Slide 1: Investor Presentation
Investor Presentation May 2025
Slide 2: Forward Looking Statements
Forward Looking Statements This slide presentation contains “forward-looking statements” and “forward-looking information” within the meaning of the Private Securities Litigation Reform Act of 1995. This information and these statements, which can be identified by the fact that they do not relate st
Slide 3: LWLG At A Glance
LWLG At A Glance Strong platform + favorable market dynamics to enable utilization of electro- optic polymers for high speed, low power AI and data center applications. Unprecedented Innovative EO Strong Patent Deeply Experienced Robust Balance Accelerating Demand Polymer Technology Portfolio Leader
Slide 4: Business Model
Business Model Materials and IP licensing/royalty dual-model for attractive blended gross margin We are a Material + IP/Royalty Licensing Company …For Creating …And Generating Foundational E/O Next-Gen Optical High Margin Polymer R&D… Modulators Revenues E/O Polymer E/O Polymer Material Sales 60%+ C
Slide 5: AI Infrastructure Challenges Addressed by Lightwave Logic EO Polymers
AI Infrastructure Challenges Addressed by Lightwave Logic EO Polymers BANDWIDTH CONNECTIVITY POWER INTEGRATION 5
Slide 6: AI Cluster Opportunity
AI Cluster Opportunity 2 Scale Out – Switch Rack to 3 1 Switch Rack interconnect using optics (transceiver based) 1 Scale Out – GPU rack to Switch 2 rack connectivity – migrating to optical cables/CPO Scale Up – GPU to GPU 3 connectivity – PCB traces migrating to CPO/optical chiplets Source: Nvidia
Slide 7: AI & Data Center Market Opportunity
AI & Data Center Market Opportunity Unprecedented Growth + Opportunity from Global AI Demands and Adoption >10X Growth in 800G since 800G 2022 1.6T & 3.2T Largest opportunity 3.2T for LWLG >20X 3.2T Forecast growth for 1.6T since 2023 7
Slide 8: AI/Datacenter and Telecom Opportunity for Ultra High-Speed Modulators
AI/Datacenter and Telecom Opportunity for Ultra High-Speed Modulators AI 2028 Estimated $10 billion TAM Total Addressable Market (TAM) Critical Milestones 20M units of 1.6Tb/s and 3.2Tb/s & Serviceable Addressable Market (SAM)* For LWLG transceivers/CPO (200Gb/s+ lane) = 160M modulators Multiple maj
Slide 9: Uniquely Enabling AI Connectivity Ecosystem
Uniquely Enabling AI Connectivity Ecosystem Hyperscale AI Data Center Optical Transceiver Suppliers Silicon Photonics Engines (PICs) & Foundries Polymer Modulators OFC Update 20+ meetings with potential customers Traction with both Tier 1 SiPho design houses and new players Significant SiPho investm
Slide 10: Entering a New Stage for Lightwave Logic
Entering a New Stage for Lightwave Logic Seizing growth opportunities presented by AI Stage 1 Stage 2 Stage 3 Complete 2025 + 2026 Starting 2026 Technology & Customers & Products Scale-up & Materials Diversification Development Product Design-ins Production Silicon Photonics Patents/IP, infrastructu
Slide 11: Design Win Cycle
Design Win Cycle 1 2 3 4 Technology Prototype to Production Ramp to Stage Product Design Selection Final Product High Volume Support customer on Supply customer with Support product design process and yield Demonstrate performance process design kit (PDK) iterations (alpha, beta, final) improvement
Slide 12: Customer Update
Customer Update Technology Prototype to Production Ramp to Stage Product Design Selection Final Product High Volume Customer 1 customer in Pipeline Targeting Stage 3 10 customers currently volume ramp in 20+ engaged in Stages 1 or 2 Targeting 3-5 2027 & 2028 currently in customers by pipeline year-e
Slide 13: SiPho Meeting its Physical Limits
SiPho Meeting its Physical Limits EOP can leverage and supercharge the innovation, scale and infrastructure of SiPho for next gen data speeds Silicon photonics has enabled But AI Clusters are increasing demand the revolution so far… for datacom 10x… … with optical interconnects growing ∝ 10x cluster
Slide 14: Lightwave Logic Edge
Lightwave Logic Edge LWLG EO polymers are world-class in every parameter and designed for reliability LWLG Polymers vs Competition/Legacy Polymers ωλc Performance 𝑽𝝅 = 2ΓL𝒏3r33 r33 Electro-optic Refractive index 𝑛 coefficient Temporal Tg stability (poled state) Thermal stability Absorbance Td…
Slide 15: EOP Performance vs. Alternative Technology
EOP Performance vs. Alternative Technology LWLG EO polymers have inherently high performance and are fully Si-foundry compatible Thin-Film LiNbO3 (TFLN) Electro-optic Polymers r33 intrinsically capped at ~ 31 pm/V at 1310 nm No intrinsic cap on r33 (> 200 pm/V at 1310 nm easily achieved) n = 2.2, εr
Slide 16: EOP Reliability
EOP Reliability LWLG EO polymers are uniquely resistant to de-poling due to high Tg Temporal Stability = Orientational Lifetime as function of Tg for 65°C and 85°C operating temperature Stability of Poled State 100.00 • Lifetime = 10% loss of poled state 85°C Top • Increasing Tg of material increase
Slide 17: CMOS Compatible Process Flow
CMOS Compatible Process Flow Fully compatible and integrable with SiPho foundry process LWLG Backend/Encapsulation Process: Currently performed in-house; fully documented and ready for transfer to the foundry Finished device ready Receive bare SiPho EOP coating Poling Encapsulation for characterizat
Slide 18: Enhance Operational Excellence to Benefit Tier 1s and Foundries
Enhance Operational Excellence to Benefit Tier 1s and Foundries Key Focus Areas: Backend Reliability + High-Speed RF Internal Materials Business Semiconductor Qualification Electronics Production Processes + Process Toolkit Expertise People Adding rigor to our commercialization efforts 18
Slide 19: Enabling the Utilization of Polymers for Industry Applications
Enabling the Utilization of Polymers for Industry Applications Preparing for commercialization Reliability Testing 1 • Conducting accelerated Telcordia testing at 85° Celsius and 85% humidity • Conducting photosensitivity testing for high optical power Materials • Deployed infrastructure for co-test
Slide 20: Customer and Application Support
Customer and Application Support One of our great values is our expertise in integration and processing Integration Efforts 1 • Continuing collaboration on enhancing plasmonic modulators for multi-terabit applications Backend • Initiating customer-led program to co-design polymer-based SiPH based cu
Slide 21: Company Infrastructure Improvement
Company Infrastructure Improvement Positioning company infrastructure for growth and scalability Drive Operational Excellence 1 • Completing review of all policies and procedures • Adding rigor to our technology commercialization process People 2 • Optimizing and improving teams across Engineering,
Slide 22: Contact
Contact IR: Ryan Coleman or Nick Teves investor.relations@lightwavelogic.com +1 (312) 445-2870