Teradyne, Inc. · NASDAQ:TER
Teradyne — Technical Presentation (October 2010)
23 slides from Teradyne's technical presentation, October 2010
Slide 1: Introduction to TestStation Duo
Introduction to TestStation Duo Concurrent Test Platform October 2010 alan.albee@teradyne.com BECAUSE TESTING MATTERS
Slide 2: Challenges for High Volume Manufacturers
Challenges for High Volume Manufacturers Functional Screen Chip Fine Pitch Reflow Test Printer Shooter Placement AOI Solder ICT • PCB assembly equipment speeds continue to increase – Manufacturing beat rates can be less than 30 seconds • In-circuit tester becomes bottleneck on manufacturing line – I
Slide 3: Typical High Volume Manufacturing Segments and Products
Typical High Volume Manufacturing Segments and Products Storage Automotive Industrial Consumer 33
Slide 4: Current Methods Used to Satisfy High Volume Test Requirements and their Drawbacks
Current Methods Used to Satisfy High Volume Test Requirements… and their Drawbacks ICT Functional Screen Chip Fine Pitch Reflow Test Printer Shooter Placement AOI Solder • Add additional testers to the manufacturing line – Increases capital equipment, test fixture, and operation costs – Requires add
Slide 5: A Better High Volume Solution
A Better High Volume Solution • A unique concurrent in-circuit test system – Supports simultaneous testing of two boards • Twice the throughput of standard ICT testers – Doubles test throughput in the same footprint as single test system • Valuable cost savings – Less expensive capital equipment, fi
Slide 6: Concurrent Tester Features
Concurrent Tester Features • Split Backplane Instrument Cage – Each module supports 15 slots – Single test receiver spans both modules • Two Independent Subsystems – Two PC controllers – Two system controllers – Two in-circuit analog instruments – Two accessory slots – 12 pin boards per module (1,53
Slide 7: Synchronous Concurrent Tester
Synchronous Concurrent Tester 77
Slide 8: Core Components
Core Components TestStation “Standard” Receiver Primary PC Secondary PC Single Alliance PS Split Pin Bay 88
Slide 9: Pin Cage Configuration
Pesaro Duo- Pin Cage Configuration ar of i inant. 9 a ERADY NE}
Slide 10: Pin Cage Configuration Diagram
Pin Cage Configuration Diagram • Two independent 33 Slot Standard Receiver modules Main Module Secondary Module • Single receiver with common vacuum • Supports analog only, all digital, or mixed pin boards Accessory Slot Accessory Slot Pin Board Pin Board Pin Board Pin Board Pin Board Pin Board Pin
Slide 11: Pin Board Options
Pin Board Options Total flexibility to match pin count, technology, and budget requirements… Pin Board Analog Digital Pure Pin Pin Real Pin Type Test Test Board Ratio Mix Yes, with 0/128 Analog 121 Ultra II 121 Ultra II 121 Yes, with 128/128 Analog 121 No 32/128 Ultra II 124 11 11
Slide 12: Provides True Concurrent Testing
Provides True Concurrent Testing • Two PC Controllers and Independent Test Modules Allow All Tests to be Run in Parallel for Maximum Test Throughput – Shorts and opens tests – Vectorless tests – Analog component tests – Digital vector tests – Boundary scan tests – PLD programming – Functional tests
Slide 13: Development Process
Development Process Creates a common test program that is shared by both modules! Fabricate fixture (with special Produce circuit description for instructions to offset and single board replicate wiring for secondary module) Generate single board test Debug single board program program using main mo
Slide 14: Production Test Process
Production Test Process Select Duo program from Main and secondary module shared Duo directory tests are automatically started Production UI starts up in All un-powered tests are run special Duo operation mode in parallel – modules are synchronized at power-up Operator places panel or two duplicate
Slide 15: Production Pro User Interface
Production Pro User Interface • Shows test results for both primary and secondary modules • Combines yield and throughput statistics for both modules • Graphically highlights failing boards 15 15
Slide 16: Manufacturing Application
Manufacturing Application • Ultrasonic sensor • 72 boards per panel • Applied test techniques – Continuity – Vectorless tests – Capacitor orientation – Analog components – Mixed signal tests – Analog functional tests • High volume application – Line beat rate 80 sec. – ICT test time 130 sec. • Manuf
Slide 17: Manufacturing Application
Manufacturing Application • Manufacturer decided to replace standard tester with TS Duo • New Duo test fixture was built – 36 boards of the panel were wired to the Duo’s primary module – The other 36 boards of the panel were wired to the Duo’s secondary module – Wiring was replicated for secondary m
Slide 18: Comparison of Test Results
Comparison of Test Results Single Module Test Duo Concurrent System Test System Boards Per Panel 72 boards tested 72 boards – 36 boards sequentially by single tested by each module module two boards tested at a time in parallel Individual Board Test 1.8 seconds 1.8 seconds Time Panel Test Time 130 s
Slide 19: Test Strategy Comparison
Test Strategy Comparison Existing Single ICT Tester • Test Time: 130 Seconds • Test Cells: 1 • Test Operators: 1 • Test Fixtures: 1 • Boards per Shift: 15950 Screen Chip Fine Pitch Reflow ICT • Cost per Panel: $0.93 Printer Shooter Placement Solder Two ICT Tester Solution • Test Time: 65 Seconds • T
Slide 20: TestStation Duo Solution Provides Highest Throughput at Lowest Cost
TestStation Duo Solution Provides Highest Throughput at Lowest Cost Existing Single 2 Single ICT ICT Solution Solution Solution Capital Cost $30K $60K $56K (5 year dep.) Fixture Costs $30K $60K $33K Labor Costs $70K $140K $70K (2 Shifts) Extra Test Cell $0K $75K $0K Cost Total Cost $130K $335K $159K
Slide 21: Product Considerations
Product Considerations • TestStation Duo Can Operate in Single Module or Concurrent Test Mode – TestStation Small (1,536 pin) and Half-Size (1,920 pin) fixture kits can be used when running the Primary module in non-concurrent mode – Max pincount for each module is 1,536 pins – Test resources from t
Slide 22: Benefits and Value
Benefits and Value • Reduces ICT MFG Costs – Lower capital equipment costs – Fewer test fixtures – Smaller footprint (less floor space) – Fewer operators required • Manufacturing Test Flexibility – Run single module or concurrent test – Use existing fixture kits – Test panelized or duplicate boards
Slide 23: Introduction to TestStation Duo
Introduction to TestStation Duo Concurrent Test Platform Q&A For Additional Information Please Email: alan.albee@teradyne.com BECAUSE TESTING MATTERS