Canon Inc. · TSE:7751

Canon — Investor Day (March 2023)

15 slides from Canon's investor day presentation, Mar 6, 2023

  1. Slide 1: Canon Inc. 2023 Corporate Strategy Conference: Industrial Group

    Canon Inc. 2023 Corporate Strategy Conference Industrial Group March 6, 2023 Hiroaki Takeishi Senior Managing Executive Officer Head of Industrial Group This presentation contains forward-looking statements with respect to future results, performance and achievements that are subject to risk and unc

  2. Slide 2: Industrial Group Businesses

    Industrial Group Businesses Developing wide array of manufacturing solutions for cutting-edge electronics industry Canon Inc. Optical Canon Tokki Canon Anelva Canon Machinery Products Operations Semiconductor lithography equip. Die bonders Sputtering equip. Dry etching Wire bonding equip. FPD lithog

  3. Slide 3: Semiconductor Manufacturing Equipment of the Industrial Group

    Semiconductor Manufacturing Equipment of the Industrial Group Semiconductor device Manufacturing Process (Abstract) Front-end process Back-end process Deposit Coat Resist Expose Develop Etch Cut Expose Bond Inspect Product (Front-end Process) (Back-end process) Form thin film for Transfer circuit pa

  4. Slide 4: Display Manufacturing Equipment Offered by Industrial Group

    Display Manufacturing Equipment Offered by Industrial Group Display manufacturing process (Abstract) TFT Process Vacuum deposition process Back-end process Coat Vacuum Deposit Resist Expose Develop Etch deposition Seal Cut Product Circuit pattern on original plate Organic material heated in vacuum a

  5. Slide 5: Semiconductor Market Trend

    Semiconductor Market Trend Lithography O-S-D Lithography equipment market in units equipment CAGR21-27 market in units Semiconductor market (US$ M) Analog O-S-D 7.2% SPE market (US$ B) Logic Analog 9.3% SPE Logic 9.7% Micro 6.8% Micro Memory 3.7% ※O-S-D Optical Sensor Discrete Device Memory Canon pr

  6. Slide 6: Display Market Trend

    Display Market Trend Display market trend (Overall) TV market trend IT* market trend Smartphone market trend M [Units] (Large size) (Medium size) (Small size) * Desktop, laptop, tablet Unit sales M [Units] 300 Unit sales M [Units] 600 200 Unit sales M [Units] 800 80 10 40 400 0 0 0 ■TV ■IT ■Smartpho

  7. Slide 7: Business Strategy

    Business Strategy  Expand business scale, market coverage , and application of semiconductor manufacturing equipment  Raise the competitiveness of OLED manufacturing equipment  Strengthen and expand data solutions service  Cultivate new business domains by integrating core technologies 7

  8. Slide 8: Expand business scale, market coverage, and application of semiconductor manufacturing equipment

    Expand business scale, market coverage, and application of semiconductor manufacturing equipment Product lineup for SiP high-variety Product lineup for SoC mass production production Logic Packaging Power/LED CPU Lithography equip. Lithography equip. Nanoimprint High-productivity for WLP For PLP lit

  9. Slide 9: Expand business scale, market coverage, and application of semiconductor manufacturing equipment

    Expand business scale, market coverage, and application of semiconductor manufacturing equipment Semiconductor lithography equip. unit sales (台) 250 Optical Equipment Site 200 195 New 176 building Site of planned new plant 150 140 122 Site area: Approx. 70,000㎡ Cleanroom expansion within 100 84 Inve

  10. Slide 10: Raise competitiveness of OLED manufacturing equipment

    Raise competitiveness of OLED manufacturing equipment Resolution Higher resolution FPD lithography equip. MPAsp-E903T Larger panel size OLED Mass Production System System-ELVESS FPD lithography equip. MPAsp-H1003H FPD lithography equip. MPAsp-E813T FPD lithography equip. MPAsp-H1003T FPD lithography

  11. Slide 11: Strengthen and expand data solutions service

    Strengthen and expand data solutions service Launch “Lithography Plus,” a solutions platform for semiconductor manufacturing equip. Improve productivity of lithography equip. in operation at customer sites, integrating support know-how and data 2. Achieve high equipment 3. Achieve high yield by opti

  12. Slide 12: Cultivate new business domains by integrating core technologies (1)

    Cultivate new business domains by integrating core technologies (1) Nanoimprint semiconductor manufacturing equip.  Next-generation semiconductor manufacturing equipment that can achieve circuit patterns in the 10 nm range at low cost Power consumption comparison (When forming 15nm pattern, Canon

  13. Slide 13: Cultivate new business domains by integrating core technologies (2)

    Cultivate new business domains by integrating core technologies (2) Semiconductor device manufacturing process (Abstract) Front-end process Back-end process Advanced packaging market Deposit Expose (Front-end process) Cut Expose Bond Inspect (Back-end process) Advanced packaging market (US$ B) Optic

  14. Slide 14: Cultivate new business domains by integrating core technologies (3)

    Cultivate new business domains by integrating core technologies (3) Machinery Automation Technology Thin-film die handling technology Next generation semiconductor manufacturing equip. Atomic diffusion Vacuum bonding technology deposition technology Anelva New Domain Tokki Offer new value by integra

  15. Slide 15: 2023 Performance Outlook

    2023 Performance Outlook Industrial Group Consolidated Performance (Billions of yen) Op. profit Op. profit ratio Net sales 400.0 Net sales and Operating profit 352.0 337.7 329.2 Operating profit ratio 300.0 200.0 100.0 58.0 44.9 61.8 0.0 Will firmly capture demand in the semiconductor and display pr

Canon — Investor Day (March 2023) on 6ix