Slide 1: Q2 2023 Results Presentation
Q2 2023 Results Presentation 26 July 2023
Slide 2: Disclaimer
Disclaimer The information contained in this presentation is provided for These forward-looking statements reflect the Company’s current informational purpose only and should not be relied upon for the expectations, beliefs, hopes, intentions or strategies regarding the purpose of making any investm
Slide 3: Agenda
Agenda 01 │ Key Highlights 02 │ Financial Performance 03 │ Q3 2023 Revenue Guidance 04 │ Key Investor Takeaways 05 │ Q&A 3
Slide 4: Key Highlights
Key Highlights Private and confidential
Slide 5: Advanced Packaging Highlights
Advanced Packaging Highlights Positioned Well for Generative AI and HPC Growth Advanced Thermo-Compression Bonding (TCB): Packaging • Highest contribution to AP revenue ~19% • Logic: Key enablers of C2W and C2S processes • Memory: Fulfil demanding requirements for next-gen HBM, won repeat HBM orders
Slide 6: TCB - Key Enabler for Generative AI and HPC
TCB - Key Enabler for Generative AI and HPC Accelerated Adoption of TCB Generative AI Chip Accelerated ASMPT’s Unique Demand Drivers TCB Adoption TCB Capabilities • Increased number of TCB Equipment Market * • Best in class die logic chiplets & new placement accuracy generation HBM (<1 μm) Inflectio
Slide 7: Automotive Highlights
Automotive Highlights Automotive CIS Solutions Automotive ~23% LED / Advanced Laser Singulation & Silver Display Solutions Sintering Solutions 1H 2023 Vehicle LiDAR Module Group Revenue US$998M Power Module In-Vehicle Micro LED Display Advanced Packaging Die/Wire Bond & • Highest revenue contributio
Slide 8: Financial Performance
Financial Performance Private and confidential
Slide 9: 1H 2023 Key Financials
1H 2023 Key Financials Revenue Bookings Backlog US$998M US$838M US$993M (-25.3% YoY)1 (-43.9% YoY)1 (-30.4% YoY)1 (-12.1% HoH)1 (-2.7% HoH)1 (-13.4% HoH)1 Gross Margin Operating Margin 40.3% 10.9% (-89 bps YoY) (-804 bps YoY) (-86 bps HoH) (-318 bps HoH) Net Profit EPS DPS HK$623M HK$1.52 HK$0.61 (-
Slide 10: 1H 2023 Group Financial Results
1H 2023 Group Financial Results 1,496 1,338 1,134 998 860 838 USD’M Revenue 1H 2022 2H 2022 1H 2023 • Declined HoH and YoY due to SEMI Bookings Revenue Gross Margin 41.2% 41.1% 40.3% Bookings • Declined HoH due to SMT, while SEMI grew from low base • Declined YoY due to high base effect 1,984 • AP,
Slide 11: Q2 2023 Group Financial Results
Q2 2023 Group Financial Results 664 593 500 497 453 384 USD’M Revenue • Above mid-point of guidance Q2 2022 Q1 2023 Q2 2023 • Declined YoY due to high base effect Bookings Revenue Gross Margin 41.7% 40.4% 40.1% Bookings • Declined QoQ due to ongoing industry downcycle • Declined YoY due to high base
Slide 12: Q2 2023 Semiconductor Solutions Segment Performance
Q2 2023 Semiconductor Solutions Segment Performance 392 272 211 Revenue 192 197 USD’M 162 • IC/Discrete: Highest contribution from TCB; uptick in contribution from mainstream tools • Optoelectronics: QoQ growth driven by wire bonders for Q2 2022 Q1 2023 Q2 2023 Conventional Displays and high-end Sil
Slide 13: Q2 2023 SMT Solutions Segment Performance
Q2 2023 SMT Solutions Segment Performance 321 303 272 286 261 223 USD’M Revenue • Driven by Industrial and Automotive, mostly from Q2 2022 Q1 2023 Q2 2023 Europe Bookings Revenue Gross Margin 37.4% 37.4% 38.2% Bookings • Entered normalisation phase after high levels for more than 2 years 400 480 428
Slide 14: Key End-Market Applications
Key End-Market Applications Serving Broad-based End-Market Applications* Automotive Industrial Consumer Computers Communication Others TV Visual Sensors Personal Computers Mobile Phones EV Charging Wearables Medical Devices Infotainment Servers Wired Infrastructure Smart Factories Audio devices Aero
Slide 15: Key Partner to Global Customers
Key Partner to Global Customers Group Revenue Contribution by Geography 50% 44% 39% 40% 30% 30% 30% 21% 19% 20% 15% 14% 9% 10% 10% 8% 7% 6% 5% 3% 3% 3% 3% 2% 3% 2% 2% 1% 2% 3% 4% 2% 2% 1% 1% 3% 1% 2% 0% China Europe Americas Malaysia Korea Taiwan Thailand Vietnam Japan Philippines Others 1H 2022 2H
Slide 16: Returning To Shareholders
Returning To Shareholders Consistent Dividend Payout Ratio Policy Supported by Healthy Cash Flow Dividend Payout (%) FY13 FY14 FY15 FY16 FY17 FY18 FY19 FY20 FY21 FY22 1H23 61% 53% 59% 53% 36% 49% 132% 68% 51% 50% 40% Dividend Per Share (HKD) 2.6 1.9 1.4 1.3 0.7 2.0 1.3 1.1 0.4 0.5 1.2 1.3 1.3 1.3 1.
Slide 17: Q3 2023 Revenue Guidance
Q3 2023 Revenue Guidance Private and confidential
Slide 18: Q3 2023 Revenue Guidance
Q3 2023 Revenue Guidance Near term visibility continues to be limited due to: • Uncertainty in macroeconomic environment • Tepid consumer sentiment • Ongoing inventory digestion As SMT continues to normalise, the Group expects Q3 2023 revenue to be: US$410m to US$480m (-23.4% YoY and -10.5% QoQ at
Slide 19: Key Investors Takeaways
Key Investors Takeaways Private and confidential
Slide 20: Key Investor Takeaways
Key Investor Takeaways Unique Broad-based Portfolio Strong Unique Long-Term Tailwinds Broad-based Portfolio Performance Mainstream & Applicative Tools Advanced Packaging Long-Term Secular Growth Volume Leverage + Cash Tools Drivers Generators High Growth + High Margin (5G / AI / Advanced Displays /
Slide 21: Q&A
Q&A Private and confidential
Slide 22: Thank You!
Thank You! For enquiries, please contact: Mr. Romil Singh / romil.singh@asmpt.com Mr. Leonard Lee / leonard.lee@asmpt.com asmpt.com Private and confidential
Slide 23: Appendix
ASMPT sian Appendix erro cna a
Slide 24: Advanced Packaging
Advanced Packaging Example of a High-end HPC device using both TCB & Hybrid Bonding Interconnects by TCB = 54 Interconnects by HB = 6 Memory stacking (A) Chiplet integration to Active 48 interconnects (4 x 12 = 48) Interposer (B) 6 interconnects (6 x 1 = 6) Passive interposer Active interposer Bondi