Malaysian Pacific Industries Bhd. · MYX:MPI

Malaysian Pacific Industries Bhd — Q4 FY2026 Earnings Presentation

61 slides from Malaysian Pacific Industries Bhd's earnings presentation, August 2026

  1. Slide 1: Malaysian Pacific Industries Berhad Investor Presentation Q4 FY2026

    1 M A L A Y S I A N P A C I F I C I N D U S T R I E S B E R H A D I N V E S T O R P R E S E N T A T I O N Q 4 F Y 2 0 2 6 ( A p r - J u n ‘ 2 6 ) INVESTOR RELATIONS CONTACT Kaushal Mathur +60320809283 extn 89283 kaushal.mathur@carsem.com Malaysian Pacific Industries Berhad

  2. Slide 2: Disclaimer

    2 DISCLAIMER Malaysian Pacific Industries (MPI) provides access to this presentation for general reference only. This presentation is strictly confidential solely intended for communicating financials and may not be reproduced or circulated without MPI’s prior consent. If you are the recipient of th

  3. Slide 3: Table of Content

    1 3 TABLE OF INTRODUCTION CONTENT 2 CORPORATE OVERVIEW 3 BUSINESS OVERVIEW 4 SUSTAINABILITY 5 GROWTH DRIVERS 6 FINANCIALS & SUMMARY

  4. Slide 4: Introducing Hong Leong and MPI

    4 Introducing Hong Leong and MPI MPI is part of Hong Leong Manufacturing Group Hong Leong’s diverse global businesses Malaysian Pacific Industries Berhad

  5. Slide 5: Financial performance snapshot

    5 Financial performance snapshot FY26: Sustaining profitability amid headwinds Revenue (RM million) PAT growth (%) Debt 2,650 25% ZERO FY26 FY26 vs. FY25 as of 30-Jun-26 CAPEX (RM million) EBITDA (%) Net cash (RM million) 573 22% 531 FY26 FY26 as of 30-Jun-26 Note: FY26 = July 2025 – June 2026 Malay

  6. Slide 6: Table of Content

    1 6 TABLE OF INTRODUCTION CONTENT 2 CORPORATE OVERVIEW 3 BUSINESS OVERVIEW 4 SUSTAINABILITY 5 GROWTH DRIVERS 6 FINANCIALS & SUMMARY

  7. Slide 7: Journey & capabilities

    7 Our journey JOURNEY & CAPABILITIES 50+ years in semiconductor assembly & test Carsem Bangkok Carsem Suxiang Power Management 5G, 5G Test Memory – NOR, NAND - CuClip Technology for Cloud Server Farms RF – Smartphone Thin & Multi-Die WBG facility Sensors TVS SiC tech SiC, GaN, modules MLP – Small &

  8. Slide 8: Management team

    8 Management team Several years of deep consolidated experience in the industry Manuel Zarauza GROUP MANAGING DIRECTOR, MPI Over 25 years of manufacturing sector experience; Previously with Siemens, Osram Opto Semiconductors, and Seoul Semiconductor Prof. Ts. Dr. AJayandaran Lau Ping Ong Inderjeet S

  9. Slide 9: Table of Content

    1 9 TABLE OF INTRODUCTION CONTENT 2 CORPORATE OVERVIEW 3 BUSINESS OVERVIEW 4 SUSTAINABILITY 5 GROWTH DRIVERS 6 FINANCIALS & SUMMARY

  10. Slide 10: Supply chain & business model

    10 Supply chain & business model Carsem’s packaging & test services form a vital part of semiconductor value chain IC backend Boxing/ PCB manu- SMT SMT End Mask IC frontend production module/ System design IC Design facturing Assembly Assembly customer production production (Assembly & system (bareb

  11. Slide 11: Wide portfolio

    11 Wide portfolio COMPREHENSIVE TURNKEY PACKAGING & TEST SERVICES CAPABILITY STACK ACROSS KEY APPLICATIONS SENSORS Automotive POWER/ DRIVERS System in Quad Flat Package MLP Small Outline IC Package (SiP) (QFP) CPU Industrial (inc. AI) Power Management (SiC, GaN, GaN on SiC) TIMING Transient Voltage

  12. Slide 12: Geographic footprint

    12 Geographic footprint Broad geographic presence, serving a global customer base CARSEM SUXIANG, CHINA CARSEM NORTH AMERICA CARSEM S. KOREA CARSEM SUZHOU, CHINA CARSEM JAPAN CARSEM TAIWAN CARSEM BANGKOK, THAILAND CARSEM IPOH, MALAYSIA Wide bandgap S-site M-site (SiC/ GaN) LEGEND Manufacturing plant

  13. Slide 13: Production facilities

    13 Production facilities 6 strategically located manufacturing sites - Malaysia · China · Thailand MY MY MY Carsem S-Site, Ipoh, Malaysia Carsem M-Site, Ipoh, Malaysia Carsem Wideband Gap (WBG), Ipoh, Malaysia Floor Space: 640K sq. ft. (60,000 sq. m.) Floor Space: 436K sq. ft. (40,500 sq. m.) Floor

  14. Slide 14: Table of Content

    1 14 TABLE OF INTRODUCTION CONTENT 2 CORPORATE OVERVIEW 3 BUSINESS OVERVIEW 4 SUSTAINABILITY 5 GROWTH DRIVERS 6 FINANCIALS & SUMMARY

  15. Slide 15: Sustainability performance

    15 Sustainability performance MPI is a reliable and recognized brand for sustainable business practices for FIVE successive years Top ESG ratings Diverse and inclusive organisation >9,000 workforce Gender diversity In top band of ESG ~47% ~53% ratings amongst all Leader in sustainability Bursa PLCs

  16. Slide 16: Environment

    16 Environment Continuously identifying and implementing opportunities to optimize our GHG emissions, and energy consumption Installation of solar photovoltaic (PV) system at Carsem Malaysia and Carsem Suxiang building rooftops Deployed EV forklifts Malaysian Pacific Industries Berhad

  17. Slide 17: Training & education

    17 Training & education Training and upskilling are among our topmost strategic priorities Quality Day – Quality Awareness Training 5S Internal Auditor Training ISO37001 Upgrade Training Information security Training OpenClaw AI Training Construction management system Training Malaysian Pacific Indu

  18. Slide 18: Training & education

    18 Training & education Training and upskilling are among our topmost strategic priorities InfluxDB & Grafana for Developers training Failure Mode & Effects Analysis Training Six Sigma Green Belt Training Firefighting Training Performance Management Training Akademi Dalam Industri (ADi) Malaysian Pa

  19. Slide 19: Training & education

    19 Training & education Training and upskilling are among our topmost strategic priorities Anti-bribery and Code of Conduct Training Malaysian Pacific Industries Berhad

  20. Slide 20: Employee relations

    20 Employee relations Employee engagement and CSR activities Blood Donation Songkran Festival (Thai New Year) Carsem Bangkok Operations (Donation service from hospital) Monthly Birthday Malaysian Pacific Industries Berhad

  21. Slide 21: Anti-bribery & anti-corruption

    21 Anti-bribery & anti-corruption Leading ethically and transparently Carsem Suzhou and Carsem Suxiang achieved ISO 37001:2025 ABMS certification Malaysian Pacific Industries Berhad

  22. Slide 22: Responsible business practices

    22 Responsible business practices Conformance with RBA Carsem (M) Sdn Bhd achieved both the RBA Validated Assessment Program (VAP) Recognition Certificate (Gold) and VAP Recognition Certificate (Platinum) Malaysian Pacific Industries Berhad

  23. Slide 23: Table of Content

    1 23 TABLE OF INTRODUCTION CONTENT 2 CORPORATE OVERVIEW 3 BUSINESS OVERVIEW 4 SUSTAINABILITY 5 GROWTH DRIVERS 6 FINANCIALS & SUMMARY

  24. Slide 24: Market outlook

    24 Market outlook The semiconductor industry just posted its fastest growth in 40 years Q2 2026 GLOBAL CHIP SALES US$403.3bn +35.1% QoQ - highest quarterly growth in 40+ years of WSTS statistics JUNE 2026 (YoY) +123.6% Monthly sales reached US$134.5bn, up from US$60.2bn a year earlier FULL-YEAR 2026

  25. Slide 25: Market outlook

    25 Market outlook AI capex supercycle is accelerating into 2027, and capex is converting with rising cloud/ AI revenue, fast growing order backlogs, and profits Hyperscalers’ Capex (US$ billion) Spend is monetizing, not just building capacity +82% YoY Google Cloud revenue accelerated to $24.8B in Q2

  26. Slide 26: Market outlook

    26 Market outlook Automotive demand is stabilizing across the US, EU and Japan, while China's domestic softness is being offset by a record export surge EU Japan US China Supportive of MPI's automotive segment demand visibility Source: Research publications, Media Malaysian Pacific Industries Berhad

  27. Slide 27: Market outlook

    27 Market outlook Rising backlog, accelerating bookings, and growing design wins – voice of Carsem’s strategic customer base Customer 1 Customer 2 Customer 3 1The total amount of orders received regardless of their current status Source: Customer disclosures Malaysian Pacific Industries Berhad

  28. Slide 28: Market outlook

    28 Market outlook Meanwhile, Humanoids: market is starting to take shape - early signals Source: Media Malaysian Pacific Industries Berhad

  29. Slide 29: Impact of Forex and input costs

    29 Impact of Forex and input costs Resilient performance amid elevated costs and global turbulence FX: MYR strength High levels of raw material prices Avg. exchange rate, USD-MYR, Jan-24 – Aug-26 Gold price avg., per troy ounce, Aug-22 – Jul-26 Source: DOSM, CNBC, Gold Hub Malaysian Pacific Industri

  30. Slide 30: Growth strategy

    30 Growth strategy Our long term vision is to be the leading OSAT for automotive and AI, driven by 4 strategy tenets Sales Technology • Strategic sales across application & geography • Investing in wide band gap tech (SiC, GaN), power • Strategic acquisitions packages, custom sensors for auto, AI, 5

  31. Slide 31: Sales – Profitable growth focus

    31 Sales – Profitable growth focus MPI continues to deliver outstanding YoY profitable growth Revenue (USD mil) PATAMI (RM mil) +33% +22% Note: FY25 = Jul ‘24 to Jun ’25; FY26 = Jul ‘25 to Jun ’26 Malaysian Pacific Industries Berhad

  32. Slide 32: Sales – Revenue composition

    32 Sales – Revenue composition AI doubles (YoY), Automotive holds steady - powering 40% YoY revenue growth in Q4 FY26 AUTOMOTIVE CONSUMER & COMMUNICATIONS • 5G and IoT are unlocking multitude of use • Automotive sector stabilizing cases – smart cities, healthcare, etc. • Long term growth is driven b

  33. Slide 33: Sales – Future growth focus

    33 Sales – Future growth focus Actively pursuing viable M&A opportunities to accelerate technology leadership and move up the value chain Exploring viable options, especially in EU, US and Mexico Advanced packaging. e.g. power modules, Packaging/ IC design panel level packaging Specialized materials

  34. Slide 34: Technology – Automotive segment

    34 Technology – Automotive segment Innovating in line with strategy to be globally preferred OSAT partner for automotive Major trends impacting semiconductor demand (Mobility disruptions) Electrification Autonomy Connectivity Novel battery technologies, growth of electrical Surge in autonomous drivi

  35. Slide 35: Technology – Industrial segment

    35 Technology – Industrial segment Expanding portfolio aligned with trends in advanced packaging and testing for power semiconductors, esp. towards AI applications Major trends impacting semiconductor demand Industry 4.0 Big Data Higher performing devices with greater functionality driving models th

  36. Slide 36: Technology – Consumer/ communications segment

    36 Technology – Consumer/ communications segment Tapping into the next gen RF and IoT application revolution via robust custom offerings Major trends impacting semiconductor demand 5G IoT High data rates, massive connectivity and ultra-low latency, catalyzing Need for combining functionalities – sec

  37. Slide 37: Technology–Immediate focus

    37 Technology–Immediate focus VPD (Vertical Power Delivery) technology development for AI data-center application at Carsem Suzhou VPD – 9x10x5mm/ 9x10x8mm Package Key applications ~85% Reduction of PDN losses • VPD is applied in AI data centers, covering not only the core boards but also SMPS (Swit

  38. Slide 38: Technology–Immediate focus

    38 Technology–Immediate focus Single and Multi-Phase System in Package Technology Development for AI data-center application at Carsem S-Site 5x5.25x1.05mm/ 4x6x1.05 Package End applications • High-end mobile and wearable devices that requires small package footprints • High-performance computing fo

  39. Slide 39: Technology–Immediate focus

    39 Technology–Immediate focus MIS solution for QFN at Carsem S-Site New 5x6x0.65/ 8x8x0.92/ 3x5x0.65 mm² package FC QFN with Top Side Cooling End applications Key benefits • Multi-output power regulators, DC-DC converters, and advanced power • Superior electrical performance with low parasitic induc

  40. Slide 40: Technology–Immediate focus

    40 Technology–Immediate focus Cutting edge technology development across Automotive and Robotics Hydrogen fuel cell – gas sensor Air flow sensor for ICE vehicles Custom design and manufacturing by Carsem ✓ Custom developed air flow sensor micromodule; enables improvement in air-fuel mixing ratio, le

  41. Slide 41: Technology–Immediate focus

    41 Technology–Immediate Pressure Sensors For Automotivefocus Cutting edge technology development MOLD / PREMOLD PACKAGES (Hybrid) - Planning expansion of the capability readiness with SiP APPLICATION Lead frame Substrate Automotive under the hood and safety relevant Film assist molding Cavity fill K

  42. Slide 42: Technology–Immediate focus

    42 Technology–Immediate focus Cutting edge technology development TPMS Government mandates for TPMS • Regulators now treating TPMS data as frontline safety information. From Jul 2024, the EU General Safety Regulation II requires TPMS on every new Gel passenger car, bus, truck and trailer. South Amer

  43. Slide 43: Technology–Immediate focus

    43 Technology–Immediate focus sTOLL 1st successful CLIP MOSFET at Carsem Suzhou sTOLL- new 7x8 mm² Power MOSFET package Perfect choice for future automotive applications up to 250 A Key applications • 12V EPS / 12 VBLDC / 12-48V DC-DC End applications •Motor driving End Customer (Battery supplier) f

  44. Slide 44: Technology–Immediate focus

    44 Technology–Immediate focus ESSOP Cu Wire for automotive application at Carsem Suzhou ESSOP - new 3.9x4.9 mm² power MOS package Multiple dies with integrated MOS (Solder) and IC (Epoxy) Key applications • 5~65W Lighting / 10~100W Heater / 0~100W Pump / 0~200W Power End applications End Customer (H

  45. Slide 45: Technology – Immediate focus

    45 Technology – Immediate focus Exposed die technology development – AI & power applications Significant growth is projected for exposed die in AI server industry and power application Advantages: ✓Carsem Suzhou is developing exposed die technology with both Film assistant mold and grinding •Topside

  46. Slide 46: Technology – Immediate focus

    46 Technology – Immediate focus BGBM + Taiko Wafer B/G + CP (Chip/ Wafer Probe) One-Stop Service from Wafer Level Treatment BGBM & CP to ASSY & TEST  BGBM & CP Process Flow  Wafer Size Capability Process Taiko Non-taiko BG 8 inch 6/8/12 inch BM 6/8/12 inch 6/8/12 inch CP 8/12 inch 8/12 inch  Back

  47. Slide 47: Technology – Immediate focus

    47 Technology – Immediate focus 5G Testing 5G – Next Generation of mobile broadband Carsem Suzhou ✓ CSZ is working with 10+ customers for 5G device testing ✓ Completed 5G and Wifi7 RF test capability development, up to WiFi7 7.125GHz ✓ Continuing engagement with specialized customer for 5G FR2 (mmWa

  48. Slide 48: Technology – Future focus

    48 Technology – Future focus Satellite Communication Satellite Communication Growth Up Carsem Suzhou ✓ Continue to extend super high RF frequency up to 54 GHz Freq extension ✓ Coverage for mmWave applications: such as 5G, Satcom, Radar, and EW ✓ Engagement with specialized customer for satellite com

  49. Slide 49: Technology – Future focus

    49 Technology – Future focus Modules CARSEM SUZHOU Entirely new SMT Line 3D X - Ray C - Mold ✓ Invested in dedicated machines for FEM module line, capacity expansion for second line is ready in FY26 ✓ In production - regular & hybrid SiP package ✓ PAMiD module under development, expected to start pr

  50. Slide 50: Quality & productivity focus

    50 Quality & productivity focus AGV/robotics for automated cleanroom material handling & loading/unloading Wafer FOUP Robot AGV - Concept EOL Auto Load & Unload System and Magazine Stocker Magazine Robot AGV - Concept Malaysian Pacific Industries Berhad

  51. Slide 51: Awards and recognitions

    51 Awards and recognitions Quality, People and ESG BEST SUPPLIER AWARDS received RBA recognition MSOSH Gold Class 1 Award 2025 under the Manufacturing & Chemical RBA Validated Assessment Program, Sectors category — a recognition for Xing Hao Kang Xi Jie Hua Te GOLD and PLATINUM excellent OSH perform

  52. Slide 52: Table of Content

    1 52 TABLE OF INTRODUCTION CONTENT 2 CORPORATE OVERVIEW 3 BUSINESS OVERVIEW 4 SUSTAINABILITY 5 GROWTH DRIVERS 6 FINANCIALS & SUMMARY

  53. Slide 53: Financial highlights

    53 Financial highlights Consistently profitable, resilient through headwinds - MPI's FY26 story REVENUE Amidst market challenges, Q4 FY26 increased by ~40% YoY in USD terms compared to Q4 FY25 PAT Full year PAT in FY26 increased by 25% against FY25 CASH MPI retains a strong cash position while compl

  54. Slide 54: Key financials

    54 Key financials FY26: A Record Year - Revenue +24%, PAT +25%, dividend climbs up; sustained reinvesting for future FY26 FY25 YoY Q4 FY26 Q4 FY25 Q4 vs Q4 RM mil RM mil % RM mil RM mil % Revenue 2,649.7 2,131.0 24% 736.6 564.0 31% PAT 249.5 199.7 25% 61.2 52.7 16% PATAMI 188.0 153.8 22% 44.2 43.5 2

  55. Slide 55: Investments

    55 Investments Carsem investing today to capture future growth waves EBITDA & CAPEX (in RM million), MPI • Installing new machines for capacity expansion • Hire more people across the globe to support business operations & sales • Invest in Research & Development to deliver latest technology solutio

  56. Slide 56: Cash

    56 Cash Sound cash position enables expansion, advanced capability investments, and resilience through semiconductor cycles Net cash (RM million), MPI Bangkok acquisition + normal Capex + DCI land sale Malaysian Pacific Industries Berhad

  57. Slide 57: Statement of profit or loss

    57 Statement of profit or loss Q4FY26 Q4FY25 Changes RM '000 RM '000 % Revenue 736,637 564,017 31% Cost of sales (667,576) (504,833) 32% Gross profit 69,061 59,184 17% Operating expenses (25,189) (22,137) 14% Other operating income/(expenses) 14,373 6,788 112% Profit from operation 58,245 43,835 33%

  58. Slide 58: Statement of financial position

    58 Statement of financial position 30/06/2026 30/06/2025 RM'000 RM'000 Non-current assets Property, plant and equipment 1,924,483 1,297,074 Right-of-use assets 36,925 40,249 Investments 46 46 1,961,454 1,337,369 Current Assets Inventories 278,798 157,377 Trade and other receivables, including deriva

  59. Slide 59: Statement of financial position

    59 Statement of financial position 30/06/2026 30/06/2025 RM'000 RM'000 Equity Share Capital 352,373 352,373 Reserves 2,014,333 1,888,344 Treasury shares (160,858) (160,858) 2,205,848 2,079,859 Non-controlling interests 431,046 396,288 2,636,894 2,476,147 Non-current liabilities Borrowings 207,742 10

  60. Slide 60: Summary

    60 Summary Strong momentum across segments (AI, Automotive, Industrial, Energy, Humanoids, Consumer) - a diversified growth story, not just AI Outperforming amid market challenges: Q4 FY26 revenue up ~40% YoY (USD terms), extending a strong full-year FY26 (+33% YoY, USD terms) Profitability healthy

  61. Slide 61: Thank You

    61 Thank You Malaysian Pacific Industries Berhad

Malaysian Pacific Industries Berhad — Q4 FY2026 Earnings Presentation on 6ix