Kinik Co. · TWSE:1560

Kinik — Q2 2026 Earnings Presentation

36 slides from Kinik's earnings presentation, August 2026

  1. Slide 1: Q2 2026 Investor Meeting

    fa ~ TWSE STOCK CODE 1560 2 2026 Investor Meetin ir@kinik.com.tw www.KinikKcom.tw

  2. Slide 2: Disclaimers

    Disclaimers • The prospective statements released or mentioned in this presentation are based on our company’s data as well as the current situation. • The forward-looking statements contained in this presentation are affected by risks, uncertainties, and people’s inferences. As a result, actual res

  3. Slide 3: Outline

    Outline • Welcome Tony Pai, Vice President / Acting Spokesperson • Company overview • 2Q26 financial results • 2026 outlook • Q&A • Appendix: KINIK Visions/Missions, Products, Plants information 3 Copyright© KINIK COMPANY, All Rights Reserved.

  4. Slide 4: Company Overview

    Company Overview  Company established in 1953; TWSE Code 1560  Capital : 1,503 Million NTD$ (11-Aug. 2026)  Employees： ~2400 worldwide. (~1900 in Taiwan.)  2025 revenue NTD 8,149M, EPS=9.28 Product  Main products by 3 BUs & subsidiaries, and Sales Ratio in 2025 Introduction Grinding Wheel CMP D

  5. Slide 5: 2Q26 Consolidated Income statement

    2Q26 Consolidated Income statement  2Q26 revenue reached NTD 2.49B, up 8.7% QoQ. Gross margin was 40.1%, up 5.1 ppt QoQ; EPS was NTD 3.49.  1H26 revenue reached NTD 4.79B, up 23.1% YoY. Gross margin was 37.6%, up 6.1 ppt; EPS was NTD 6.44.  Revenue and gross margin growth were mainly driven by Qo

  6. Slide 6: 2Q26 Sales Performance by BUs

    2Q26 Sales Performance by BUs ABU: Grinding Wheel DBU: CMP Pad Conditioner SBU: Reclaim/Test Wafer Subsidiaries: Hongia, KTC, MKS, MGT  Company-wide: 2Q revenue reached NTD 2.49B, up 8.7% QoQ and 17.9.% YoY.  Grinding Wheel: Revenue grew 16.3% QoQ, driven by recovery in machinery and machine tool

  7. Slide 7: 1H'26 Sales Performance by BUs

    1H’26 Sales Performance by BUs ABU: Grinding Wheel DBU: CMP Pad Conditioner SBU: Reclaim/Test Wafer Subsidiaries: Hongia, KTC, MKS, MGT  Company-wide: 1H’26 revenue reached NTD 4.79B, up 23.1% YoY. Business Unit 1Q~2Q 2025 1Q~2Q 2026 YoY ABU+subsidiaries 852,994 1,175,895 25% 37.9% (Grind Wheel) DB

  8. Slide 8: 2Q26 Diamond Disk Sales (1/2)

    2Q26 Diamond Disk Sales (1/2) Diamond Disk Sales Ratio by Region 8 Copyright© KINIK COMPANY, All Rights Reserved.

  9. Slide 9: 2Q26 Diamond Disk Sales (2/2)

    2Q26 Diamond Disk Sales (2/2) • 2Q26 DBU revenue: NT$ 783M, QoQ +9.1%. • Revenue from our largest single customer's advanced node products, including sub-5nm and advanced packaging, accounted for 61.2% of total revenue. 2nm diamond disk sales surged 84%, and commenced shipments of diamond disks for

  10. Slide 10: 2Q26 SBU Wafer Sales

    2Q26 SBU Wafer Sales  2Q26 SBU revenue reached NTD 1.08B, up 4.4% QoQ.  2Q26 12-inch capacity increased to 360k wafers, coupled with sustained growth in specialty wafer sales. 10 Copyright© KINIK COMPANY, All Rights Reserved.

  11. Slide 11: Capacity and Capital Expenses

    Capacity and Capital Expenses  2026 CapEx budget: NT$1.5 billion  Expand DBU diamond disk monthly capacity to 70k units.  Expand SBU 12-inch wafer monthly capacity to 400k pieces. 11 Copyright© KINIK COMPANY, All Rights Reserved.

  12. Slide 12: Summary of Recent Key Events

    Summary of Recent Key Events  KINIK ESG Achievements: Included in the 2025 S&P Global CSA Machinery and Electrical Equipment ‘s " Sustainability Yearbook Member" and awarded the "Industry Mover“.  Leadership Recognition: Chairman Po-Chuan Bob Lin was named one of Harvard Business Review's (HBR) "T

  13. Slide 13: 2026 Outlook

    2026 Outlook  ABU Grinding Wheel Business Unit and Subsidiaries – Targeting double-digit+ YoY revenue growth in 2026, driven by demand recovery and merger synergies from the new subsidiary..  DBU CMP Diamond Disk – Demand for advanced node and advanced packaging diamond disks expected to surge seq

  14. Slide 14: Q & A Thanks for your attention

    Q & A Thanks for your attention investor relationship: ir@kinik.com.tw 14 Copyright© KINIK COMPANY, All Rights Reserved.

  15. Slide 15: Appendix

    Appendix Company Philosophy, Mission, and Vision  Introduction of KINIK Products  Plants Information Company Milestone 15 Copyright© KINIK COMPANY, All Rights Reserved.

  16. Slide 16: KINIK Company

    KINIK Company 16 Copyright© KINIK COMPANY, All Rights Reserved.

  17. Slide 17: History, Now, and Future of KINIK

    History, Now, and Future of KINIK 17 Copyright© KINIK COMPANY, All Rights Reserved.

  18. Slide 18: Core Technology Grinding

    Mw Core Technology “ Grinding” ©.,,,,. Le — «ek SS Tool £e? er Diamond Dresser Bonding Tool CMP Disk Si/SiC Wafer Thinning y )

  19. Slide 19: Major Product and Business Diagram

    Major Product and Business Diagram Customer Semiconductor/Electronics/Optical… Machinery/Mechanical… Industries • CMP Disk • Grinding Wheel Major • Test Wafer • Resin Wheel • Diamond Tool • Diamond Wheel Products • Reclaim wafer • Si/SiC Wheel • CBN Wheel • Plating Wheel SBU DBU ABU KTC Hongia (Semi

  20. Slide 20: Products Introduction

    中砂產品介紹 Products Introduction 20 Copyright© KINIK COMPANY, All Rights Reserved.

  21. Slide 21: KINIK's products in Semiconductor Industries

    KINIK’s products in Semiconductor Industries Revenue(NTD) in 2025 3.8 billion 2.5 billion Ingot test& CMP Wafer Dicing Dressing 2.5D/3D ABF Bevel grind reclaim Disk thinning blade board Package bonding grind wafer grind tool Wafer IC Manufacturing IC Packaging 研磨技術 (Grinding Technology by Diamond Ab

  22. Slide 22: Test / Reclaim Wafer

    測 試 & 再 生 晶 圓 Te s t / R e c l a i m Wa f e r What is test and reclaim wafer? 22 Copyright© KINIK COMPANY, All Rights Reserved.

  23. Slide 23: Test / Reclaim Wafer process

    測 試 & 再 生 晶 圓 Te s t / R e c l a i m Wa f e r 中砂的再生晶圓之製程特色以延性輪磨(Ductile Mode Grinding)加工取代傳統 研磨(Lapping)加工，目的是降低加工之變質層，減少化學藥品污染，且可提高加工 精度，為最先進之再生晶圓製程。 The features of the KINIK reclaimed wafers are refurbished by ductile mode grinding used to replace traditional lapping to lower the strained thickne

  24. Slide 24: CMP Diamond Disk

    CMP鑽石碟 Diamond Disk CMP (Chemical Mechanical Polish) 化學機械拋光，主要用於先進IC製程中，透過拋光墊與拋 光液同時透過機械與化學反應加工晶圓表面，達到表面晶圓材料的移除及整體的平坦化，才能接續後 續製程以及提高良率，進而能循摩爾定律持續微縮IC線寬面積，推展出N5/N3/N2先進製程。而鑽石 碟的功用就是在拋光晶圓的同時去加工拋光墊，以移除拋光時的副產物及穩定拋光速率並提升良率 及延長拋光墊使用壽命，是先進IC拋光製程中提升良率及控制成本中非常重要的一環。 CMP (Chemical Mechanical Polish) is widely

  25. Slide 25: KINIK CMP Module Lab

    KINIK CMP Module Lab Co-creation Platform (Now) As Is 25 Copyright© KINIK COMPANY, All Rights Reserved.

  26. Slide 26: Kinik's Diamond Disk Share

    Increasing Trend of Advanced IC CMP Layer Numbers & Kinik’s Diamond Disk Share Global CMP Diamond Disk Market Size and Kinik’s Market Share Trends (2020-2026) Source: SEMI, QY Research, and Kinik internal financial data and estimates; compiled by Kinik. 26 Copyright© KINIK COMPANY, All Rights Reserv

  27. Slide 27: CMP Diamond Disk

    CMP鑽石碟 Diamond Disk 中砂鑽石碟用於半導體化學機械研磨製程中修整研磨墊以達到理想移除率及平坦度。 KINIK diamond disk is used on semi-conductor CMP process in order to make the pad reach the desirable removal rate and uniformity. Conventional Disk DiaGrid® I-DiaGrid® S-DiaGrid® Advanced Disk：High Performance / Long Life Time Pyradia® EDP D

  28. Slide 28: EDP Disk for Metal Free Solution

    EDP Disk for Metal Free Solution  Diamond disk protected with EDP film for metal-free requested in advanced IC technologies. 28 Copyright© KINIK COMPANY, All Rights Reserved.

  29. Slide 29: equaDia Disk

    equaDia Disk® 鑽石碟  Advanced disk “equaDia” for excellence tip height leveling and longer lifetime. 29 Copyright© KINIK COMPANY, All Rights Reserved.

  30. Slide 30: Metal-free O-Pyradia

    Metal-free O-Pyradia® 鑽石碟  O-Pyradia CMP pad conditioner for advanced customer’s tightened metal contamination control. Pyradia Type O-Pyradia Pyradia Tip Height Control Photo Material of Substrate Polymer Metal Strong Metal O-Pyradia Diamond Free LM(Ni ; Cr Bonding Material Polymer powder) Bonding

  31. Slide 31: Semiconductor Grinding Wheel

    Semiconductor Grinding Wheel  The Wafer grinding wheels are used in the in-feed grinding process of semiconductor wafers such as Si, SiC, and advanced 2.5D/3D package (Cu/compound…etc.). The in-feed grinding process consists of rough and fine grinding processes. Wafer grinding wheels are made of di

  32. Slide 32: Plant Information

    廠區 Plant Information • Manufacturing Plants: Taiwan x5; Thailand x2. Japan x1 • Grind Wheel: ABU(Yingge), Hongia(Hsinchu), KTC Thailand, MGT Thailand, MKS Japan • Diamond Disk: DBU (Yingge & Shulin, Taiwan)) • Reclaim Wafer: SBU (Zhubei & Zhunan, Taiwan) 32 Copyright© KINIK COMPANY, All Rights Reser

  33. Slide 33: Plant Information

    廠區 Plant Information 總 公 司 Head Office 鶯歌廠區 Yingge Factory 239010 新北市鶯歌區中山路64號 No.64, Zhongshan Rd., Yingge Dist., New Taipei City 239010, Taiwan TEL:+886 2 2679-1931~40 Grinding Wheel, Diamond Disk, Dicing Blade 樹林廠區 Shulin Factory 238010 新北市樹林區中山路2段151巷16號 No.16, Ln. 151, Sec. 2, Zhongshan Rd., Sh

  34. Slide 34: Plant Information

    廠區 Plant Information 竹北廠區 Zhubei Factory 302059 新竹縣竹北市十興路260號 No.260, Shixing Rd., Zhubei City, Hsinchu County 302059, Taiwan TEL:+886 3 550-7160~5 竹科廠區 Hsinchu Science Reclaim & Test Wafer Park Factory 350401 苗栗縣竹南鎮科北五路6號 再生晶圓 & 測試晶圓 No. 6, Kebei 5th Rd., Jhunan Township, Miaoli County 350401, Taiw

  35. Slide 35: Plant Information

    廠區 Plant Information 鴻記工業股份有限公司 Hongia Industry Co, Ltd. 239008 新北市鶯歌區余厝巷2號 No. 2, Yucho Lane, Yingge Dist., New Taipei City 239008, Taiwan TEL:+886 2 2679-1006 Email : hongia-sale@kinik.com.tw www.hongia.com.tw Electroplated Diamond Wheel 電鑄砂輪 金力泰國有限公司 Kinik - Thai Co., Ltd. 225 Moo 7 , Khok Pip, S

  36. Slide 36: Acquired MKS (Japan) & MGT (Thailand) as subsidiaries on April 2025

    Acquired MKS (Japan) & MGT (Thailand) as subsidiaries on April 2025 36 Copyright© KINIK COMPANY, All Rights Reserved.

Kinik Company — Q2 2026 Earnings Presentation on 6ix