Kulicke And Soffa Industries, Inc. · NASDAQ:KLIC
Kulicke And Soffa Industries — Technical Presentation (November 2001)
5 slides from Kulicke And Soffa Industries's technical presentation, November 2001
Slide 1: Contour Motions: 2-28 software second-bond process control enhancement
Contour Motions 2-28 S/W includes “Contour Motions” a major new 2nd-bond process control enhancement Benefits to all “standard”(free) and “premium” processes! (Available on 8028 and MAXµm) LF2 Allows loops to be formed with less wire down (2nd bond sag) at second bond requiring less complex motions.
Slide 2: LF2 Extended Capability
Contour Motions Contour Motions LF2 Extended Capability The parameter limits for LF2 in Contour Motions have been extended. The extended parameters, -1 to -20 may allow an increase in the throttle (LF4) in some applications. LF2 = 20 LF2 = 0 LF2 = -20 The original range for this parameter was 0 – 20
Slide 3: Step Approach Capability
Contour Motions Step Approach Capability Step Approach Approach Method = 1 New Parameters Approach Method Controls the approach method used during bonding: 0- Standard Contact Angle/Contact Offset (Default) 1- New Step Approach XY Step Sets the lateral (XY) pullout distance (in mills) Z Step Step Ap
Slide 4: Height Control Capability
Contour Motions Height Control Capability Up-bond New Parameters Loop Configuration Height Control Used to enable/disable the feature 0- Turns Up-bond Off (Default) 1- Turns Up-bond On Height Target Defines the average bond height difference between 1st and 2nd bonds (Default = 0.0 mils). Height Bal
Slide 5: Independent Directional Balance
Contour Motions Independent Directional Balance New Parameters Overbend Scale Used to adjust the amount of additional wire shaping to apply at the Flat Length during looping formation. Default 100% Range 0% - 200% Balance Mode Used to control the balance method used during loop formation. 0- X/Y Bal
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