Agilent Technologies, Inc. · NYSE:A

Agilent Technologies — Technical Presentation (February 2005)

11 slides from Agilent Technologies's technical presentation, February 2005

  1. Slide 1: Agilent 5DX 8.3 Software Release Overview

    Agilent 5DX 8.3 Software Release Overview

  2. Slide 2: 8.3 Overview

    8.3 Overview •Currently planned features •Compatibility and upgrades •Alpha & Beta testing •Questions? Page 2

  3. Slide 3: 8.3: Currently planned features

    8.3: Currently planned features •New BGA Voiding algorithm (BGA2 Voiding2) •New PTH algorithm (PTH2) •Improvements to Paste Voiding •Two Condition FPGullwing Open •New Test Execution software •Improvements to Defect Analyzer •Change Requests and Code Improvements Page 3

  4. Slide 4: 8.3: Goals of new BGA Void Algorithm

    8.3: Goals of new BGA Void Algorithm •Provide a BGA void detection algorithm which tests according to the guidelines stipulated in IPC-7095A. •Ability to indict entire components for voiding instead of individual joints. •Introduce improved void measurement techniques. •Improve open outlier call acc

  5. Slide 5: 8.3: Goals of new PTH2 Algorithm

    8.3: Goals of new PTH2 Algorithm •Primary objective: Provide ease of use improvement for algorithm set-up • Update nominal values from Review Measurements • Ease of setup should help reduce false calls due to programmer inexperience Page 5

  6. Slide 6: 8.3: Paste Voiding Improvements

    8.3: Paste Voiding Improvements • Report total voiding for entire component (can’t do today for large pads that don’t fit in single view) ƒ One new threshold for Component Voiding ƒ By default this is Off – needs to be switched on by programmer. Page 6

  7. Slide 7: 8.3: Two Condition FPGullwing Open

    8.3: Two Condition FPGullwing Open •New threshold called “Filter Method” ƒ Can be found under the FPGullwing > Open > Additional tab •Threshold Setting: ƒ 0: Makes calls as normal (Default) ƒ 1: Must fail both Fillet Length and Open Signal ƒ 2: Must fail two of the following three: Heel Thickness, F

  8. Slide 8: 8.3: New Test Execution Interface

    8.3: New Test Execution Interface •A new Graphical User Interface when you select Automatic or Panel test from the main User Interface. •New GUI when you Collect Images. •Same functionality as the current DOS interface ... but allows for future expansion. Page 8

  9. Slide 9: 8.3: Defect Analyzer Improvements

    8.3: Defect Analyzer Improvements •Throughput improvement by eliminating retest of: ƒ BGA2 ƒ PTH (& PTH2) ƒ CHIP ƒ Connector •Note: If using Open Outlier and ART, BGAs are not re-tested but images will be re-snapped. •No changes required by programmer. Page 9

  10. Slide 10: 8.3: Compatibility and Upgrades

    8.3: Compatibility and Upgrades •8.3 is being tested to work on both NT and XP operating systems. •It will be tested for performance on the Kayak 800MHz, IPC-1GHz and IPC-2.8GHz controllers. •It will be tested for functionality on the 500MHz controller. •Will not be tested for <500MHz controllers. P

  11. Slide 11: 8.3: Alpha & Beta Testing

    8.3: Alpha & Beta Testing •We are currently conducting Alpha & Beta testing of the individual components of 8.3 at various Customer sites. •Beta System tests to start soon. ƒ This means running a late beta / early production version of the software at one or more Manufacturing sites to ensure that t

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