Meyer Burger Technology — Fact Sheet (2013)

2 slides from Meyer Burger Technology's fact sheet, 2013

Slide 1: DW 288 Wafering System
Options & Accessories Accessories Handling accessories for workpiece / wire guide rolls / wire spools Tools for exchange of spools / wire web / wire guide rolls and for maintenance Options Wafer carrier transportation Interface for external filtration MES Interface PV2 DW 288 Wafering System Dedicat
Slide 2: DW 288 Wafering System includes
Water based diamond wire process DW 288 Wafering System includes (glycol optional) Consumables DW 288 Diamond wire Dedicated DW beam Maximum load 620 mm Cutting fluid Glue Dedicated diamond wire process Thinnest wafer down to 100 µm Thinnest wire down to 100 µm (core) Smooth wafer handling Lowest Co