Modulight Oyj · OMXHEX:MODU

Modulight Oyj — Investor Presentation (May 2004)

50 slides from Modulight Oyj's investor presentation, May 30, 2004

  1. Slide 1: Product Presentation

    Product Presentation Updated: 30th May 2004

  2. Slide 2: Outline

    Outline • Product overview • Fabry-Pérot (FP) laser products • Distributed Feedback (DFB) laser products • Future products • Conclusion

  3. Slide 3: Laser Product overview

    Laser Product overview • Wavelengths • Packages • 808 nm • Bare die • Chip-on-submount • 920 nm • TO-CAN • 1310 nm • TOSA • 1490 nm • Coaxial • 1550 nm • Custom • Modulation • CW / Pulsed • Types • 1.25 Gb/s • Fabry-Pérot (FP) • 2.5 Gb/s • DFB • 10 Gb/s

  4. Slide 4: Modulight 1310 nm FP laser diode products for digital applications

    Modulight 1310 nm FP laser diode products for digital applications

  5. Slide 5: Modulight 1310 nm FP laser products

    Modulight 1310 nm FP laser products • Laser product family for different needs and applications: • ML-C-1310-FP-10G laser chip • 10 Gb/s FP laser chip for 10G transponder and transceviver manufacturers • SONET OC-192 VSR (< 600 m) • SDH STM VSR-64.1r, STM I-64.1r (< 600 m) • OIF VSR-4, (< 600m) • 10

  6. Slide 6: Modulight 1310 nm FP laser products

    Modulight 1310 nm FP laser products • ML-C-1310-FP-2G5 • Bare 2.5 Gb/s FP die for full packaging and assembly lines • SONET OC-48 SR / SDH STM I-16 • 1.25 Gb/s Gigabit Ethernet • 1.06 Gb/s / 2.125 Gb/s Fibre Channel • ML-T-1310-FP-2G5-F/B-X • ML-C-1310-FP-2G5 laser chip in a TO-56 can for 2.5 Gb/s a

  7. Slide 7: Modulight 1310 nm FP laser products

    Modulight 1310 nm FP laser products • ML-COAX-1310-FP-2G5-2 • Reliable coaxial fiber pigtail module with ML-C-1310-FP-2G5 chip • 2 mW output power • Selectable connector • ML-W-1310-FP-2G5 1310 nm FP epiwafers • 1310 nm FP epiwafers with Modulight’s high-performance design or with customer’s own des

  8. Slide 8: Competitive advantages

    Competitive advantages • Narrow spectral linewidth enables longer transmission distances with high-speed operation • Strong core material design with superior temperature behavior for uncooled applications • Controlled beam characteristics for optimal coupling efficiency • Controlled design and manu

  9. Slide 9: ML-C-1310-FP-10G –10 Gb/s FP

    ML-C-1310-FP-10G –10 Gb/s FP • Proven robust manufacturing process inherited from 2.5G product • 10 mW kink-free output power up to 85°C • Narrow linewidth (typ. RMS 1 nm, -20 dB noise floor) reduces chromatic dispersion • High-speed operation also at elevated temperatures • Alignment features for a

  10. Slide 10: ML-C-1310-FP-10G – high-temperature operation

    ML-C-1310-FP-10G – high-temperature operation 10 mW kink-free single transverse mode cw power 5 Ω serial resistance Stable slope efficiency Example data: 10 devices from different laser bars

  11. Slide 11: ML-C-1310-FP-10G – good fiber coupling

    ML-C-1310-FP-10G – good fiber coupling Good beam shape for optimal coupling efficiency Typical beam ellipticity ~1.4 Horizontal FWHM 24.33° Vertical FWHM 34.42°

  12. Slide 12: ML-C-1310-FP-10G – reliability

    ML-C-1310-FP-10G – reliability

  13. Slide 13: ML-C-1310-FP-10G – S21

    = Modu 0 OEE of Optical Communication ML-C-1310-FP-10G — S21 B036 - 006 7G GSG 25°C B036 - 006 7G GSG 85°C + o4 1 10 Frequency (GHz) Frequency (GHz)

  14. Slide 14: ML-C-1310-FP-10G –narrow spectrum

    ML-C-1310-FP-10G –narrow spectrum Excellent linewidth in broad temperature range

  15. Slide 15: ML-C-1310-FP-10G – eye pattern

    ML-C-1310-FP-10G – eye pattern Rise time 39.6 ps (20-80) Fall time 46.7 ps (80-20) Jitter pk-pk 19.11 ps Jitter rms 3.31 ps S/N 10.21 ER > 5 dB (Modulight 10Gb/s die in customer 10 Gb/s TO-can, Ib = 40 mA, room temperature, filtered)

  16. Slide 16: ML-C-1310-FP-10G – eye pattern

    ML-C-1310-FP-10G – eye pattern 10.312 Gb/s Eye-Pattern [N=231-1], 10GBASE-R mask, 20% margin (example data from customer sub-assembly, Iljin Corp.)

  17. Slide 17: ML-C-1310-FP-2G5

    ML-C-1310-FP-2G5 • 1310 nm bare FP laser die for up to 2.5 Gb/s digital applications • For customers with own packaging and assembly lines • Reliable AlGaInAs/InP epi structure with Modulight’s high-performance design • 7 mW rated output power (to be upgraded) • >2.5 Gb/s operation -40-85°C • Low <5

  18. Slide 18: ML-C-1310-FP-2G5

    ML-C-1310-FP-2G5 • Narrower (<1 nm) spectral width than for competing 1310 nm FP laser products ⇒ Reduced chromatic dispersion ⇒ Longer transmission distances than with conventional MLM lasers

  19. Slide 19: Developed for mass production

    Developed for mass production • Modulight’s chip products developed to match customers’ automated process lines • Die-shear force typ. 390 g • Ball shear force typ. 48 g • Wire pull strength >6 g • Metal reflection and dicing quality suitable for pattern recognition methods • Good beam shape for opt

  20. Slide 20: Unbeaten temperature performance

    Unbeaten temperature performance • Best 2.5 Gb/s 1310 nm high- temperature FP laser chip in the market • Suitable for uncooled transmitters, transceivers and transponders • Best high-temperature performance • Slope efficiency typ. 0.28 W/A@85 °C • Key to low cost through simple packaging • Higher ma

  21. Slide 21: ML-T-1310-FP-2G5-F/B-X

    ML-T-1310-FP-2G5-F/B-X • Modulight’s high-performance 2.5 Gb/s nm 1310 nm FP chip in a TO-56 can • Available with flat window and ball lens caps • Ask for custom caps • Ball lens cap can with low beam divergence (<10°) • Stable focal distance • 100% gross leak test for hermeticity • 300-700 µA monit

  22. Slide 22: Customer interface – quality of service

    Customer interface – quality of service • Fast customer response • Modulight’s committed technical and sales personnel in your service for after-sales support • Product-specific quality plans available for customer review • Describing QC/QA activities in Modulight’s production in detail • Exact desc

  23. Slide 23: ML-C-1310-FP-2G5 – reliability

    ML-C-1310-FP-2G5 – reliability

  24. Slide 24: ML-C-1310-FP-2G5 – threshold current

    ML-C-1310-FP-2G5 – threshold current 2nd derivative method

  25. Slide 25: ML-C-1310-FP-2G5 – frequency response

    ML-C-1310-FP-2G5 – frequency response

  26. Slide 26: ML-C-1310-FP-2G5 – 2.5 Gb/s eye pattern

    ML-C-1310-FP-2G5 – 2.5 Gb/s eye pattern 2.488 Gb/s, Iop = 30 mA, ext ratio 9.24 dB. OC-48/STM-16 mask, 20% margin (Modulight 2.5 Gb/s die in customer sub-assembly, Iljin Corp.)

  27. Slide 27: ML-C-1310-FP-2G5 – for 1.25 Gb/s and 2.5 Gb/s

    ML-C-1310-FP-2G5 – for 1.25 Gb/s and 2.5 ML-C-1310-FP-2G5 –2.5 Gb/s eye pattern Gb/s 2.488 Gb/s, OC-48/STM-16 filter (Modulight 2.5 Gb/s die in Customer’s SFP transceiver)

  28. Slide 28: ML-T-1310-FP-2G5-F-3

    ML-T-1310-FP-2G5-F-3 Eye pattern after 55 km transmission Modulated spectrum • 55 km Gigabit Ethernet transmission, 13.5 dB extinction ratio, Pout = -0.2 dBm • 25 °C ambient temperature (Tc = 41°C) • λ=1310.08, ∆λ = 0.88 nm • Modulight TO-can in Allied Telesyn (US) GigE transceiver sub-assembly

  29. Slide 29: ML-T-1310-FP-2G5-F-3

    ML-T-1310-FP-2G5-F-3 Eye pattern after 40 km transmission Modulated spectrum • 40 km Gigabit Ethernet transmission, 9.9 dB extinction ratio, Pout = -0.8 dBm • 70°C deg ambient temperature (Tc = 87.5°C) • λ=1325.10, ∆λ = 0.79 nm • Modulight TO-can in Allied Telesyn (US) GigE transceiver sub-assembly

  30. Slide 30: 1310 nm FP epiwafers

    1310 nm FP epiwafers • Use Modulight’s standard production design in your own device process or • Base your own FP or DFB design on Modulight’s proprietary active area design • Exploit Modulight’s processing services for broad-area characterisation or device-level epiwafer qualification

  31. Slide 31: Modulight 1310 nm DFB products

    Modulight 1310 nm DFB products

  32. Slide 32: 1310 nm DFB laser products

    1310 nm DFB laser products • Products for SONET OC-48, 1x/2x Fibre Channel and long-reach Gigabit Ethernet • ML-C-1310-DFB-2G5 • 300x300 µm bare die • ML-T-1310-DFB-2G5 • TO-56 can with flat window cap or aspherical lens cap

  33. Slide 33: 1310 nm DFB laser products

    1310 nm DFB laser products • Active area design platform inherited from Modulight’s mature 1310 nm FP products • Focus on full operating temperature range (0- 85°C), not just RT operation • Small slope saturation at elevated temperatures • Small beam ellipticity • Cost-effective grating process • Ty

  34. Slide 34: > Modu

    > Modu In the heart of Optical Communication DFB Source Test (TrA) Stop Band Peak Amplitude Peak Wavelength Center Offset Bandwidth Mode Offset 0.78 nm SMSR at: 10.00 : Agilent REF: 0.00 dem dim —— === ——L——-————-+-—-—----__--___ wt | ST | SST BL -10.00 sc 47 6e 8ST | | 01.0888 mn/*C PHHM linewidth

  35. Slide 35: Optical output power vs. forward current

    > Modu in the heart of Optical Communication OPTICAL OUTPUT POWER vs. FORWARD CURRENT 15°C 25°C 35°C 45°C 55°C 65°C 75°C \ \\\ 0 20 40 60 80 100 If (mA)

  36. Slide 36: Operating current and threshold current vs. case temperature

    > Modu in the heart of Optical Communication OPERATING CURRENT@Pop = 5 mW AND THRESHOLD CURRENT vs. CASE TEMPERATURE 60 50 a lop _ _ 40 ta Es 30 oz 20 Ith 10 0 5 15 25 35 45 55 65 75 85 Tc (°C)

  37. Slide 37: ML-C-1310-DFB-2G5 – frequency response

    ML-C-1310-DFB-2G5 – frequency response

  38. Slide 38: ML-C-1310-DFB-2G5 – 4 Gb/s modulation test

    ML-C-1310-DFB-2G5 – 4 Gb/s modulation test • Data Rate 4 Gb/s. • PRBS: 231-1 • Eye Diagrams @ temperatures of 0, 25, 50, 75, 85, 100°C and link distances of 0km, 2km and 10km • Temperature compensation not optimized. • RF filter between LDD and LD not optimized. ⇨ Some ringing occurs in eyes, can be

  39. Slide 39: Link: 0 m; Temp.: 0°C

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  40. Slide 40: Link: 0 m; Temp.: 25°C

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  41. Slide 41: Link: 0 m; Temp.: 50°C

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  42. Slide 42: Link: 0 m; Temp.: 75°C

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  43. Slide 43: Link: 0 m; Temp.: 85°C

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  44. Slide 44: Link: 0 m; Temp.: 100°C

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  45. Slide 45: Link: 2 km; Temp.: 0°C

    6 Modulight ~ In the heart of Optical Communication 4 Link: 2 km; Temp.: 0°C

  46. Slide 46: Link: 2 km; Temp.: 100°C

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  47. Slide 47: Link: 10 km; Temp.: 0°C

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  48. Slide 48: Link: 10 km; Temp.: 100°C

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  49. Slide 49: Future DFB products from Modulight

    Future DFB products from Modulight • 2.5 Gb/s 1550 nm DFB die & TO-can • Long reach applications • 1490 nm DFB die & TO-can • PON • 10 Gb/s directly modulated 1310 nm DFB die • Based on Modulight’s 10G 1310 nm FP design • For uncooled transceivers/transponders

  50. Slide 50: Conclusion

    Conclusion • Robust and manufacturable laser products • Strong customer focused technical pre and after sales • Key success factors • Agility, Reliability, Customer Focus and Profitability • Quality, environment and cost- effectiveness in mind • Volume manufacturing capacity in own building

Modulight — Investor Presentation (May 2004) on 6ix