Tdk Corporation · TSE:6762

Tdk — Investor Presentation (January 2024)

11 slides from Tdk's investor presentation, Jan 31, 2024

  1. Slide 1: ModCap HF

    ModCap HF DCR Modular | New Modular High Frequency Series TDK Electronics Components CAP Business Group • Product Marketing Malaga, Spain 31/01/2024

  2. Slide 2: Introducing the New Modular HF Series

    Introducing the New Modular HF Series Highlights Product developed Powered design with according to fire safety high power density standards ModCap HF Very low ESL (<8 nH) Reduce time to market to avoid use of & lead time additional snubbers Renewable energies & Cost saving solution Traction (SiC) R

  3. Slide 3: ModCap HF series | B25647A*

    ModCapTM HF series | B25647A* ~ AC filter = DC link/DC filter MKK HP ModCap HF MKK DCR MKK DCi-R MKK DCi-H © TDK Electronics Components, S.A.U.  2024 Product presentation · ModCap HF B25647A* CAP FILM ES HP PM  March 2024  3

  4. Slide 4: ModCap HF Series B25647A* DC-link Applications

    ModCap HF Series B25647A* DC-link Applications Energy transmission Renewable energies Traction Industry Solar Loco & EMU LV Wind Light trains MV © TDK Electronics Components, S.A.U.  2024 Product presentation · ModCap HF B25647A* CAP FILM ES HP PM  March 2024  4

  5. Slide 5: General Overview B25647A* Series

    General Overview B25647A* Series = ModCap HF (dry-modular-high frequency) Features Benefits ● Capacitance range from 660 ● High power density, high up to 1900 µF and voltage frequency performance from 900 up to 1,600 V ● Modular concept for ● Very low ESL <8 nH parallelization ● Temperature range up

  6. Slide 6: Construction C Simplified Drawing & 3-D

    Construction C Simplified Drawing & 3-D Main dimensions: 243 x 169.5 x 90 mm Terminal © TDK Electronics Components, S.A.U.  2024 Product presentation · ModCap HF B25647A* CAP FILM ES HP PM  March 2024  6

  7. Slide 7: Highlights: HF Performance, Ultra Low ESL & Higher Operation Temperature

    Highlights: HF Performance, Ultra Low ESL & Higher Operation Temperature Compact power unit ● Capacitors can be mounted very close to the power modules to reduce loop inductance. ➔ Compact and scalable solution specially designed for SiC semiconductors ➔ Less investment on cooling ● Very short conne

  8. Slide 8: Electromagnetic Behavior of Modular HF series

    Electromagnetic Behavior of Modular HF series Electromagnetic: Modelling Customer benefits Customer input Current-frequency spectrum ● Electromagnetic model available for specific TDK input simulation according to current-frequency Capacitor design spectrum defined by the customer. Simulation ● Capa

  9. Slide 9: Thermal Behavior of Modular HF series

    Thermal Behavior of Modular HF series Thermal: Hot spot & temperature maping Customer benefits ● Thermal model available for specific simulation according to spectrum and boundary conditions defined by the customer. ● Thermal simulations to be integrated as part of the type test report. ● Thermal si

  10. Slide 10: ModCap HF Ordering Code System

    ModCap HF Ordering Code System Repetitive Nominal Capacitance Nominal Surge peak Dimensions Con- Part ModCap HF: Construction C voltage (V) ±10% (µF) current (A) current (kA) current (kA) (L x W x H, mm) struction number 900 1900 210 225 5 205 x 90 x 170 C B25647A9198K003 1000 1550 200 220 5 C 205 x

  11. Slide 11: www.tdk-electronics.tdk.com

    www.tdk-electronics.tdk.com

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