Asml Holding Nv · EURONEXT:ASML
Asml Holding Nv — Investor Day (November 2024)
40 slides from Asml Holding Nv's investor day presentation, Nov 18, 2024
Slide 1: DUV products and business opportunity
Public Page 1 Herman Boom DUV products and business opportunity ASML Investor Day Veldhoven, The Netherlands November 14, 2024 Executive Vice President and Head of Business Line DUV Small Talk 2024 Exhibit 99.5
Slide 2: Summary
Public Page 2 • DUV is and will remain a workhorse for the industry. • We continue to support both our advanced and mainstream semiconductor customers with a portfolio of immersion systems that address the need for both overlay and higher productivity. • Our XT and NXT dry DUV portfolio continues to
Slide 3: EUV has become the standard for critical layers; other layers use DUV
Public Page 3 DUV EUV While EUV has become the standard for most LOGIC and DRAM critical layers, all other layers are patterned using DUV technology November 14, 2024
Slide 4: DUV is and will remain a workhorse of the industry
Public DUV is and will remain a workhorse of the industry Page 4 >900 Million wafer exposures 2030 EUV KrF ArFi ArF i-line 525 Million wafer exposures 2024 EUV KrF ArFi ArF i-line ASML Market research: expectations of total exposure area worldwide November 14, 2024
Slide 5: DUV is present in all markets and supports many applications
Public Cloud infrastructure Edge computing Energy transition Automation Healthcare, medical tech Technological sovereignty Working, learning remotely Hyperconnectivity Electrification, smart mobility Agricultural innovation Smarter use of limited resources DUV is present in all markets and supports
Slide 6: All DUV wavelength segments expected to grow in wafer exposures
Public Page 6 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2030 Added wafer exposures1 2025-2030 ArFi ArF KrF i-line More layers All DUV wavelength segments are expected to grow in wafer exposures per year due to the growth in volume of wafers and higher litho spend W a
Slide 7: DUV strategy and portfolio address the holistic lithography triangle
Public The DUV strategy and product portfolio address a comprehensive set of value and cost drivers in the holistic lithography triangle Page 7 Resolution ProductivityAccuracyPatterning Yield × × × • i-line • KrF • ArF • ArFi • EUV / ArFi • Overlay • Local CDU • EPE • System Throughput • System perf
Slide 8: DUV strategy and portfolio address the holistic lithography triangle
Public The DUV strategy and product portfolio address a comprehensive set of value and cost drivers in the holistic lithography triangle Page 8 Resolution ProductivityAccuracyPatterning Yield × × × • i-line • KrF • ArF • ArFi • EUV / ArFi • Overlay • Local CDU • EPE • System Throughput • System perf
Slide 9: DUV portfolio in place to capture growth opportunities across markets
Public DUV portfolio in place to capture the growth opportunities across markets Page 9 i-line KrF ArF ArFi NXT:2150i NXT:2100i NXT:2050i NXT:1980i NXT:1470 XT:1460 XT:260 XT:400 Advanced Markets Mainstream Markets NXT:870 XT platform NXT platform XT:860 XT:1060 November 14, 2024
Slide 10: DUV portfolio: NXT immersion platform
Public DUV portfolio in place to capture the growth opportunities across markets Page 10 NXT platform Advanced Markets Mainstream Markets November 14, 2024 ArFi NXT:2150i NXT:2100i NXT:2050i NXT:1980i
Slide 11: ASML's immersion portfolio has become the backbone of the industry
Public ASML’s immersion portfolio has grown to be the backbone of the industry by providing mid-critical and high-end immersion scanners Page 11 2012 In s ta ll e d i m m e rs io n w a fe r c a p a c it y NXT:1970i NXT:2000iNXT:1950i NXT:1980i NXT:2050i NXT:2100i NXT:2150i Immersion system releases
Slide 12: Investing in immersion technology to enable customer roadmaps and reduce cost
Public … and we keep investing in immersion technology to enable customer roadmaps and reduce cost of ownership further November 14, 2024 Page 12 Improving overlay to enable overlay critical applications Improving productivity to reduce cost of ownership for our customers High-end Immersion NXT:2xx0
Slide 13: High-end immersion systems adopted by customers and ramping up fast
Public 0 0.5 1 1.5 2 Our high-end immersion systems are adopted by customers and ramping up fast and reliably November 14, 2024 Page 13 >>100 high-end immersion systems installed Fast ramp to a stable production of 5000 wafers per day 5000 14 21 Days after install W a fe rs p e r d a y Matched Machi
Slide 14: NXT:2150i supports tight overlay requirements
Public NXT:2150i supports tight overlay requirements incl NXT-NXE cross-matching Provides 1.0 nm matched machine overlay and on product overlay improvement Page 14 New reticle heating control Reducing impact of reticle heating on overlay Conditioned reticle library Faster conditioning and lower reti
Slide 15: Improved correction capability for post wafer bonding overlay
Public Improved correction capability enables the patterning image to be manipulated locally on the wafer to correct post wafer bonding overlay fingerprints Page 15 50 nm 2.5 nm Metrology ARRAY CMOS Wafer bonder Massive metrology Litho scanner Wafer deformation directly after bonding Overlay error a
Slide 16: DUV portfolio in place to capture growth opportunities across markets
Public DUV portfolio in place to capture the growth opportunities across markets Page 16 i-line KrF ArF ArFi NXT:2150i NXT:2100i NXT:2050i NXT:1980i NXT:1470 XT:1460 XT:260 XT:400 Advanced Markets Mainstream Markets NXT:870 XT platform NXT platform XT:860 XT:1060 November 14, 2024
Slide 17: DUV portfolio: KrF
Public DUV portfolio in place to capture the growth opportunities across markets Page 17 KrF XT platform NXT platform Advanced Markets Mainstream Markets NXT:870 XT:1060 XT:860 November 14, 2024
Slide 18: NXT and XT platforms serve high-volume fabs with different product mixes
Public The NXT and XT platforms serve high-volume wafer fabs with different product mixes Page 18 Analog Power Mainstream Logic Advanced Packaging 300 mm 200 mm Various substrates Optical Sensors Specialty memory 300 mm DRAM NAND # of different products # r u n s p e r p ro d u c t # of different pr
Slide 19: Continuing to serve new wafer fabs across the world
Public …and will continue to serve new wafer fabs across the world November 14, 2024 Page 19 XT characteristics NXT characteristics Analog Power Mainstream Logic Advanced Packaging 300 mm 200 mm Various substrates Optical Sensors Specialty memory 300 mm DRAM NAND Logic & MPU
Slide 20: NXT:870 KrF scanner seen solid and rapid adoption
Public The NXT:870 KrF scanner has seen a solid and rapid adoption with proven productivity and reliability based on the NXT platform Page 20 NXT:870 system installed base growing rapidly >5200 wafers per day in 13-weeks-average 7000 wafers per day Distribution wafers per day2022 2023 2024 Stable fl
Slide 21: NXT:870B KrF scanner extends the NXT platform to ≥400 WpH
Public The NXT:870B KrF scanner will build on and extend the NXT platform to ≥400 WpH Page 21 Wafer Stage Reduced settling time, improved dynamics and productivity System Dynamics Improved wafer stage and base frame damping Wafer Handler Improved conditioning and higher productivity UV - Level Senso
Slide 22: DUV portfolio in place to capture growth opportunities across markets
Public DUV portfolio in place to capture the growth opportunities across markets Page 22 i-line KrF ArF ArFi NXT:2150i NXT:2100i NXT:2050i NXT:1980i NXT:1470 XT:1460 XT:260 XT:400 Advanced Markets Mainstream Markets NXT:870 XT platform NXT platform XT:860 XT:1060 November 14, 2024
Slide 23: DUV portfolio: i-line XT platform
Public DUV portfolio in place to capture the growth opportunities across markets Page 23 i-line XT platform Advanced Markets Mainstream Markets XT:260 XT:400 November 14, 2024
Slide 24: XT:260 delivers highest productivity for advanced packaging
Public XT:260 delivers the highest productivity in the industry for advanced packaging applications which could benefit from a larger exposure field size Page 24 XT:260 large field exposure system supports high throughput for increasing interposer sizes Throughput of XT:260 Throughput of current 4x
Slide 25: DUV strategy and portfolio address the holistic lithography triangle
Public The DUV strategy and product portfolio address a comprehensive set of value and cost drivers in the holistic lithography triangle Page 25 Resolution ProductivityAccuracyPatterning Yield × × × • i-line • KrF • ArF • ArFi • EUV / ArFi • Overlay • Local CDU • EPE • System Throughput • System per
Slide 26: Commonality in NXT platform and between DUV and EUV
Public Commonality in the NXT platform and between DUV and EUV gives shorter development lead time, more customer upgradability and lower operational cost November 14, 2024 Page 26 DUV NXT platform EUV NXE platform Level sensor Alignment sensor Metrology Wafer handling Common technology across DUV a
Slide 27: Commonality drives efficiency across the value chain
Public Commonality is an important factor in driving efficiency across the value chain Cost effective way to increase factory output and reduce installation time Page 27 Pre- install before shipment system CUSTOMERASML Standard set up for building both XT and NXT systems Direct pre-shipment to custo
Slide 28: Commonality drives efficiency across the value chain
Public Commonality is an important factor in driving efficiency across the value chain Cost effective way to increase factory output and reduce installation time Page 28 Pre- install before shipment system CUSTOMERASML Standard set up for building both XT and NXT systems Direct pre-shipment to custo
Slide 29: Commonality drives efficiency across the value chain
Public Commonality is an important factor in driving efficiency across the value chain Cost effective way to increase factory output and reduce installation time Page 29 NXT Direct pre-shipment to customer Pre- install before shipment system CUSTOMERASML Standard set up for building both XT and NXT
Slide 30: Commonality drives efficiency across the value chain
Public Commonality is an important factor in driving efficiency across the value chain Cost effective way to increase factory output and reduce installation time Page 30 NXTXT Pre- install before shipment system CUSTOMERASML Standard set up for building both XT and NXT systems Direct pre-shipment to
Slide 31: Commonality benefits for the customer
Public Commonality is an important factor in driving efficiency across the value chain Customer Page 31 Commonality benefits November 14, 2024
Slide 32: Commonality reduces cost, lead times and cycle times
Public With commonality we reduce cost, development lead times, cycle times, have lower inventory, faster ramp-up, improve upgradability and re-use To customer Lower Cost Innovation Higher Quality Page 32 FactorySupply chain Install ServiceD&E Commonality Benefits Reduced cycle timeReduced design co
Slide 33: Operational innovation to reduce cost and environmental footprint
Public Along with product design, operational innovation is applied to reduce cost and the environmental footprint of our operations Page 33November 14, 2024
Slide 34: ASML has shipped >6000 systems since starting operations
Public ASML has shipped >6000 systems to its customers since we started our operations Page 34 1985 1990 1995 2005 20252010 2015 20202000 2030 10,000 9000 8000 7000 6000 5000 4000 3000 2000 1000 0 EUV ArFi ArF KrF i-line ASML installed base N u m b e rs o f s y s te m i n t h e f ie ld November 14,
Slide 35: Focus on upgrade and service portfolio for the installed base
Public Continued focus on the upgrade and service portfolio to maintain and improve the performance as well as the cost effectiveness of the installed base V a lu e [ a .u .] 0 10yrs 20yrs Page 35 Regular service w a rr a n ty NXT-platform XT-platform PAS-platform AT-platform EXTEND installed base I
Slide 36: Market opportunity of growing installed base with expanding service
Public Our market opportunity of our growing installed based with an expanding service & upgrade portfolio November 14, 2024 Page 36 Regular service Value-up service Extended service Field Upgrades Installed base growth Trade-in & Refurb 0.0x 1.0x 2.0x 3.0x 4.0x 5.0x 2019 2020 2021 2022 2023 2024 20
Slide 37: NXT immersion field upgrades enable improved performance and output
Public November 14, 2024 Page 37 Our NXT immersion (Field) upgrades enable improved on-product performance and higher wafer output Matched Machine Overlay 5.5 nm 3.5 nm 2.5 nm 2.0 nm 1.5 nm 1.3 nm 4.5 nm 4.0 nm 1.0 nm NXT:1960Bi NXT:1980Di NXT:2050i NXT:2100i NXT:1980Ei NXT:1980Fi NXT:1965Ci NXT:197
Slide 38: Summary
Public • DUV is and will remain a workhorse for the industry. • We continue to support both our advanced and mainstream semiconductor customers with a portfolio of immersion systems that address the need for both overlay and higher productivity. • Our XT and NXT dry DUV portfolio continues to provid
Slide 39: Forward Looking Statements
Public Forward Looking Statements This document and related discussions contain statements that are forward-looking within the meaning of the U.S. Private Securities Litigation Reform Act of 1995, including statements with respect to our strategy, plans and expected trends, including trends in end m
Slide 40: Thank you
Public THANK YOU Page 40