 600% 500% 400% 600% 500% 400% 700% 800% 2018 2019 2020 2021 2022 2023 2024 2025 NX

  9. Slide 9: ASML to address EUV demand by increasing shipments and system productivity

    ASML to address EUV demand by increasing shipments and system productivity Slide 9 29 Sept. 2021 800% Actuals Today Roadmap (ambition) Total EUV wafers exposed per year Memory 700% EUV wafer capacity [units x wph] Shipments/Capacity per year [#] Fab Model: EUV estimated (3600D) Fab Capacity Exposure

  10. Slide 10: Higher than previously projected DRAM adoption will drive EUV demand

    Higher than previously projected DRAM adoption will be an additional driver for EUV demand Slide 10 29 Sept. 2021 800% Actuals Today Roadmap (ambition) Total EUV wafers exposed per year Memory 700% 600% 500% 400% 300% Logic 200% 100% 600% 500% 400% 700% 2018 2019 2020 2021 2022 2023 2024 2025 Public

  11. Slide 11: EUV reduces lithography and process steps, defects, cost and cycle time

    EUV reduces lithography and process steps resulting in significant defect, cost and cycle time reduction Slide 11 29 Sept. 2021 No EUV – EUV (0.33 NA) Critical Total litho masks process steps 120% # Process steps No EUV No EUV 100% No EUV EUV (0.33 NA) EUV 80% (0.33 NA) EUV 60% (0.33 NA) EUV value t

  12. Slide 12: Samsung reported >20% defect reduction at EUV introduction

    Samsung reported >20% defect reduction at EUV introduction versus multi-patterning immersion (ArFi) Slide 12 29 Sept. 2021 Eliminating multi-patterning related defects Defects ratio Patterning ArFi MPT EUV SET > 20% DRAM D1xBLP BLP Defects ration [%] SEM Image Enhancing patterning precision and cost

  13. Slide 13: EUV extension and EUV 0.55 NA introduction

    EUV is in production for both Logic and DRAM, and its adoption is expected to continue to grow • EUV extension and EUV 0.55 NA introduction is expected to extend EUV values to the next decade Our increased EUV product and service value is expected to continue to drive profitability Public

  14. Slide 14: ASML to extend DUV and EUV platforms at the pace required by customers

    ASML is expected to continue to extend DUV and EUV platforms at the pace required by our customers Slide 14 29 Sept. 2021 Wavelength NA, Half pitch 2020 2021 2022 2023 2024 ≥2025 DUV 1.35 NA, 38 nm NXT:2000i NXT:2050i NXT:2100i NEXT (ArFi) 2.0 nm | 275wph 1.5 nm | 295wph 1.3 nm | 295wph NXE:3400C NX

  15. Slide 15: EUV 0.55 NA to be added to EUV portfolio for high-volume manufacturing 2025-2026

    EUV 0.55 NA is expected to be added to EUV portfolio to support high-volume manufacturing in 2025 - 2026 Slide 15 29 Sept. 2021 Wavelength NA, Half pitch 2020 2021 2022 2023 2024 ≥2025 DUV 1.35 NA, 38 nm NXT:2000i NXT:2050i NXT:2100i NEXT (ArFi) 2.0 nm | 275wph 1.5 nm | 295wph 1.3 nm | 295wph NXE:34

  16. Slide 16: EUV 0.55 NA expected to again reduce litho and process steps

    EUV 0.55 NA expected to once again reduce litho and process steps at the horizon of 2025 - 2026 for both Logic and DRAM Slide 16 29 Sept. 2021 Critical litho masks Total process steps EUV value to customers 120% No EUV EUV (0.33 NA) No EUV EUV (0.33 NA) Less defects 100% EUV EUV EUV (0.33 NA) (0.55

  17. Slide 17: EUV 0.55 NA scanner is an evolutionary step on EUV technology

    EUV 0.55 NA is an evolutionary step on EUV technology, we have the source, we developed new optics Slide 17 29 Sept. 2021 NXT EUV 0.33 NA EUV 0.55 NA System changes platform to platform High Source 193 nm deep UV light 13.5 nm EUV light 13.5 nm EUV light Many Existing changes technology Source: diff

  18. Slide 18: Large part of the EUV 0.55 NA platform common with EUV 0.33 NA

    A large part of our EUV 0.55 NA platform is expected to be common with our EUV 0.33 NA reducing introduction risk, cost and R&D Slide 18 29 Sept. 2021 RETICLE HANDLING RETICLE STAGE PROJECTION OPTICS BOX ILLUMINATION SOURCE WAFER HANDLING WAFER STAGE DRIVE LASER Specific Common Public

  19. Slide 19: EUV optical projection mirrors: ASML and Zeiss cooperation

    EUV optical projection mirrors ASML and Zeiss cooperation on mirror design and unique metrology system Slide 19 29 Sept. 2021 EUV 0.55 NA mirror metrology fully operational at Zeiss Public

  20. Slide 20: EUV optical projection mirrors: unprecedented size and accuracy

    EUV optical projection mirrors Mirrors of unprecedented size and accuracy Slide 20 29 Sept. 2021 EUV 0.55 NA optics: 1m diameter with accuracy of 20pm If you were to enlarge these mirrors to the size of planet Earth, the biggest aberration would be the diameter size of a human hair EUV 0.55 NA mirro

  21. Slide 21: Facilities for integration of EUV 0.55 NA in progress

    Facilities for integration of EUV 0.55 NA in progress Slide 21 29 Sept. 2021 Cleanroom, Fab ASML Veldhoven Public

  22. Slide 22: EUV 0.55 NA manufacturing through integration of 4 pre-qualified modules

    EUV 0.55 NA manufacturing is expected to improve quality and cycle time through integrations of 4 pre-qualified modules Slide 22 29 Sept. 2021 RETICLE HANDLINGPre-qualifiedRETICLE module: RETICLE STAGE PROJECTION Pre-qualified Pre-qualified module : OPTICS module: OPTICS BOX ILLUMINATION SOURCE SOUR

  23. Slide 23: Increased EUV product and service value to drive profitability

    EUV is in production for both Logic and DRAM, and its adoption is expected to continue to grow EUV extension and EUV 0.55 NA introduction is expected to extend EUV values to the next decade • Our increased EUV product and service value is expected to continue to drive profitability Public

  24. Slide 24: Increased EUV value combined with cost reduction to drive better profitability

    Increased EUV product and service value combined with cost reduction expected to drive better profitability Slide 24 29 Sept. 2021 400% Today Roadmap Actuals 300% Average wafer per day* System throughput * 2 nm Overlay [nm] 200% 100% 1 nm 500% 2018 2019 2020 2021 2022 2023 2024 2025 NXE:3400B NXE:34

  25. Slide 25: EUV products and business opportunity: Key messages

    EUV products and business opportunity Key messages Slide 25 29 Sept. 2021 ASML EUV lithography extends our Logic and DRAM customers roadmap by providing lithography resolution improvement, state of the art overlay performance and year on year cost reduction Our customers are using EUV in Logic node

  26. Slide 26: Forward Looking Statements

    Forward Looking Statements Slide 26 29 Sept. 2021 This presentation contains statements that are forward-looking, including statements with respect to expected industry and business environment trends including expected growth, outlook and expected financial results, including expected net sales, gr

  27. Slide 27: Public

    Public

ASML — Investor Day (September 2021) on 6ix