Nanoveu Ltd. · ASX:NVU
Nanoveu — Merger or Acquisition (October 2024)
23 slides from Nanoveu's merger presentation, Oct 15, 2024
Slide 1: Unleashing the Power of Ultra-Low Power Semiconductor System on Chip for Next-Gen 3D Content
(ASX: NVU) & Unleashing the Power of Ultra-Low Power Semiconductor system on chip (SoC) for Next-Gen 3D Content October 2024 1
Slide 2: Disclaimer
Disclaimer The information in this presentation has been prepared by Nanoveu for the purposes of providing an overview of the company and its products. This presentation does not constitute investment advice. Neither does this presentation nor the information contained in it constitute an offer, inv
Slide 3: Transaction Summary
Transaction Summary x Structure NVU to acquire 100% of Embedded A.I. Systems Pte. Ltd (“EMASS”) including: - Proprietary System on a Chip business - IP portfolio Consideration Total Consideration of $5m in Shares plus Performance Rights: - 172,413,793 Shares (priced at 2.9c) - 83,333,333 Performance
Slide 4: Acquisition Rationale | Artificial Edge Computing for 3D Imaging
Acquisition Rationale | Artificial Edge Computing for 3D Imaging Founded in 2020 Founded by a Stanford-trained researcher and Nanoveu will integrate EMASS SoC capability into engineer whose groundbreaking research led to the EyeFly3D platform to support $75M of DARPA funding, EMASS was incubated at
Slide 5: Competitive Advantages
Competitive Advantages 20x Efficiency EMASS SoCs deliver 20x the energy $$$ COST ADVANTAGES By processing AI tasks on-device, EMASS SoCs reduce the need for efficiency compared to competitors, cloud infrastructure, minimising making them the leading solution for operational costs and enabling power-
Slide 6: System-on-Chip (SoC) Technology: Overview
EMASS Overview System-on-Chip (SoC) Technology: What is an SoC?: Powering Portable Benefits RISC-V A System-on-Chip (SoC) is a Technology: Architecture: technology-intensive SoCs enable small, “non-smart” The RISC-V instruction semiconductor that integrates devices to deliver a range of architecture
Slide 7: Brings BIG computation to SMALL chips
EMASS Brings BIG computation to SMALL chips Problem: As AI applications grow in complexity, greater performance and memory is required from our devices. Current devices have high power demands and struggle to deliver the full suite of emerging AI applications. Solution: EMASS proprietary tech solves
Slide 8: EMASS x Glasses-free 3D on more devices
EMASS x | Glasses-free 3D on more devices Enhanced 3D Experiences: Faster Performance: Lower Power Consumption: EMASS integrated into portable devices By eliminating the need for cloud EMASS’s ultra-low power SoCs enable and wearables extends Nanoveu's processing, EMASS SoCs accelerate 2D EyeFly3D t
Slide 9: EMASS x Glasses-free 3D on more devices
EMASS x | Glasses-free 3D on more devices 2D Content 2D to 3D Conversion Glasses-Free 3D Experiences + On Power- Hungry NVU’s Smartphones Smartphone proprietary Today AI Apps Leverage powerful computation of a 2D content smartphone to perform 2D to 3D conversions Low-power, portable devices Future O
Slide 10: Expands Market Opportunities for EMASS's SoC Technology
Expands Market Opportunities for EMASS’s SoC Technology Unlocks New Target Industries Beyond EyeFly3D Medical Imaging Autonomous Driving Systems IoT Devices Improve reach and portability of next- Improve safety by leveraging 5G Nanoveu has ability to license cutting-edge generation medical imagi
Slide 11: Expands Market Opportunities for EMASS
Expands Market Opportunities for EMASS has been tried and tested to deliver cutting-edge semi-conductor performance with industry leading power efficiencies Ability to undertake 13 Million AI Parameters and perform 30,000,000,000 operations per second while consuming < 2Milli-Watts. - Processing liv
Slide 12: Leading SoC Outperforms Peers
Leading SoC Outperforms Peers EMASS's edge AI capabilities and power efficiency outperforms peers in the semiconductor and SoC market, particularly in applications requiring high performance and low energy consumption. EMASS consistently achieves over 10 trillion AI operations per second per watt, f
Slide 13: EMASS | Cutting Edge, Low-Power Chip
EMASS | Cutting Edge, Low-Power Chip Ideal for integrating AI capabilities into battery-powered IoT devices Selected Chip Performances GoPs ≈ Clock Speed (GHz) × Instructions Per Cycle (IPC) × Number of Cores Max Peformance Power Consumption Company Chip Chip Type Target Industry (GoPs) (TPD) INTEL
Slide 14: EMASS | Cutting Edge Performance, Low Power Consumption
EMASS | Cutting Edge Performance, Low Power Consumption EMASS full semi- conductor System on Chip provides complete AI operational capability with leading power efficiency. EMASS is positioned as Less Power the ideal SoC to integrate Consumption into any battery-sensitive Legend IoT device without c
Slide 15: AI Task Benchmarking and Chips
EMASS | AI Task Benchmarking and Chips EMASS SOC has greater AI performance compared to today’s leading chips Image Classification Visual Wake Words STMicroelectronics Nucleo L4 STMicroelectronics STMicroelectronics Energy Consumption in µJ (log scale) STMicroelectronics Nucleo H7 Energy Consumption
Slide 16: EMASS | World Leading Founder
EMASS | World Leading Founder EMASS was founded with the world’s leading Chip manufacturers FOUNDER: Professor Mohamed Sabry Aly ● Associate Professor at Nanyang Technological University, Singapore ● Ph.D. in Electrical and Computer Engineering from EPFL ● Postdoctoral Research Fellow at Stanford Un
Slide 17: EMASS | Global Development Partners
EMASS | Global Development Partners EMASS has been developed with the world’s leading Chip manufacturers and partners Taiwan Semiconductor Fabless Design (I.P) Manufacturing Company (Market Cap: $1.2T) Moschip Technologies (Market Cap: $763M) Investment Partners, Performance Testing IC Fabrication S
Slide 18: Market for next-gen SoCs represents a massive opportunity
Market for next-gen SoCs represents a massive opportunity 18
Slide 19: Market Trends for SoCs
Market Trends for SoCs The System-on-Chip market is projected to reach USD 205.97 billion by 2029.1 EMASS’s edge AI SoC capabilities will provide Nanoveu with the opportunity to participate in the growing portable and power-sensitive technology markets. Investment Impact: This acquisition positions
Slide 20: The Vital Importance of SoCs
The Vital Importance of SoCs Edge AI and Machine Learning Use Cases: Augmented Reality (AR) and Virtual Reality (VR): SoCs enable real-time AI processing directly on devices, reducing reliance on cloud- SoCs allow for efficient 3D content processing, making immersive AR based systems and improving o
Slide 21: EMASS Stats | Ultra-Low Power Edge AI RISC-V
EMASS Stats | Ultra-Low Power Edge AI RISC-V EMASS UNPARALLED NUMBERS AT A GLANCE AI Capacity • 30 Giga-Operations Per second @ 50 MHz, 2mW • That is the ability for EMASS to perform 30 billion operations, in one second, using 2-Milliwatts. Power Efficiency • Upto 12 TOPs/W • That is 12 Trillion Ope
Slide 22: EMASS | Deep and Growing IP Portfolio
EMASS | Deep and Growing IP Portfolio Exclusively Licensed Patents Micro and Technology Edge (Target market) Disclosures: No Title 1 Rate-distortion Optimized Coding for Deep Neural Network Compression 2 Edge SoC with AI acceleration 3 Porting of EMBED OS 5.12.4 to ECS-DOT’s SoC and RISCV CPU 4 Port
Slide 23: Thank you for viewing
ASX|NVU Thank you for viewing NANOVEU PTE LTD NANOVEU LIMITED Blk 20 Ayer Rajah Level 5, 191 St Georges Crescent, Terrace, #08-09 Singapore Perth WA 139964 6000 Australia Singapore Tel: +61 8 6244 9095 Tel: +65 6557 0155