ASML Holding NV · EURONEXT:ASML
ASML Holding NV — BAML 2019 APAC TMT Conference
41 slides from ASML Holding NV's conference presentation, Mar 20, 2019
Slide 1: EUV: Enabling cost efficiency, tech innovation and future industry growth
Public BAML 2019 APAC TMT Conference EUV: Enabling cost efficiency, tech innovation and future industry growth Craig De Young VP Investor Relations Asia Taipei, Taiwan March 20, 2019
Slide 2: Forward Looking Statements
Forward Looking Statements Public Slide 2 This document contains statements relating to certain projections, business trends and other matters that are forward-looking, including statements with respect to expected trends and outlook, 20 March 2019 strategy, bookings, expected financial results and
Slide 3: Agenda
Agenda Public Slide 3 20 March 2019 • Today’s Advanced Lithography Technology • Tech innovation and future growth drivers 5G connectivity, Artificial Intelligence, Autonomous Driving, Big Data, Emerging Memory • Lithography's role in semiconductor manufacturing now and in the future
Slide 4: And this happens 50,000 times every second
Public Slide 4 20 March 2019 And this happens 50,000 times Backlight every second, of every minute, of shadowgram from every hour, of every a NXE:3300 EUV source day…month…year….
Slide 5: As a frame of reference: what else happens in a second?
As a frame of reference…..What else happens in a Public second? Slide 5 20 March 2019 A spark plug ignites Hummingbird flap their wings Bees flap their wings 16.67 sparks per second 40-80 times in one second 180 times per second How about an internet second?: 54,907 Google searches, 125,406 YouTube
Slide 6: Main modules of the EUV Source
Main modules of the EUV Source Public Populated vacuum vessel with tin droplet generator and collector Slide 6 20 March 2019 Intermediate Focus Droplet Generator Droplet Catcher EUV Collector
Slide 7: ASML EUV Lithography - expanding the possibility landscape
ASML EUV Lithography - expanding the possibility landscape by providing……………………. Public Slide 7 20 March 2019 Process simplification and improved device performance 15 to 50% cost reduction compared to multi-patterning schemes 3 to 6x cycle time reduction compared to critical multi- patterning layer
Slide 8: ASML where it all happens
ASML where it all happens Veldhoven, the Netherlands Public Slide 8 20 March 2019 ASML Wilton ASML San Diego Zeiss Oberkochen Facility Facility Facility New layout new High-NA bays New High- High NA Expansion
Slide 9: Our EUV journey so far
Our EUV journey so far…. > 10 years to develop EUV technology with our customers Public Slide 9 20 March 2019 2006 2010 2013 2017 2018-19 ASML ships first full ASML ships first NA ASML ships first NA ASML ships first NA ASML NXE:3400B field EUV research 0.25 development 0.33 development 0.33 product
Slide 10: EUV technology now supporting processes of the future
EUV technology now supporting processes of the future Public Installed base of EUV systems ramping in preparation for HVM in 2019 Slide 10 20 March 2019 R&D HVM ramp HVM NXE:33x0 and NXE:3400 40 Installed Base Planned Shipments 30 22 18 12 9 10 7 3 4 3 2 ’13 ’14 ’15 ’16 ’17 ’18 ’19
Slide 11: EUV ramp at Logic customers started, DRAM expected 2019
EUV ramp at our Logic customers has started with DRAM expected to begin in 2019 Public Slide 11 20 March 2019 Cumulative exposed 3.2M EUV wafers Total # of wafers exposed 2.0M 1.1M ES Jung, EVP Foundry Seoul October 18th, 2018 0.6M The initial EUV production has started in Samsung's S3 Fab in Hwaseo
Slide 12: Customers are building significant capacity using EUV systems
Customers are building significant capacity for advanced Public processes using EUV systems Slide 12 20 March 2019
Slide 13: Agenda
Agenda Public Slide 13 20 March 2019 • Today’s Advanced Lithography Technology • Tech innovation and future growth drivers 5G connectivity, Artificial Intelligence, Autonomous Driving, Big Data, Emerging Memory • Lithography's role in semiconductor manufacturing now and in the future
Slide 14: Immersive devices will be the next computing wave
Immersive devices will be the next computing wave Public Slide 14 20 March 2019 1,200 ‘Immersive era’ 1,000 Smartphone + apps era 800 Drivers Resolution Frame rate Millions of units 600 400 Color accuracy Contrast/brightness PC + browser era 200 Broad applications • Entertainment • Visualization 199
Slide 15: The revolution in automotive
The revolution in automotive Public Slide 15 20 March 2019 Source: Optics & Photonics, Texas Instruments Autonomous and connected cars drive double digit growth to 80 B$ by 2025 Source: NVIDIA Corporate Presentation 2018
Slide 16: Artificial Intelligence impacting multiple applications
Artificial Intelligence impacting multiple applications Public Slide 16 20 March 2019 Artificial Intelligence (AI) as a major industry disruptor will represent a >15B$ new revenue opportunity in semiconductors by 2022 Source: Gartner
Slide 17: 5G connectivity
5G connectivity Public Slide 17 20 March 2019 >1,000,000 connections/km2 <100,000 3G connections/km2 4G 5G 100-1000 Gb/s/km2 1 Gb/s/km2 10 Gb/s/km2 1 ms latency 100 ms latency 50 ms latency Source: Qorvo, CNET 5G connectivity speed and latency improvement drives applications with more volume and rea
Slide 18: Advanced chips are needed to store and crunch data
Advanced chips are needed to store and crunch data Public Slide 18 20 March 2019 LOGIC 44 MEMORY Zetabytes (2020) Source: EMC Digital Universe report with Research & Analysis by IDC (2014)
Slide 19: Major trends in semiconductor-enabled computing
Major trends in semiconductor-enabled computing High demand is fueled by these major industry trends Public Slide 19 20 March 2019 • Autonomous decisions Applications • Immersive resolution • On-device Artificial Intelligence • Virtual / augmented reality Moore’s Law • 5G connectivity • Real-time la
Slide 20: Major trends in computing require new devices
Major trends in semiconductor-enabled computing require new devices Public Slide 20 20 March 2019 SoC Applications CPU NPU Digital GPU Signal Processor Moore’s Moore’s Law Law Fast Performance Performance data Algorithms Cost Cost Data Memory & Storage Source: Sumit Sadana, Micron, Micron Investor D
Slide 21: ASML continues to enable Logic process evolution
ASML continues to enable Logic process evolution Public Slide 21 20 March 2019 2007 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 iPhone iPhone 3G iPhone 4 iPhone 4S iPhone 5 iPhone 5S iPhone 6(+) iPhone 6S(+) iPhone 7 (+) iPhone iPhone (dual lens design) 8,8+,X XS,XR APL0098 APL2298 A4 A5 A6 A7
Slide 22: Processes continue to evolve and new devices are being built
And those processes continue to evolve and new devices are being designed and built now Public Slide 22 20 March 2019 TSMC with EUV process gearing up for AI, 5G boom Monica Chen, Hsinchu; Jessie Shen, DIGITIMES Friday 22 February 2019 Chipmakers are expected to showcase their new-generation chip so
Slide 23: Considerable motivation to continue Scaling/Shrinking
Considerable motivation to continue Scaling/Shrinking Moore’s Law is underpinning a business model Public Slide 23 20 March 2019 IC performance 1 improvement at similar cost Takeaways Part of the profits are reinvested in R&D, equipment Approx $350 billion of 4 Virtuous 2 annual profit is riding on
Slide 24: ASML operates in an industry value chain with strong incentives to innovate
ASML operates in an industry value chain that has considerable means with strong incentives to compete and drive innovation Public Slide 24 Top technology companies in our ecosystem (EBIT CY2017, B$) 20 March 2019 Applied Materials ASML LAM Research KLA-Tencor TEL 4.3 2.8 2.6 1.4 2.2 Semi Equipment
Slide 25: Agenda
Agenda Public Slide 25 20 March 2019 • Today’s Advanced Lithography Technology • Tech innovation and future growth drivers 5G connectivity, Artificial Intelligence, Autonomous Driving, Big Data, Emerging Memory • Lithography's role in semiconductor manufacturing now and in the future
Slide 26: Lithography remains at the heart of semiconductor manufacturing
Lithography is and will remain at the heart of the Public semiconductor manufacturing process Slide 26 20 March 2019 To produce a chip the process is repeated >50 times to build a 3-dimensional structure
Slide 27: PPAC requirements for scaling - Lithography is at the Heart
Power, Performance, Area, and Cost are critical Public requirements for scaling - Lithography is at the Heart Slide 27 20 March 2019 Industry role e.g. enable new Increase performance computing architectures ASML role e.g. HVM integration of Reduce power/energy new materials e.g. improving yield wit
Slide 28: Chipmakers accelerate performance for the next decade
Chipmakers accelerate performance for the next decade¹ Process technology innovation accounts for 30%, grounded in Moore’s prediction2 Public Slide 28 20 March 2019 1M Improvement opportunities for the next decade Log Scale System Performance/Watt 100% “Device 3D stacking 64K & Circuit >2X clevernes
Slide 29: Customers' roadmaps show continued plans to shrink
Customers’ roadmaps show continued plans to shrink Public Slide 29 EUV Production High NA Production 20 March 2019 Insertion Window Insertion Window 2017 2018 2019 2020 2021 2022 2023 2024 2025 Logic Node name Logic Logic 10nm 7nm 5nm 3nm 2nm Performance Node name Performance Memory Memory DRAM 1X 1
Slide 30: And ASML has a roadmap to match
And ASML has a roadmap to match Combined EUV, High NA, DUV and holistic solutions needed to support shrink in the next decade Public Slide 30 20 March 2019 Minimum resolution continues to shrink … … and Logic takes over from DRAM in overlay scaling 100 Mix&match Applications MPU lithography ArFi Fou
Slide 31: End market growth drives our opportunity
End market growth drives our opportunity Public Slide 31 20 March 2019 Mobile and PC maturing Continued growth in cloud applications Emerging connected devices market Smartphones, B$ Wired & wireless Infrastructure, B$ Automotive, B$ +6% CAGR 80 145 +10% CAGR 123 128 125 110 +4% CAGR 87 53 42 48 43
Slide 32: IC unit demand growth drives investments in wafer capacity
IC unit demand growth drives investments in wafer capacity Public Most of which will be on leading edge nodes Slide 32 20 March 2019 7000 • Growing wafer capacity drives increased litho demand 6000 WW 300mm Capacity 5000 • New (leading edge) nodes with increased litho intensity further drives litho
Slide 33: EUV continues to demonstrate its value
EUV continues to demonstrate its value layer adoption increasing for Logic, expected EUV layer adoption DRAM Public Slide 33 20 March 2019 +50% next node +50% next node +30% realized # of EUV layers x3 opportunity 7nm Node 5nm Node 16nm Node 1A nm Node Logic adoption has increased by 30% for 7nm, 50
Slide 34: EUV estimated demand per fab by market
EUV estimated demand per fab by market Range of layers and corresponding systems per fab1 Public Slide 34 20 March 2019 Fab Capacity Market EUV layers EUV systems/fab (kwspm2) Logic 45 10 – 20 10 – 20 (7nm – 5nm) DRAM 100 1-6 2 - 10 (16nm -1Anm) Logic EUV capacity: 1 EUV layer requires 1 EUV system
Slide 35: EUV: two accelerated development programs in parallel
EUV: two accelerated development programs in parallel Supporting applications beyond the next decade l Public Slide 35 Resolution = k1 x 20 March 2019 NA EUV 0.33 platform will be extended to provide state of the art overlay and node to node productivity improvements EUV 0.33 NA 2016 2017 2018 2019
Slide 36: 0.55NA EUV enables 3nm Logic
In the same way 0.33NA enables 7nm Logic, 0.55NA EUV Public enables 3nm Logic Slide 36 20 March 2019 Process simplification and improved device performance >> 50% cost reduction compared to multi-patterning schemes 3 to 6x cycle time reduction compared to multi-patterning for critical layers Best in
Slide 37: Reducing risk, lowering cost
Reducing risk, lowering cost Driving commonality between High NA and 0.33 NA Public Slide 37 20 March 2019 Illuminator Projection Mirror ‘rework’ Source Reticle Masking Unicom Reticle Stage Reticle Handler Optics Optics process at Zeiss Specific Common Mechanical Broad band Electronics & SW Cooling
Slide 38: Solid progress on optics development at ZEISS SMT
Solid progress to support optics development and manufacturing at ZEISS SMT Public Slide 38 20 March, 2019 Optics metrology vessel installed Outer mirror handling robot in High NA cleanroom
Slide 39: Holistic Lithography roadmap focuses on patterning performance and control
As Moore’s Law continues, tolerance requirements get tighter ASML’s Holistic Lithography roadmap focuses on patterning Public Slide 39 performance and control 20 March 2019 Other patterning tools Lithography scanner with advanced capability (imaging, overlay and focus) Process Window resist and proc
Slide 40: EUV Lithography - expanding the possibility landscape
ASML EUV Lithography - expanding the possibility landscape and providing a clear value creation opportunity Public Slide 40 20 March 2019 ● Healthy semiconductor end market growth fueled by major innovation drivers such as 5G Connectivity, Artificial Intelligence, Autonomous Semi End Driving, and Bi
Slide 41: Public Slide 41 20 March 2019
Public Slide 41 20 March 2019