Formfactor, Inc. · NASDAQ:FORM
Formfactor — Technical Presentation (2021)
14 slides from Formfactor's technical presentation, 2021
Slide 1: FRT Metrology for Advanced Packaging
FRT METROLOGY FOR ADVANCED PACKAGING Kenan Görgülü Head of Sales & Business development - FRT Metrology
Slide 2: FormFactor FRT Metrology
FormFactor FRT Metrology TECHNOLOGY • Leader in Optical Surface Metrology and Inspection • SurfaceSensʰ Multi-Sensor Technology • Various optical point, field of view and film thickness sensors and microscopes integrated in one device • More than 700 FRT Metrology tools are established worldwide SER
Slide 3: FRT: Enabling the ASAP Metrology Roadmap
FRT: Enabling the ASAP Metrology Roadmap • FRT is specialized in fully automated multi-sensor metrology system for application-specific advanced packaging (ASAP) measurements • Cost/Performance optimized for micron-level features • Supporting the 40µm heterogenous integration HVM •Leading-customer g
Slide 4: FRT: Scalable Platform with SurfaceSens
FRT: Scalable Platform with SurfaceSens TM Standardized System Platform MicroProf® 300 MicroProf® MHU MicroProf® FE MicroProf® AP Fully automated system for Advanced Packaging production Modular Multi- An example of multi-sensor sensor configuration including topography Configuration point sensors,
Slide 5: SurfaceSens
SurfaceSens TM CWL sensor for surface structure evaluation CFM DT confocal microscope / white light interferometer for high resolution FTR Thin Film Reflectometer for film thickness analysis down to 20 nm Camera for pattern recognition of alignment structures CWL sensors in TTV setup IRT Infrared Th
Slide 6: 2.5D/3D IC Packaging Process Flow
2.5D/3D IC Packaging Process Flow
Slide 7: Wafer Geometry – Thickness, TTV, Bow, Warp
Wafer Geometry – Thickness, TTV, Bow, Warp • Advanced Packaging Challenge: • Increasing wafer geometry variation for Advanced Packaging, such as thickness variations and warp post-stack, affect later processes and the device quality • FRT Solution: • High-throughput process control of wafer thicknes
Slide 8: Etch – Via and Trench Dimensions
Etch – Via and Trench Dimensions Trench depth 370 ~ 400 nm • Advanced Packaging Challenge: • Increasing aspect ratio (AR) for vias and trenches process control • FRT Solution: • White light interferometer (WLI) to determine widths and depths large single via small via array high AR via spacer ~ 1.40
Slide 9: RDL Width and Height
RDL Width and Height • Advanced Packaging Challenge: Bump • High-precision and high-throughput micron-level process control of RDLs Bump • FRT Solution: PI RDL UBM • Evaluation of RDL height and width using WLI with optimized setup for high Passivation Metal resolution Oxide • Repeatability of RDL w
Slide 10: CMP Die and Wafer Flatness
CMP Die and Wafer Flatness • Advanced Packaging Challenge: • Detrimental surface irregularities post-CMP with increasing number of layers and process steps, resulting in electrical defects of chips and reduced wafer yield • FRT Solution: • New capability to evaluate die areas up to 25 mm x 35 mm per
Slide 11: Critical Dimension and Overlay
Critical Dimension and Overlay intensity map • Advanced Packaging Challenge: • Low CoO monitoring of micro-level CD and overlay • FRT Solution: • Measurement with confocal microscope (CFM DT) • CD and OVL analysis intensity profile Outer CD Photoresi st Inner CD Polyimide Metal CD and overlay measur
Slide 12: Production Case Study: Repeatability of Step Height/Width
Production Case Study: Repeatability of Step Height/Width Determination with Hybrid Metrology step height = 5.2 µm step width = 12 µm standard deviation for 12 weeks dynamic repeatability test: σ = 9 nm (0.17 %) F. Heider, et al., Infineon Technologies, "Optical step height and trench depth measurem
Slide 13: Conclusion
Conclusion • FRT is a leader in surface metrology solutions for Advanced Packaging applications • We provide the lowest cost of measurements for new heterogenous integration manufacturing processes. • Our SurfaceSensTM multi sensor technology provides a very flexible system serving R&D as well as hi
Slide 14: Thank You
THANK YOU FormFactor FRT Metrology FRT GmbH Friedrich-Ebert-Strasse 75 51429 Bergisch Gladbach Germany