Slide 1: Microcontrollers, Digital ICs and RF products Group
Microcontrollers, Digital ICs and RF products Group Remi El-Ouazzane President, Microcontrollers, Digital ICs and RF products Group
Slide 2: Agenda
Agenda 1 Introduction 2 Edge 3 Space 4 Cloud 5 Takeaways
Slide 3: Era of Cloud Connected “Intelligent Things”
Era of Cloud Connected “Intelligent Things” Three pillars to make cars & things more intelligent, >$100B SAM in 2027 secure and connected Sources: WSTS Edge Cloud AI @ the Edge: to more efficiently and autonomously compute and actuate Security: to identify / authenticate / protect data within device
Slide 4: Revenue overview - MDRF
Revenue overview - MDRF MDRF Group revenue $B MDRF Sub-group revenue $B 5.0 First 9 months 2024 4.0 First 9 months 2024 $4.0B MCU $2.6B 3.0 2.0 7.5 1.0 0.0 6.0 Q1-Q3 Q1-Q3 Q1-Q3 Industrial 2022 2023 2024 4.5 Automotive 3.0 2.0 Personal First 9 months 2024 1.5 electronics 1.5 CECP 0.0 Q1-Q3 Q1-Q3 Q1-
Slide 5: The trends we intend to benefit from
The trends we intend to benefit from AI Electrified & software LEO satellite Cloud optical at the (tiny) edge defined vehicles constellations interconnect Enables more energy-efficient & smarter Are flexible & upgradable: with over- Connect the unconnected: Cloud requires increasingly higher decisio
Slide 6: What has changed since May 2022
What has changed since May 2022 Global economic environment WSTS MCU TAM forecast and actual ($B) 2021-2023: sustained average annual inflation > 6.5% May 2022 29.2 27.7 All MCU 25.9 Interest rates jumping from <1% in 2022 to ~5% in ‘24 24.6 3.8 3.9 3.5 3.4 US China relationship degrading 10.4 Secur
Slide 7: What has changed since May 2022
What has changed since May 2022 Global economic environment WSTS MCU TAM forecast and actual ($B) 2021-2023: sustained average annual inflation > 6.5% May 2022 29.2 27.7 All MCU 24.6 25.9 Interest rates jumping from <1% in 2022 to ~5% in ‘24 3.8 3.9 3.5 3.4 US China relationship degrading Secure 10.
Slide 8: The global opportunity for general-purpose, automotive and secure MCU
The global opportunity for general-purpose, automotive and secure MCU MCU TAM ($B): +5% CAGR 2024 to 2027 #1 CAGR ‘24-’27 $27.9 $27.1 +5% 10.9 CAGR ‘24-’27 10.8 Industrial +11% $23.2 7.9 Automotive +8% 12.7 10.3 General Purpose PE -4% 8.8 11.9 15.2 12.0 CECP +9% Automotive 3.8 2.7 3.1 1.5 1.0 1.3 10
Slide 9: What’s unique about ST in microcontrollers
What’s unique about ST in microcontrollers MCU key eNVM CMOS process Why ST success factors in-house technology Manufacturing capacity, In-house silicon technology & capacity in Europe, and resilience External fab partners, China for China nm 110 90 65 40/45 28 18 eNVM technology 40 nm eNVM in produ
Slide 10: STM32 state of the union
STM32 state of the union Sales drop in 2024 versus 2023 Book-to-bill Market share Contributors to GP MCU Sales decline 2024 vs 2023 GP MCU book-to-bill GP MCU market share * (Index 100 = 2019) Share Market 1 100 Inventory Actual Market share Net of Inventory correction 2019 2020 2021 2022 2023 2024F
Slide 11: STM32 market share health check
STM32 market share health check Customer survey STM32 maintaining or gaining share Stickiness of MCU platform development at ~80% of our customers favors the STM32 % of customers with ST share stable or increased % of customers preferring to reuse MCU platform 85% 80% 81% 86% 82% 78% 73% 72% 65% 58%
Slide 12: A developer-first mindset with STM32Cube
A developer-first mindset with STM32Cube The world largest MCU software ecosystem platform STM32Cube adoption is accelerating 1.2M unique active developers in last 12 months (was 0.8M in 2022) >30% YoY growth accelerating (+20% vs previous years trend) Fastest growing, most satisfied and active MCU
Slide 13: Making AI @ the tiny edge… a reality
Making AI @ the tiny edge… a reality Increasing adoption Significant growth in A roadmap for the most Introducing STM32N6 of edge AI solutions developer engagement challenging workloads with Neural-ART 1 Neural-ART Accelerator Battery management Arc fault detection Face / object recognition Anomaly
Slide 14: ST & Qualcomm Technologies collaborating for edge AI powered industrial applications
ST & Qualcomm Technologies collaborating for edge AI powered industrial applications Bringing significant value to 100,000+ STM32 customers System-level integration with STM32 MCUs Starting with Wi-Fi/Bluetooth/Thread combo connectivity with self- contained modules Complementing existing multi-proto
Slide 15: STM32 China-for-China game plan
STM32 China-for-China game plan Growing local customers base 50% in next 5 years Creating a differentiator that will help us gain ST eNVM 40 nm dual-supply chain market share with Chinese and global customers China Non-China Support growing need of Chinese and global customers for a fully localized
Slide 16: Doubling down on automotive MCUs
Doubling down on automotive MCUs ST objective Grow automotive MCU revenue 2x HPC 2030 vs. 2024 Autonomous (ADAS/IVI) Drive & Computing Vehicle How we achieve this Computer Leveraging ST’s IDM model ST MCU focus Ethernet Capitalizing on ST proprietary eNVM technology X-1 Realtime Electrification Intr
Slide 17: Stellar MCU: a game-changing architecture
Stellar MCU: a game-changing architecture Stellar: a foundation of Auto MCU growth Stellar for X-in-1 and zonal architectures ECU functions integration into MCUs: Stellar P New MCUs will become scalable integrated zonal controllers → powerful computing capabilities and HW variant scalability. Integr
Slide 18: ST Phase Change Memory (PCM): Redefining eNVM for automotive MCUs
ST Phase Change Memory (PCM) Redefining eNVM for automotive MCUs Proprietary PCM technology: Best power, performance, area (PPA) index Industry-leading memory density & robustness Versus alternative technologies (RRAM, MRAM, Flash) Phase change memory Memory cell size Best-in-class Achieves automoti
Slide 19: Stellar MCU gaining increasing momentum at top automotive OEMs and Tier1s
Stellar MCU gaining increasing momentum at top automotive OEMs and Tier1s OEMs Tier1s Leading Chinese EV maker Major EU Tier1 Validated Stellar in latest hybrid platform, with Adopted Stellar for X-in-1 integration, ST’s unique PCM over-the-air capabilities driving system BOM reduction for EVs Major
Slide 20: New Mobileye and ST collaboration
New Mobileye and ST collaboration Adopting Stellar MCU in next generation ADAS/AV SerDes Memory Mobileye EyeQ System-on-Chip Broad product portfolio from basic ADAS to autonomous-driving solutions Market leader with >50% market share 2023 Camera Radar Stellar microcontrollers Safe & secure high-perf
Slide 21: Bringing the benefits of STM32 to automotive applications
Bringing the benefits of STM32 to automotive applications STM32A X-in-1 Electrification ECU Zone I/O Bringing competitive STM32 platforms to automotive Focus on ASIL-B-level safety applications Expanding STM32 ecosystem to automotive developers • Designed for actuation • Scalable and cost effective
Slide 22: ST’s opportunity in the fast growing LEO satellite market
ST’s opportunity in the fast growing Low earth orbit (LEO) satellite market 2024 2027 2029 ONEW EB CHINA IRIS² CHINA KUIPER KUIPER STARLINK STARLINK STARLINK Source : ST, Morgan Stanley Research. April 7, 2024 LEO credibility & viability proven by Starlink New constellations being deployed China con
Slide 23: BiCMOS and PLP: the winning combo for LEO user terminal front-end module
BiCMOS and PLP: the winning combo for LEO user terminal front-end module BiCMOS PLP 200 mm wafer for high-volume B9MW Very high volume Panel level Packaging 300 mm wafer for leading-edge B55X Versatile packaging compatible with 200 & 300 mm wafers • mmW Frequencies Unbeatable performances up to 30 G
Slide 24: Starlink and ST: What we have accomplished together to date
Starlink and ST What we have accomplished together to date >4 Billion ICs delivered to date Silicon delivered 7000 14 6000 12 5000 10 Millions ICs delivered Cumulative UTs 4000 8 BiCMOS RF-FE 3000 6 2000 4 109m 109m x x 49m 49m 1000 2 Others (FD-SOI) 0 0 2020 2021 2022 2023 2024 2025 ICs (Millions)
Slide 25: Cloud optical interconnect opportunity
Power supply Compute Memory Cloud optical interconnect opportunity Interconnect ST addressing the pluggable transceiver market ST’s BiCMOS high Fmax is key in EIC devices for high with a Silicon Photonics & BiCMOS foundry offer throughput transceivers for data center and AI infrastructure and fiber
Slide 26: Silicon Photonics: The linchpin of next-generation AI factories
Silicon Photonics The linchpin of next-generation AI factories SiPho PIC100 ST’s SiPho provides clear advantages over VCSEL/EML The only silicon-only 300 mm technology able to support for new generation of optical transceivers 200 Gbps per lane (100 GBaud PAM4) Power efficiency Pluggables Volume and
Slide 27: MDRF Takeaways
MDRF Takeaways Continuously focus our R&D on markets where we are or we can become #1 or #2, accretive to ST GM and OM margin targets and leveraging our IDM model Leverage ST differentiated technology and manufacturing platform to: 1. Grow our GP MCU 1.5x faster than the market over 2017-2027 2. Bui
Slide 28: Find out more at www.st.com
Find out more at www.st.com © STMicroelectronics - All rights reserved. ST logo is a trademark or a registered trademark of STMicroelectronics International NV or its affiliates in the EU and/or other countries. www.st.com/trademarks For additional information about ST trademarks, please refer to ww