Asml Holding Nv · EURONEXT:ASML
Asml Holding Nv — Deutsche Bank Technology Conference 2010
16 slides from Asml Holding Nv's conference presentation, Sep 16, 2010
Slide 1: Deutsche Bank Technology Conference
Deutsche Bank Technology Conference Craig DeYoung, VP Investor Relations San Francisco, CA September 16, 2010
Slide 2: Safe Harbor
Safe Harbor "Safe Harbor" Statement under the US Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements, including statements made about our outlook, realization of backlog, IC unit demand, financial results, average selling pr
Slide 3: Agenda
Agenda General update ASML Business/Market Overview Outlook summary
Slide 4: General update & ASML
General up & ASML
Slide 5: General update
General update Short term: no change No customer has delayed shipment of any tool Meeting customer demand remains challenging Technology conversions continue in each sector Bit capacity grows while minimal wafer capacity added Medium term: the business may fluctuate Continued urgent demand for tools
Slide 6: ASML business/market overview
ASML business/market overview
Slide 7: Total net sales by quarter 2005-2010
2005 2006 2007 2008 2009 2010 Q1 685 629 949 919 183 742 Q2 763 942 930 844 277 1069 Q3 533 958 934 697 555 Q4 548 1053 955 494 581 2369 Total net sales M€ 2,529 3,582 3,768 Numbers have been rounded for readers' convenience. 2,954 1,596 Guidance: 2010 sales to grow 10 - 15% above historical peak of
Slide 8: Backlog: record value with 30% less units, ASP grows 60%+
Backlog: Record value with 30% less units, ASP grows 60%+ vs prior peak backlog, not creating "oversupply" Backlog Jan 04 Apr 04 Jul 04 Oct 04 Jan 05 Apr 05 Jul 05 Oct 05 Jan 06 Apr 06 Jul 06 Oct 06 Jan 07 Apr 07 Jul 07 Oct 07 Jan 08 Apr 08 Jul 08 Oct 08 Jan 09 4/9/2009 Jul 09 Oct 09 Jan 10 Apr 10 J
Slide 9: Market overview
Market overview Semiconductor unit growth back to historical trend, "catch up" capacity investments required in all sectors after a long period of slow capacity growth Share of new technology nodes in total semiconductor market accelerating as shrink continues to enable reduced chip cost and increas
Slide 10: Node transitions consume growing numbers of immersion tools
NAND 0 1 2 3 4 5 6 7 8 2008 2009 2010 2011 Immersion Exposures Snapshot based on average customer product mix (300mm) and layer stacks DRAM 0 1 2 3 4 5 6 7 8 2008 2009 2010 2011 Immersion Exposures LOGIC 0 1 2 3 4 5 6 7 8 2008 2009 2010 2011 Immersion Exposures MPU 0 2 4 6 8 10 12 14 2008 2009 2010
Slide 11: Technology transitions continue with capacity additions required in 2011
Technology transitions continue with capacity additions required in 2011 to meet forecasted demand* required in 2011 to meet forecasted demand* required in 2011 to meet forecasted demand* required in 2011 to meet forecasted demand* required in 2011 to meet forecasted demand* required in 2011 to meet
Slide 12: DRAM prices further weakened in August, still good margins
Source: DRAMeXchange (31/8/2010), ASML MCC DRAM prices further weakened in August Still good margins for all DRAM manufacturers 300 mm cash-costs for 5x nm 1 Gb DRAM between 0.8 & 0.9 USD 300 mm cash-costs for 7x nm 1 Gb DRAM between 1.4 & 1.6 USD 300 mm cash-costs for 6x nm 1 Gb DRAM between 1.0 &
Slide 13: Technology Leadership - Reinforced
Technology Leadership - Reinforced Source: ASML Immersion Lithography: Installed Base >160 Systems leading performance on CD imaging uniformity well below 1 nm and overlay of less than 2 nm More than 20 NXT installed and producing 38 NXT systems in backlog end Q2 '10 EUV: - - 6 systems shipping thru
Slide 14: Outlook summary
Outlook summary
Slide 15: Outlook summary
Outlook summary Short term: no change Memory customers continue strategic node shrinks and planned capacity addition to meet long term memory demand As Foundry sector competition heats up; customers shrink to support growing leading edge demand and add capacity for future MPU sector prepares for 22n
Slide 16: Slide 16
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