Synaptics Incorporated · NASDAQ:SYNA
Synaptics — Investor Day (September 2026)
138 slides from Synaptics's investor day presentation, Sep 16, 2026
Slide 1: Powering a Smarter World
Powering a Smarter World September 16, 2026
Slide 2: Cautionary Note Regarding Forward-Looking Statements
Cautionary Note Regarding Forward-Looking Statements This communication relates to a proposed business combination transaction between Synaptics Incorporated (“Synaptics”) and ON Semiconductor Corporation (“onsemi”). This communication includes forward-looking statements within the meaning of Sectio
Slide 3: Use of Non-GAAP Financial Measures
Use of Non-GAAP Financial Measures This presentation contains historical non-GAAP financial measures including, among others, free cash flow (FCF) and FCF margin, non-GAAP gross margin and non-GAAP operating margin. This presentation also contains forward looking non-GAAP financial measures, some of
Slide 4: Agenda: Topics and Presenters
Powering a Smarter World TOPIC PRESENTER Charting a Path to Power the Next Decade of Innovation Hassane El-KhouryPresident & CEO Powering the AI Revolution Achyut Shah Group President, Power Solutions Group Expanding the Core: Automotive and Industrial Sudhir Gopalswamy Group President, Anal
Slide 5: Powering a Smarter World
Powering a Smarter World September 16, 2026
Slide 6: Built to Break the Constraint
Slide 7: Charting a Path to Power the Next Decade of Innovation
Charting a Path to Powerthe Next Decade of Innovation Hassane El-KhouryPresident and CEO
Slide 8: Every foundational technology eventually encounters a physical limit
Every foundational technology eventually encounters a physical limit We’ve reached it. © onsemi 2026 | Public Information
Slide 9: A Foundational Technology Is Not an Invention
A Foundational Technology Is Not an Invention… Three Signatures of a Foundational Technology 1 WIDESPREAD IMPACT CONTINUOUS IMPROVEMENT FOUNDATIONAL DEPENDENCY 2 3 A force multiplier… …for human progress. IT'S A LAYER EXPANDS POSSIBILITY ELEVATES QUALITY OF LIFE ENABLES SUSTAINABILITY UNLOCKS THE NE
Slide 10: The Future is Arriving Faster Than Ever
The Future is Arriving Faster Than Ever SLOWER THEN FASTER NOW STEAM ENGINE ~60 YEARS ~90 YEARS ~37 YEARS ~26 YEARS ~13 YEARS ~9 YEARS ELECTRICITY AUTOMOBILE COMPUTING INTERNET AI TIME FROM IDEA TO BINDING CONSTRAINT Every Foundational Technology Was Gated By A Physical Constraint Precision metalwor
Slide 11: Every Foundational Technology Was Gated By A Physical Constraint
Every Foundational Technology Was Gated By A Physical Constraint Precision metalworking Grid & factory reorganization Petroleum refining, fuel distribution & road network Switching element – the transistor Bandwidth & local access infrastructure COMPUTE, MEMORY & POWER STEAM ENGINE ELECTRICITY AUTOM
Slide 12: Physical Constraint Ladder
Physical Constraint Ladder Each constraint sits deeper in the system. Each is harder to move. Until power density breaks through, the AI revolution is limited COMPUTE THE CONSTRAINT ON BREADTH Compute determines how broadly a foundational technology can be deployed ADVANCEDNODES FAB CAPACITYEXPANDIN
Slide 13: More Power Isn't Enough. The World Needs Better Power.
More Power Isn’t Enough. The World Needs Better Power. YESTERDAY: POWER SUPPORTED WORK Factories Predictable operations Appliances Intermittent usage Buildings Managed consumption Conventional Vehicles Mechanical systems Power was relatively predictable and tolerant of inefficiency TOMORROW: POWER E
Slide 14: We Solved Power, Now We Solve Power Density
WE SOLVED POWER NOW WE SOLVE POWER DENSITY © onsemi 2026 | Public Information POWER OF TODAY WE SOLVED THE POWER OF YESTERDAY ELECTRICAL (COMPONENTS) MULTI-PHYSICS SYSTEMS More watts Bigger Centralized More watts Smaller Distributed Electrical Convert, control and distribute power efficientl
Slide 15: System Requirements are Moving in Opposite Directions
AI Data Center And the problems only get harder across end markets and applications 800V and higher 6V or less Industrial: Solid-State Transformer 13.8kV 34.5kV Automotive: xEV 400V 900V+ © onsemi 2026 | Public Information no overlap Thermal Mechanical Electrical Physical What the customer ask
Slide 16: Power density requires a different company
Power density is not solved by one device It requires a different company SOLVING POWER DENSITY TO Electrical • Thermal • Mechanical • Physical onsemi is a fundamentally different company for a fundamentally different problem: Power Density SOLVING POWER FROM Efficiency • Conversion • Components • S
Slide 17: Strong Technology Base and Strategic Actions
2021 GTAT Acquisition SWIR VISION Acquisition SiC JFETAcquisition SiC VCOREAcquisition Treo Platform Technology Development Treo LATERALGaNTechnology Development GaN VERTICALGaNTechnology Development GaN RISC-VAcquisition 300mm East Fishkill NY FabAcquisition EFK SiC MOSFET Technology Development Em
Slide 18: Strong Technology Base and Strategic Actions
2021 GTAT Acquisition SWIR VISION Acquisition SiC JFETAcquisition SiC VCOREAcquisition Treo Platform Technology Development Treo LATERALGaNTechnology Development GaN VERTICALGaNTechnology Development GaN RISC-VAcquisition 300mm East Fishkill NY FabAcquisition EFK SiC MOSFET Technology Development Em
Slide 19: Synaptics Extends the onsemi Portfolio
POWER Efficient power conversion Silicon to wide-bandgap Power management Power protection SENSE Perception of the physical world Image sensors Ultrasonic & Inductive position sensors HMI & Tactile sensing CONTROL Precise actuation & control Analog & mixed-signal ICs Drivers Controllers © onsemi 202
Slide 20: Four Pillars of Physical AI
CONNECTED COMPUTE Edge intelligence & connectivity Single pair ethernet AI-First Compute Connectivity: Wi-Fi / BLE / Thread + Synaptics …completing the Four Pillars of Physical AI Machines that sense, decide, act and adapt © onsemi 2026 | Public Information Synaptics Extends the POWER Efficient powe
Slide 21: Four Pillars of Physical AI
CONNECTED COMPUTE Edge intelligence & connectivity Single pair ethernet AI-First Compute Connectivity: Wi-Fi / BLE / Thread + Synaptics …completing the Four Pillars of Physical AI Machines that sense, decide, act and adapt © onsemi 2026 | Public Information Synaptics Extends the onsemi Portfolio… PO
Slide 22: Every Market Converges on Power
Auto Other $18 B AD&S $14 B Medical $4 B Autonomous Mobile Robots $3 B Drones $2 B Humanoids $1 B EV Charging <$1 B Industrial Other $20 B HV Energy Storage Systems $4 B HV Solid State Transformer $3 B HV Solid State Circuit Breaker $1 B HV Uninterruptible Power Supply $1 B Vcore $24 B HV Intermedia
Slide 23: Every Market Converges on Power: $213B TAM
Auto Other $18 B AD&S $14 B Medical $4 B Autonomous Mobile Robots $3 B Drones $2 B Humanoids $1 B EV Charging <$1 B Industrial Other $20 B HV Energy Storage Systems $4 B HV Solid State Transformer $3 B HV Solid State Circuit Breaker $1 B HV Uninterruptible Power Supply $1 B Vcore $24 B HV Intermedia
Slide 24: Delivering The Value Stack
Delivering The Value Stack Technology SiC vGaN LGaN Si Advanced Deposition BCD65 EPP © onsemi 2026 | Public Information Products
Slide 25: Delivering The Value Stack
Delivering The Value Stack Products Technology SiC vGaN LGaN 10BASE-T1S PWR Drivers ULS Small Signal Si Advanced Deposition Circuit Protection BCD65 EPP Inductive Position LV <200V MV < 650V 650V<HV<5000+V Si MOSFET LGaN LGaN Si IGBT SiC MOSFET, JFET, vGaN TVS diode LP BT © onsemi 2026 | Public Info
Slide 26: Delivering The Value Stack
Delivering The Value Stack Products Technology Solutions SiC vGaN LGaN 10BASE-T1S PWR Drivers ULS Small Signal ESS Hybrid Intelligent Power Modules xPU SPS Solid State Transformer Solid State Circuit Breaker Si Advanced Deposition Circuit Protection BCD65 EPP Inductive Position Solid State Battery D
Slide 27: Delivering The Value Stack
ASP Scale Delivering The Value Stack Products Technology Solutions Systems COMBINED, THESE CAPABILITIES CREATE A SUSTAINABLE COMPETITIVE ADVANTAGE SiC vGaN LGaN 10BASE-T1S PWR Drivers ULS Small Signal ESS Hybrid Intelligent Power Modules xPU SPS Solid State Transformer PowerBox Solid State Circuit
Slide 28: We Must Change the Power Systems Paradigm
no overlap Thermal Mechanical Electrical Physical © onsemi 2026 | Public Information We Must Change the Power Systems Paradigm…
Slide 29: Introducing Technologies to Address the Constraints
no overlap Thermal Mechanical Electrical Physical Supported by a complete portfolio of differentiated Power and Sensing technologies EPP THE INTEGRATION HV THE DEVICE Treo THE INTELLIGENCE © onsemi 2026 | Public Information …by Introducing Technologies to Address the Constraints…
Slide 30: Creating the Disruption to Unlock Power Density
Mechanical Thermal Electrical Physical © onsemi 2026 | Public Information …And Creating the Disruption Necessary to Unlock the Power Density Problem Supported by a complete portfolio of differentiated Power and Sensing technologies EPP THE INTEGRATION HV THE DEVICE Treo THE INTELLIGENCE EPP Treo HV
Slide 31: onsemi has Every HV Option to Close the Gap
Unconstrained HV power conversion Efficiency Density IGBT SiC MOSFET · JFET GaN LGaN · vGaN Cost ▼ IGBT → Hybrid → SiC → Hybrid → vGaN onsemi's HV device portfolio has every option needed to optimize the customer solution vGaN solution…And it's ready 66,000 sq ft 14-acre site 20,000 sq ft clean room
Slide 32: Treo Platform
The onsemi Treo Platform is the most advanced in the industry, enabling winning analog and mixed-signal products, for next generation applications BCD 65nm Technology Process Best performance & power Advanced feature integration Industry’s Widest Voltage Range: 1 - 90V Highest integration Auto 48V t
Slide 33: Treo Products Sampling 2024-2026
Automotive Industrial AI / Client Compute Mass Market Medical 2024 Products Sampling Low-Power AFE ASIC Medical Ultrasonic Sensor ASIC Automotive Test Equipment Signal Processor ASIC Industrial 10BASE-T1S MAC-PHY Automotive, Industrial Multi-Phase Controller AI / Client LDO Regulators Mass Market Vo
Slide 34: Embedded Power Platform
Slide 35: Introducing onsemi's Embedded Power Platform
The silicon becomes the system. EPP is the breakthrough that creates a new category of power systems. Embedded Power Platform (EPP) uses the silicon wafer itself as the package, embedding heterogeneous die to deliver electrical, mechanical and thermal performance simultaneously, solving the density
Slide 36: EPP Leapfrogs PCB Embedded Power
Yesterday's solutions Lead-frame & DBC substrate (B2S) Available today Available today Sampling today EVALUATION CRITERIA Power density (area vs. B2S) 1x 1.3x 3x to 5x System cost (vs. B2S) 1.0 1.1 0.7 – 0.8 Stray inductance Medium Low Lowest Thermal path Bottom-side · 4 W/mK Bottom-side · 0.4 W/mK
Slide 37: Delivering Value to Customers Already
< 48 hours Size · Voltages · efficiency 1 Customer input Electrical, thermal and mechanical simulation · multi-technology 2 EPP Design Studio < 5 days System design and concept complete 4 Customer system modelling Design · datasheet · validated models 3 Studio output < 3 months 12″ silicon fab · sta
Slide 38: Delivering Value to Customers Already
< 48 hours Size · Voltages · efficiency 1 Customer input Electrical, thermal and mechanical simulation · multi-technology 2 EPP Design Studio < 5 days System design and concept complete 4 Customer system modelling Design · datasheet · validated models 3 Studio output < 3 months 12″ silicon fab · sta
Slide 39: Complete and Unique Suite of Capabilities
Solving Problems with a Complete and Unique Suite of Capabilities Peer 1 Peer 2 Peer 3 Peer 4 TECHNOLOGY NEEDED IGBT Silicon MOSFET SiC MOSFET SiC JFET Lateral GaN Vertical GaN Treo (BCD 65nm, 1V-90V) UNIQUE AND DEFENSIBLE COMPETITIVE POSITION Power 1500+ patents Vertical GaN (GaN-on-GaN) Syracuse-b
Slide 40: We Solve Power Density at Every Level
EPP THE INTEGRATION Silicon as the system The requirements do not converge on their own onsemi makes them converge. We solve Power Density at every level. TREO THE INTELLIGENCE Analog and mixed-signal platform HV THE DEVICE Technology for every power problem © onsemi 2026 | Public Information The co
Slide 41: OnsSEMi.
OnsSEMi. <> SUBARU
Slide 42: onsemi: Powering the AI Revolution
onsemi: Powering the AI Revolution Achyut ShahGroup President, Power Solutions Group
Slide 43: The bottleneck has shifted from chips to power
The bottleneck has shifted… from chips to power. from chips to power. © onsemi 2026 | Public Information
Slide 44: The bottleneck has shifted from chips to power
Jensen Huang Founder, President & CEO Electrical • Thermal • Mechanical • Physical from chips to power. The bottleneck has shifted… from chips to power. © onsemi 2026 | Public Information
Slide 45: Increased Power Demand Creates Architectural Challenges
GPU kW vs Deployment Horizon Source: McKinsey & Company Increased Power Demand Creates Architectural Challenges 2000 1600 0 1200 800 400 2026 2027 2028 2029 2030 Deployment Horizon 2030 142GW 2026 25GW Rack Power (kW per Rack) McKinsey & Company © onsemi 2026 | Public Information
Slide 46: Power is the limiting factor for AI data centers
“Power, not GPUs, is the limiting factor for AI data centers… the power density challenge is creating a fundamental architectural crisis at the rack level. The companies that solve this first will shape the competitive landscape for years to come.” – Roland Berger “800 VDC architecture: a single AC-
Slide 47: Power Density Redefines Economics of Compute
Less real estate More tokens/$$ Less water used Fewer Data Centers More Compute Higher Efficiency © onsemi 2026 | Public Information Power Density Redefines Economics of Compute
Slide 48: Power Increase Drives Move to High Voltage
2030 12VDC 0.8VDC DC Hot Swap DC DC DC DC Vcore PDU UPS AC DC AC HV PSU AC DC 480VAC 20KVAC 54VDC 54VDC xPU Power Transformer 480VAC 230VAC 54VDC Utility Grid BBU CBU 54VDC Bus Bar IBC AC & Low Voltage Distribution and Conversion Lateral Vcore 1kW xPU Mechanical Transformer; Low Voltage St
Slide 49: High Voltage Reaches the Core – Content Multiplies
AC High Voltage Reaches the Core – Content Multiplies © onsemi 2026 | Public Information Low Voltage High Voltage
Slide 50: High Voltage Reaches the Core – Content Multiplies
AC High Voltage Reaches the Core – Content Multiplies AC 800V DC Low Voltage © onsemi 2026 | Public Information High Voltage
Slide 51: High Voltage Reaches the Core – Content Multiplies
AC High Voltage Reaches the Core – Content Multiplies SST 800V DC AC 800V DC Low Voltage © onsemi 2026 | Public Information High Voltage $15K $115K Today 2030 per rack per rack
Slide 52: Grid to Core High Voltage Plays to Our Strength
AI DC Segment 6 VDC 0.8VDC DC Hot Swap DC DC HV DC DC DC Vcore PDU Utility Grid SST AC DC HV BBU PDU DC 35KVAC 800VDC 800VDC 800VDC ESS DC-DC xPU HV CBU BESS Grid to Core High Voltage Plays to Our Strength 800VDC HVDC Bus Bar Industrial Segment “AI Halo” © onsemi 2026 | Public Information More
Slide 53: Grid to Core High Voltage Plays to Our Strength
AI DC Segment 6 VDC 0.8VDC DC Hot Swap DC DC HV DC DC DC Vcore PDU Utility Grid SST AC DC HV BBU PDU DC 35KVAC 800VDC 800VDC 800VDC ESS DC-DC xPU HV CBU More Power, Limited Space BESS Grid to Core High Voltage Plays to Our Strength 800VDC More High Voltage Content More Energy Storage & Load Ba
Slide 54: As Technology Breadth Grows, Competitor Field Shrinks
Treo HV EPP Power and Sense Portfolio 6 VDC 0.8VDC AI Compute Tray Multiple Blade Trays per Rack DC Hot Swap DC DC HV DC PDU Utility Grid SST AC DC HV BBU PDU DC 35KVAC 800VDC 800VDC 800VDC ESS DC-DC GPU HV CBU BESS 800VDC DC DC Vcore peer peer peer peer peer peer peer peer peer peer peer peer
Slide 55: As Technology Breadth Grows, Competitor Field Shrinks
Treo HV EPP Power and Sense Portfolio 6 VDC 0.8VDC AI Compute Tray Multiple Blade Trays per Rack Utility Grid SST AC DC 35KVAC 800VDC ESS DC-DC GPU BESS DC DC Vcore DC DC HV DC PDU PDU DC 800VDC 800VDC HV CBU 800VDC DC Hot Swap HV BBU peer peer peer peer peer peer © onsemi 2026 | Public Inform
Slide 56: As Technology Breadth Grows, Competitor Field Shrinks
6 VDC 0.8VDC AI Compute Tray Multiple Blade Trays per Rack Utility Grid GPU 35KVAC DC DC Vcore DC Hot Swap DC DC HV DC PDU HV BBU PDU DC 800VDC 800VDC HV CBU 800VDC 800VDC ESS DC-DC SST AC DC BESS peer © onsemi 2026 | Public Information High Voltage: SiC JFET As Technology Breadth Grows, Compe
Slide 57: Win with Capability Breadth + Technology Differentiation
Treo HV EPP Power and Sense Portfolio 6 VDC 0.8VDC AI Compute Tray Multiple Blade Trays per Rack Utility Grid GPU 35KVAC DC DC Vcore DC Hot Swap DC DC HV DC PDU HV BBU PDU DC 800VDC 800VDC HV CBU 800VDC SST AC DC 800VDC ESS DC-DC BESS Proven leadership across technology breadth High Voltage: S
Slide 58: vGaN Enables Highest Density
Treo HV EPP Power and Sense Portfolio Competitor 1 Competitor 2 Higher Power density = More compute in Rack = Lower Cost per token vGaN + Unique magnetics = 20% smaller size © onsemi 2026 | Public Information vGaN Enables Highest Density 800V 6V IBC
Slide 59: Mechanical to Solid State Fault Protection
Mechanical Circuit Breaker High Voltage Architecture needs multiple Fault Protection points © onsemi 2026 | Public Information Industry-Standard Solid State Circuit Breaker Mechanical to Solid State Fault Protection
Slide 60: EPP + SiC JFET: Redefining the Density Benchmark
Treo HV EPP Power and Sense Portfolio EPP SSCB Industry-Standard SSCB © onsemi 2026 | Public Information EPP + SiC JFET: Redefining the Density Benchmark Over 50% Smaller 20% cooler thermals Over 50% Smaller
Slide 61: EPP + SiC JFET: Redefining the Density Benchmark
Treo HV EPP Power and Sense Portfolio Over 50% Smaller 106C 20% cooler Industry-Standard SSCB EPP SSCB 135C © onsemi 2026 | Public Information EPP + SiC JFET: Redefining the Density Benchmark Smaller size + Less cooling = Better TCO
Slide 62: EPP Enables Highest Vcore Power Density
Treo HV EPP Power and Sense Portfolio Digital multi-phase control Lateral Power Delivery 2-Phase SPS + Inductor 2 A/mm² Z = 5 mm with inductor >3 A/mm² Vertical Power Delivery onsemi enabled 4-Phase VPD In partnership with module vendors EPP enabled SPS Unique inductor design Z = 2 mm With inductor
Slide 63: AI DC Revenue Growth Outpaces the Market
>2X in 2026 Long-term Growth + 10 pts above market AI DC Revenue 2X in 2027 50%+ revenue CAGR 2026-2030 AI DC TAM CAGRGrowth estimates vary 2026 – 2030 100 0 UBS 44% 21% BofA Citi 77% 81% Mizuho ~40% CAGR baseline ~5X AI DC Revenue Growth >$500M (2026) >$2.5B (2030) Our technology innovations allo
Slide 64: AI turns power into one connected system
Solves the toughestchallenges AI turns power into one connected system. The field shrinks The prize grows © onsemi 2026 | Public Information
Slide 65: ONSEM
ONSEM Bcineider
Slide 66: Expanding the Core: Automotive and Industrial
Expanding the Core: Automotive and Industrial Sudhir GopalswamyGroup President, Analog & Mixed-Signal and Intelligent Sensing Groups
Slide 67: Expanding the Core: Automotive, Industrial
Expanding the Core Automotive Industrial © onsemi 2026 | Public Information
Slide 68: We Have Outgrown Automotive SAAR by 9%
2019 Today 9% Growth vs. Flat SAAR We Have Outgrown Automotive SAAR by 9% By Building a Franchise to Seize Megatrends ELECTRIFICATION AUTONOMOUS Intelligent Sensing: Image, Ultrasonic, Inductive Intelligent Power: HV FET, MV FET, Power IC © onsemi 2026 | Public Information 2030
Slide 69: We Will Continue to Outperform SAAR by 9%
AUTONOMOUS L2 L3 L4 End-end Ethernet Central “Brain” Intelligent Nodes 2030 ELECTRIFICATION EV penetration Ultra-fast charging Efficiency targets Today SDV/ZONAL $47B TAM $15B TAM $9B TAM © onsemi 2026 | Public Information We Will Continue to Outperform SAAR by 9% While Shifting to Higher Value
Slide 70: Intelligent Power Growth Plan
Intelligent Power Growth Plan Extend SiC Technology Leadership Expand System Value with Treo Power ICs Change the Game with EPP © onsemi 2026 | Public Information
Slide 71: SiC Leadership Provides Growth Foundation
SiC performance: +25% per generation Next-gen M1 M2 M3 Extend to 1400V SiC 400VBattery 800V Battery Today 1000V Battery 750VSiC 1200VSiC 1400VSiC Device Structure Enhancement Today Treo HV EPP Power and Sense Portfolio ELECTRIFICATION $47B TAM CustomerValue Efficiency Range or System Cost Power De
Slide 72: Expand System Value: Treo Power ICs
Treo HV EPP Power and Sense Portfolio Enabled by Treo LED Drivers Front/Rear Lighting SPS, DC-DC Controllers “Brain” Power Protection Power Tree Current Controllers Traction & OBC © onsemi 2026 | Public Information Expand System Value: Treo Power ICs LDOs Power Tree
Slide 73: Intelligent Treo SiC Current Controller
Intelligent Treo SiC Current Controller Treo HV EPP Power and Sense Portfolio Controller SiC Gate Driver DC Bus Discharge Driver Power Supply SiC FET Hall Effect Sensors Motor Current Sensing Industry Standard Inverter © onsemi 2026 | Public Information ELECTRIFICATION $47B TAM 1-Gen SiC Boost 5% BO
Slide 74: Intelligent Treo SiC Current Controller
Intelligent Treo SiC Current Controller Treo HV EPP Power and Sense Portfolio Controller Intelligent SiC Current Controller Motor Current Sensing SiC FET Smart Control Current Sense onsemi Treo Optimized Inverter 1-Gen SiC Boost 5% BOM Savings Hall Effect Sensors Enabled by Treo Available 2026 Custo
Slide 75: EPP Transforms Inverter Solutions
ELECTRIFICATION $47B TAM Customer Value Power Density Smaller, Lighter Flexibility Scalability Lower R&D & Manufacturing Cost Efficiency Range or System Cost Full System Fast Time-to-Market EPP Transforms Inverter Solutions Treo HV EPP Power and Sense Portfolio 4x Power Density 15% Power L
Slide 76: Intelligent Sensing Growth Plan
Intelligent Sensing Growth Plan Capitalize on Sensor Proliferation Extend Sensing Performance Leadership with Treo Enhance Vision with New Image Sensing Modalities © onsemi 2026 | Public Information
Slide 77: Broadest Range of Sensing Solutions
Broadest Range of Sensing Solutions Image Ultrasonic Inductive AUTONOMOUS $15B TAM © onsemi 2026 | Public Information
Slide 78: Sensors Proliferate As Autonomy Scales
AUTONOMOUS $15B TAM Sensors Proliferate As Autonomy Scales 2026 2030 L2 L4 Image Sensors Ultrasonic Sensors More use cases Inductive Sensors x-by-wire extends 1.5x 1.5x 3x © onsemi 2026 | Public Information
Slide 79: Raising the Bar on Intelligent Sensing
AUTONOMOUS $15B TAM Customer Value Accuracy Safety & Reliability Integration System Cost Raising the Bar on Intelligent Sensing Image Sensing Ultrasonic Sensing Enabled by Treo Inductive Sensing 20+ cm Legacy › 6 cm Today <1 cm Next-gen › Current Gen ~0.1° Next Gen <0.005° >20x 20x Performance 1
Slide 80: Enhancing Vision for the Next Phase of Perception
AUTONOMOUS $15B TAM PERCEPTION STACK Vision Adverse weather conditions Spatial resolution System cost CHALLENGES © onsemi 2026 | Public Information Enhancing Vision for the Next Phase of Perception Radar Lidar SWIR See through fog and rain Industrial avail today, Auto in Advanced R&D iToF High-res d
Slide 81: Enhancing Vision for the Next Phase of Perception
AUTONOMOUS $15B TAM SWIR See through fog and rain Industrial available today, Auto in Advanced R&D iToF High-res depth at <15M Detect hazard at 100M Industrial available today, Auto in Proof-of-concept Superhuman Vision Customer Value Enhanced Vision Safety iToF System Cost Vision Capture detail
Slide 82: New Growth Driver: Software Defined Vehicle/Zonal
New Growth Driver: Software Defined Vehicle/Zonal Expand Content and Intelligence at the Nodes © onsemi 2026 | Public Information
Slide 83: New Growth Driver: SDV/Zonal
Domain-Based IVN (Today) COMPLEX ECU sprawl, SW in each node, mixed protocols ADAS ECU ECU ADAS BODY POWER-TRAIN CHASSIS GATE-WAY Zonal w/ 10BT1S Zonal w/ onsemi RCP ZONAL CONTROLLER CENTRAL COMPUTE ZONAL CONTROLLER ZONAL CONTROLLER ZONAL CONTROLLER ZONAL SWITCH CENTRAL COMPUTE ZONAL SWITCH ZONAL SW
Slide 84: New Growth Driver: SDV/Zonal
SDV/ZONAL $9B TAM Basic Ethernet Node Ethernet Node with RCP Treo Intelligent Node MCU w/ SW onsemi 10BT1S onsemiUltrasonic CENTRAL COMPUTE ZONAL CONTROLLER $$$ MCU w/ SW onsemi 10BT1S onsemiLED driver Ultrasonic Node LED Node onsemi 10BT1S RCP w/ SW onsemiUltrasonic CENTRAL COMPUTE ZONAL SWITCH $ o
Slide 85: Leading the SDV Evolution
SDV/ZONAL $9B TAM Basic Ethernet Node Ethernet Node with RCP Treo Intelligent Node ZONAL CONTROLLER $$$ Ultrasonic Node LED Node ZONAL SWITCH $ Ultrasonic Node LED Node ZONAL SWITCH $ Ultrasonic Node LED Node In Production $ Today Design-in 2027 2x $ Today Next-gen in 2028 3x $ Today Leading the SDV
Slide 86: Building the Car: onsemi in Every Subsystem
Up to $2000 of onsemi content per vehicle Existing Portfolio Recently Added Products © onsemi 2026 | Public Information Building the Car: onsemi in Every Subsystem ADAS and Autonomous Driving Solutions 8Mp, 3Mp image sensor iToF SWIR Ultrasonic Sensing Inductive Sensing Rain & Light Sensing Zonal El
Slide 87: Automotive Innovations
SiC TRACTION IMAGE SENSING ADAS 10BASE-T1S IVN INDUCTIVE X-BY-WIRE INNOVATION ENGINE © onsemi 2026 | Public Information Automotive Innovations… ULTRASONIC PARK ASSIST
Slide 88: Automotive Innovations Enable Growth in Industrial
IMAGE SENSING MACHINE VISION 10BASE-T1S ETHERNET NODES INDUCTIVE JOINT CONTROL Automotive Innovations… Enable Growth in Industrial… INNOVATION ENGINE SiC ENERGY INFRASTRUCTURE ULTRASONIC FLOW METERING © onsemi 2026 | Public Information
Slide 89: The Era of Physical AI
POWER Efficient power conversion SENSE Perception of the physical world CONTROL Precise actuation and control …and Lead to the Next Major Growth Opportunity The Era of Physical AI © onsemi 2026 | Public Information
Slide 90: The Era of Physical AI has Already Begun
POWER, PERFORMANCE AUTONOMY Robot Vacuums Drones Delivery Robots Warehouse AMRs Cobots Factory Arms Autonomous Tractors Autonomous Cars onsemi Content Opportunity © onsemi 2026 | Public Information The Era of Physical AI has Already Begun Autonomous machines that sense, decide, act and adapt Warehou
Slide 91: The Evolution to Humanoids Yields Content Expansion
Warehouse AMRs Autonomous Cars Factory Arms Legged AMR “Reasoning”Vehicles Dexterous Hands + Autonomy, Legs + Gripper Hands, Force Sensing + Multi-modal VLA, Reasoning Physical AI: $6B TAM by 2030 © onsemi 2026 | Public Information The Evolution to Humanoids Yields Content Expansion
Slide 92: Building the Humanoid: onsemi in Every Subsystem
Up to $900 of onsemi content per humanoid HEAD/PERCEPTION NECK SHOULDERS UPPER ARMS ELBOWS HANDS LEGS ANKLES/FEET TORSO/COMPUTE POWER SYSTEM CORE SENSORS WAIST/HIPS BATTERY KNEES COMMUNICATION 30+ Limb Actuators 6x GaN FET 3x GaN Driver Inductive sensors 10BASE-T1S Intelligent Control Current sensor
Slide 93: Expanding the Core: Automotive and Industrial Value Drivers
Today 2030 EPP Disruption: Intelligent Sensing: SDV/Zonal: System Play Content Expansion New Growth Engine 9% CAGR Industrial Leverage Auto: Physical AI: AI Halo: SAM Expansion New Growth Engine New Growth Engine 10% CAGR © onsemi 2026 | Public Information Expanding the Core: Automotive and Industri
Slide 94: ONSeEMi
ONSeEMi MA MAGNA
Slide 95: Turning Technology Leadership into Durable Financial Performance
Turning Technology Leadership intoDurable Financial Performance Thad TrentExecutive Vice President and CFO
Slide 96: Market Inflection. Differentiated Capabilities. Shareholder Value Creation.
Market Inflection. Differentiated Capabilities. Shareholder Value Creation. HIGH-VALUE, SECULAR MARKETS AI Data Center, Automotive, Industrial DIFFERENTIATED CAPABILITIES Differentiated technology expands margins © onsemi 2026 | Public Information
Slide 97: The Power of onsemi's Transformation
Non-GAAP 2015–2020 2021–2026 Avg. Gross Margin Avg. Operating Margin 26% 43% 36% 13% *BANDS REPRESENT HIGH AND LOW OF EACH METRIC DURING THAT PERIOD Revenue Sustainable and predictable results Proven downside resilience Improved cost structure, OpEx efficiency (Rev/employee increased ~2X) Higher Ope
Slide 98: The Power of onsemi's Transformation
2015–2020 2021–2026 Avg. Gross Margin Avg. Free Cash Flow Margin Revenue 18% 8% Sustainable and predictable results Proven downside resilience Improved cost structure, OpEx efficiency (Rev/employee increased ~2X) Higher Operating leverage Differentiated products, Fab Right, portfolio rationalization
Slide 99: Strategic Investments Drive Significant TAM Expansion
R&D $3.6B Organic Investments EPP Sensing, 8MP, Ultrasonic Core Portfolio Expansion Treo Platform Low/Medium/High Voltage Strategic Investments Drive Significant TAM Expansion Auto Industrial AI Data Center Other © onsemi 2026 | Public Information 2021-2026 Total Investment: $8.7B
Slide 100: Strategic Investments Drive Significant TAM Expansion
GTAT Vcore SiC JFET SWIR Vision Vertical GaN M&A Capability Expansion $0.8B Strategic Investments Drive Significant TAM Expansion Auto Industrial AI Data Center Other © onsemi 2026 | Public Information 2021-2026 Total Investment: $8.7B
Slide 101: Strategic Investments Drive Significant TAM Expansion
CapEx Capacity Expansion $4.3B EFK Expansion SiC / vGaN Capacity Maintenance Strategic Investments Drive Significant TAM Expansion Auto © onsemi 2026 | Public Information 2021-2026 Total Investment: $8.7B Auto Opportunistic expansion leveraging strategic investments Power Distribution & Traction ADA
Slide 102: $8.7B investment delivers $81B TAM Expansion
Total Investment: $8.7B $8.7B investment delivers $81B TAM Expansion R&D $3.6B Organic Investments GTAT Vcore SiC JFET SWIR Vision Vertical GaN M&A Capability Expansion $0.8B CapEx Capacity Expansion $4.3B EFK Expansion SiC / vGaN Capacity Maintenance EPP Sensing, 8MP, Ultrasonic Core Portfolio Expa
Slide 103: Enabling Innovation Across a Global Customer Base
Deep strategic engagements addressing customers’ most complex engineering challenges Broad global distribution network to serve the mass market Top 20 customers represent ~35% of revenue, no 10% customer © onsemi 2026 | Public Information Highly diversified customer footprint spanning 9,000+ custome
Slide 104: Innovation and Portfolio Breadth Accelerates Growth
Innovation and Portfolio Breadth Accelerates Growth Other Communications, Computing, Consumer AUTO INDUSTRIAL AI DATA CENTER OTHER Non-GAAP CAGR 2026E - 2030 Target 9% 10% 50%+ 1% 12-14% 2026E 2030 Target Auto Drivers: electrification, Software-Defined Vehicles/Zonal, ADAS ~$2,000 content per vehicl
Slide 105: Fab Right: More Efficient, Scalable Manufacturing Network
East Fishkill External 2019 Footprint: Mount-ain Top Mec-helen Bucheon Poca-tello Oud-ena-arde Niig-ata Czech Repu-blic Aizu Gresham Serem-ban Aizu Gresham Bucheon Czech Republic Seremban External Fab-Liter Current Footprint: Fab Right Syracuse © onsemi 2026 | Public Information Fab Right: Building
Slide 106: Fab Right: More Efficient, Scalable Manufacturing Network
East Fishkill External 2019 Footprint: Mount-ain Top Mec-helen Bucheon Poca-tello Oud-ena-arde Niig-ata Czech Repu-blic Aizu Gresham Serem-ban Aizu Gresham Bucheon Czech Republic Seremban External Fab-Liter Current Footprint: Fab Right Syracuse © onsemi 2026 | Public Information Fab Right: Building
Slide 107: Fab Right: More Efficient, Scalable Manufacturing Network
External Scalable, Efficient, Lower Cost Right sized, ready to scale on demand Minimal CapEx needed to scale (5% of revenue) More efficient capacity drives gross margin expansion Exited five subscale fabs while expanding 300mm (EFK) capacity Current footprint ~17% lower cost (at full utilization) Ad
Slide 108: Growth and Innovation Drive Gross Margin Expansion
Utilization Volume driven ramp to full utilization Absorption of fixed costs Fab Right Additional efficiency and cost optimization Capacity allocated to high value products Two site divestitures recently announced New Products/ Mix Ramping differentiated products at accretive margins (Treo, EPP, vGa
Slide 109: Top-line Growth to Outsized Earnings Growth
Non-GAAP CAGR, 2026E – 2030 Target Operating Income $ Gross Profit $ Revenue 20% 30% 10% 0% +12-14% +22% +30% Gross profit grows 1.6x faster than revenue; operating income more than 2x faster. © onsemi 2026 | Public Information Top-line Growth Outsized Earnings Growth Structural changes, innovatio
Slide 110: Top-line Growth to Outsized Earnings Growth
Operating Income $ Gross Profit $ Revenue +12-14% +22% +30% 20% 30% 10% 0% Gross profit grows 1.6x faster than revenue; operating income more than 2x faster. Non-GAAP CAGR, 2026E – 2030 Target © onsemi 2026 | Public Information Top-line Growth Outsized Earnings Growth Structural changes, innovatio
Slide 111: Monetizing Investments through scale and efficiency
Investment Era 2020 2022 2024 2025 2026E 2021 2023 2030 Target $1.6B (25%) ~$3.5B (30-35%) Buyback $4.2B / 92% FCF 2023-2026E = 12% reduction in shares outstanding >2X © onsemi 2026 | Public Information Free cash flow more than doubling by 2030 Monetizing Investments through scale and efficiency
Slide 112: Monetizing Investments through scale and efficiency
2020 2022 2024 2025 2026E 2021 2023 2030 Target $1.6B (25%) ~$3.5B (30-35%) >2X Investment Era 2023-2026E: Share repurchase of $4.2B, 92% of FCF → 12% reduction in shares Free cash flow more than doubling by 2030 Monetizing Investments through scale and efficiency © onsemi 2026 | Public Information
Slide 113: Disciplined Capital Allocation: Reinvest
REINVEST Fund the highest-return growth Differentiated products, R&D and capacity investments that strengthen competitive advantage. © onsemi 2026 | Public Information Disciplined Capital Allocation Compounds Shareholder Value
Slide 114: Disciplined Capital Allocation: Strategic M&A
STRATEGIC M&A Expand the portfolio selectively Add capabilities to expand TAM and accelerate time to market. Clear strategic and financial merit enhancing the financial model. REINVEST Fund the highest-return growth Differentiated products, R&D and capacity investments that strengthen competitive ad
Slide 115: Disciplined Capital Allocation: Balance Sheet
BALANCESHEET Preserve resilience and flexibility Maintain strong liquidity and leverage profile. STRATEGIC M&A Expand the portfolio selectively Add capabilities to expand TAM and accelerate time to market. Clear strategic and financial merit enhancing the financial model. REINVEST Fund the highest-r
Slide 116: Disciplined Capital Allocation: Return Cash
RETURN CASH Repurchase shares consistently Return 100% of free cash flow through share repurchases. $5.3B remaining under the existing authorization. BALANCESHEET Preserve resilience and flexibility Maintain strong liquidity and leverage profile. STRATEGIC M&A Expand the portfolio selectively Add ca
Slide 117: Disciplined Capital Allocation Compounds Shareholder Value
RETURN CASH Repurchase shares consistently Return 100% of free cash flow through share repurchases. $5.3B remaining under the existing authorization. BALANCESHEET Preserve resilience and flexibility Maintain strong liquidity and leverage profile. STRATEGIC M&A Expand the portfolio selectively Add ca
Slide 118: Technology Leadership Powers Shareholder Value
Non-GAAP 2025A 2030 TARGET Revenue Gross Margin $6.0B 38.4% +12-14% CAGR 53% Growth driven by highly differentiated products in fast growing markets Utilization, high-value new products, and Fab Right Operating Expenses Operating Margin 19.8% 18.6% 15% 38% Targeted R&D investment to expand capabilit
Slide 119: Synaptics Accelerates Financial Model
Non-GAAP Synaptics Accelerates Financial Model Revenue Gross Margin $6.0B 38.4% +12-14% CAGR 53% Growth driven by highly differentiated products in fast growing markets Utilization, High-Value New Products, and Fab-Right Operating Margin 18.7% 38% Operating income grows >2x revenue growth $6.5B 40.3
Slide 120: Technology Leadership Powers Shareholder Value
Operating Expenses Operating Margin 19.8% 18.6% 15% 38% Targeted R&D investment to expand capabilities and TAM Operating income grows >2x revenue growth CapEx Free Cash Flow 5.7% 23.7% ~5% 30-35% CapEx-light model for optimal capital allocation Monetizing investments through scale and efficiency 18.
Slide 121: The Power of onsemi's Transformation: 2030 Target
2015–2020 2021–2026 8% 36% AVG GROSS MARGIN 43% REVENUE AVG FREE CASH FLOW MARGIN 18% 2030 Target 13% AVG OPERATING MARGIN 26% 53% GM 38% OM Accelerated growth, differentiated portfolio investments and Fab Right for gross margin expansion Leveraging past investments and capacity expansion support st
Slide 122: Market Inflection. Differentiated Capabilities. Shareholder Value Creation.
AI data center, automotive, industrial Higher compute power driving a shift to high-voltage architectures and greater onsemi content. Electrification, autonomy and SDV/zonal architectures sustain content growth above SAAR. AI Halo driving power semi demand; physical AI emerging as a new onsemi growt
Slide 123: Intelligent Technology. Better Future.
ONSEM!| Intelligent Technology. Better Future.
Slide 124: Market Inflection. Differentiated Capabilities. Shareholder Value Creation.
Market Inflection. Differentiated Capabilities. Shareholder Value Creation. © onsemi 2026 | Public Information
Slide 125: Thank you for joining us today
Thank you for joining us today. Your feedback is important to us. Please scan the QR code to complete a brief survey. © onsemi 2026 | Public Information
Slide 126: Slide 126
Slide 127: Appendix
APPENDIX onsemi. © onsemi 2026 | 127
Slide 128: Reconciliation of GAAP to Non-GAAP Gross Margin
Reconciliation of GAAP to Non-GAAP Gross Margin Fiscal Year FY 2021 FY 2022 FY 2023 FY 2024 FY 2025 GAAP Gross Margin 40.3% 49.0% 47.1% 45.4% 33.1% a) Impact of business wind down 0.0% 0.2% 0.0% 0.0% 0.0% b) Amortization of acquisition-related intangible assets 0.0% 0.1% 0.1% 0.1% 0.1% c) Non-recurr
Slide 129: Reconciliation of GAAP to Non-GAAP Operating Margin
Appendix – GAAP to Non-GAAP Reconciliation Reconciliation of GAAP to Non-GAAP Operating Margin Fiscal Year FY 2021 FY 2022 FY 2023 FY 2024 FY 2025 GAAP Operating Margin 19.1% 28.3% 30.8% 25.0% 1.4% a) Amortization of acquisition-related intangible assets 1.5% 1.0% 0.7% 0.8% 0.8% b) Restructuring, as
Slide 130: Reconciliation of GAAP to Non-GAAP Operating Expenses
Appendix – GAAP to Non-GAAP Reconciliation Reconciliation of GAAP to Non-GAAP Operating Expenses FY 2015 FY 2016 FY 2017 FY 2018 FY 2019 FY 2020 GAAP Operating Expenses $ 932.1 $ 1,060.8 $ 1,352.9 $ 1,391.5 $ 1,540.9 $ 1,367.1 a) Amortization of acquisition-related intangible assets (135.7) (104.8)
Slide 131: Reconciliation of GAAP to Non-GAAP Operating Expenses
Appendix – GAAP to Non-GAAP Reconciliation (in millions, except percentages) Reconciliation of GAAP to Non-GAAP Operating Expenses FY 2021 FY 2022 FY 2023 FY 2024 FY 2025 GAAP Operating Expenses $ 1,426.7 $ 1,717.2 $ 1,344.8 $ 1,448.4 $ 1,899.7 a) Amortization of acquisition-related intangible asset
Slide 132: Reconciliation of Operating Cash Flow to Free Cash Flow
Reconciliation of net cash provided by operating activities to free cash flow FY 2021 FY 2022 FY 2023 FY 2024 FY 2025 Net cash provided by operating activities $ 1,782.0 $ 2,633.1 $ 1,977.5 $ 1,906.4 $ 1,759.8 Purchase of property, plant & equipment $ (444.6) $ (1,005.0) $ (1,575.6) $ (694.0) $ (341
Slide 133: Notes and Sources
Notes and Sources Charting a Path to Power the Next Decade of Innovation Hassane El-Khoury, President and CEO $5.3B remaining under the existing authorization. As reported through Q2’2026 2026 estimates are based on consensus
Slide 134: Notes and Sources
GPU Rack Power (kW per Rack) vs Deployment Horizon Graph McKinsey & Company – The shift to 800-volt DC at data centers: Implications for providers, published July 2026 Cumulative New Data Center Power Consumption Graph Bank of America-Watts to Token, May 2026 AI DC TAM CAGRs UB, Bank of America, Cit
Slide 135: Notes and Sources
Notes and Sources Expanding the Core: Automotive and Industrial Sudhir Gopalswamy, Group President, Analog & Mixed-Signal and Intelligent Sensing Groups ~0% SAAR 2019-26, 2026-2030 Bloomberg Auto SAAR Factset 26E (0.39%) Physical AI: $6B TAM in 2030 onsemi estimates, Yole, Omdia projections for: Aut
Slide 136: Notes and Sources
What you are used to seeing (images) Maximize Market Research Pvt. Ltd Deloitte and Mordor Intelligence KBV Research Yole Sustainable Ecosystem ‘22-’27 TAM CAGRs onsemi estimates LMC Automotive: Global Hybrid & Electric Vehicle Forecast - Quarter 4, 2022 Omdia: Power IC Market Tracker, Sep’22 Sustai
Slide 137: Cautionary Information: No Offer or Solicitation
Cautionary Information No Offer or Solicitation This communication is for informational purposes only and does not constitute, or form a part of, an offer to buy or sell or the solicitation of an offer to buy or sell any securities, or a solicitation of any vote or approval, nor shall there be any s
Slide 138: Cautionary Information: Participants in the Solicitation
Cautionary Information Participants in the Solicitation Synaptics, onsemi, and certain of their respective directors, executive officers and other members of management and employees, under SEC rules may be deemed to be participants in the solicitation of proxies from Synaptics stockholders in conne