Tdk Corporation · TSE:6762
Tdk — Technologies & Products Press Conference 2018
12 slides from Tdk's conference presentation, Nov 14, 2018
Slide 1: World's first MEMS ultrasonic time-of-flight sensors
Technologies & Products Press Conference 2018 World’s first MEMS ultrasonic time-of-flight sensors Miniature high-performance range finding, presence detection and more Dr. David Horsley CTO Chirp Microsystems, Inc. A TDK Group Company Berkeley, CA, USA November 14, 2018
Slide 2: Ultrasonic sensing today
Ultrasonic sensing today ● Measure distance by time-of- flight of an ultrasonic pulse ● Use multiple sensors to find object location (left, right, center…) ● Sense range to avoid objects and prevent collisions ● Detect human proximity and presence Automotive • Automated guided vehicles • Robotics •
Slide 3: Ultrasonic sensors offer the best performance for range finding applications
Ultrasonic sensors offer the best performance for range finding applications Advantages of ultrasonic ToF sensors vs. infrared ToF sensors Power Up to 500 times lower consumption power consumption Range and accuracy not Sensitivity affected by ambient light to lighting or sunlight Detect dark or Sen
Slide 4: The new Chirp ultrasonic ToF sensor: Sonar on a chip
The new Chirp ultrasonic ToF sensor Sonar on a chip Main features Ultrasound engine ● Miniature size up to 1000 times smaller than conventional solutions ● Ultra-low power consumption (<15 µW) up to 100 times lower than conventional solutions ● Measuring range of 1 cm to 500 cm ● Very low noise rang
Slide 5: MEMS ultrasonic ToF sensor specifications
MEMS ultrasonic ToF sensor specifications Specification CH-101 CH-201 Dimensions 3.5 mm x 3.5 mm x 1.25 mm Features & benefits Operating range ≤1.2 m ≤5 m ● Range, proximity, presence and gesture sensor in one Voltage 1.8 V ● Low always-on power Interface I2C ● High accuracy Power 12 µA 20 µA @ 1 sa
Slide 6: SiP with wide range of programmable functionality
SiP with wide range of programmable functionality CH-101 and CH-201 are systems in package (SiP) with ● Piezoelectric micromachined Ultrasonic pulse ultrasonic transducer (PMUT) and ● Programmable system-on-chip (SoC) for all ultrasonic signal PMUT processing Programmable firmware for many functiona
Slide 7: Easy to interface to microcontrollers
Easy to interface to microcontrollers Features ● CH-101 and CH-201 sensors feature an I2C 1.8V interface and operate from a 1.8 V supply VDD 10k 2k2 2k2 Microcontroller ● Multiple sensors can share AVDD 3 SDA SDA (Master) the same I2C bus 7 2 SCL SCL (Master) CH-201 8 RESET_N CH-x01 GPIO ● CH-101 an
Slide 8: CH-201 ultrasonic ToF sensor performance
CH-201 ultrasonic ToF sensor performance Range measurement up to 5 m Field of view (FoV) with narrow FoV housing 5000 Range (mm) vs. Stage Distance + 90° 4000 Range (mm) 3000 135° 45° 100 samples at each distance 2000 (noise is too small 14000 12000 too see) 10000 8000 6000 1000 4000 2000 180° 0° 10
Slide 9: CH-201 range and range noise
CH-201 range and range noise Range noise @120 cm Range noise vs. target range 6 5 ±0.35 mm 1σ Range noise (mm) 4 Corner reflector target 3 Wall target 2 1 0 120.0 120.1 120.2 120.3 120.4 120.5 0 1 2 3 4 5 6 Target distance (cm) Range (m) Noise up to 100x lower than competing IR ToF sensors at 120 cm
Slide 10: Solutions from component to system level
Solutions from component to system level Unique sensor components On-chip sensing algorithms Complete system solutions Transmit burst Echo from target Application-specific software enables • Fast time to market • Design of solutions with multiple Chirp sensors Time of flight • Piezoelectric micromac
Slide 11: 6-DoF controller reference design
6-DoF controller reference design Features & Benefits Hand-held controller Head-mounted display ● Provides 6-DoF controller tracking based on sensor fusion Chirp Chirp Chirp Chirp CH-101 Chirp CH-101 Chirp ● Fuses ultrasonic ToF with IMU CH-101 (1 or more) CH-101 Ultrasound CH-101 (1 or more) CH-101
Slide 12: www.tdk-electronics.tdk.com
www.tdk-electronics.tdk.com