Slide 1: Enhance a Voltage Regulator Module's Thermal Performance Using an Inductor with a Metal Band and 3D Packaging
IS17.4 - Enhance a Voltage Regulator Module’s Thermal Performance Using an Inductor with a Metal Band and 3D Packaging Xin Zhao, Sr. Power Module Design Engineer, Monolithic Power Systems Ao Sun, Application Engineer, Monolithic Power Systems George Stathakis, Sr. E-Commerce Marketing, Monolithic Po
Slide 2: Outline
Outline • Introduction & Background • Industry Voltage Regulator Module (VRM) solution Analysis • Innovative VRM Solution and Demonstration • Analysis of Benefits and Results • Conclusion 2
Slide 3: Introduction and Background – What's Driving Power Innovation?
Introduction and Background – What’s Driving Power Innovation? Cited source： https://www.aspsys.com/server-list/intel-s9200wk- server/ Cited source：https://www.supermicro.com/en Cited source： https://globemoving.net/blog/moving-fully-populated-server-racks-during-data- Cited source： center-relocatio
Slide 4: Current Industry V-core Solution Review
Introduction and Background- Current Industry V-core Solution Review The popular planar V-Core architecture with 5x6 DrMOS plus inductors and 8 phases Routing space is limited especially as HSIO (High Speed I/O) number keep increasing 4
Slide 5: Current Industry Vcore Solution Review
Introduction and Background – Current Industry Vcore Solution Review V-core scheme with single socket V-core scheme with dual socket With the same solution area for V-core, trade-off needs to be made between HSIO routing space and Power Delivery Network 5
Slide 6: Challenges and Needs for Innovative VRM Solutions
Introduction and Background- Challenges and Needs for Innovative VRM Solutions oltions • High power capability • High current capability with more phase count • Better transient performance • Better thermal performance • Better efficiency • Slimmer form factor for more on board space for more signal
Slide 7: 3D packaging architecture
Innovative VRM solution – 3D packaging architecture Inductor on Top DrMOS Module Substrate Motherboard With 3D packaging architecture, solution area for VRM can be significantly reduced 7
Slide 8: MPS' VRM solution with 3D packaging and enhanced thermal performance
Innovative VRM solution – MPS’ VRM solution with 3D packaging and enhanced thermal performance Inductor on Top DrMOS Module Substrate Motherboard The Cu Band on Inductor and Thermal Interface Material is applied to improve thermal performance of VRM in 3D package 8
Slide 9: Prototype and multiphase demonstration
Demonstration of Innovative VRM solution- Prototype and multiphase demonstration MPS’ VRM solution prototype MPS’ VRM solution in dual phase demonstration Ultra-slim footprint (12x4.4mm) and thermal design enable ease of use on system level design and better thermal performance 9
Slide 10: Integration for Ease of Use
Innovative VRM- Integration for Ease of Use Internal components • VDD decoupling capacitors (VDRV+VDD of DRMOS) • BST capacitors • Vin decoupling capacitors Integration of components optimizes decoupling performance, eases system level design and further reduces solution size 12
Slide 11: Integration for Ease of Use
Innovative VRM- Integration for Ease of Use OUT GND VIN Solution with Caps on Top layer Solution with Caps on Bottom layer Ultra slim module footprint for significant solution size reduction Pin out for ease of use with optimized decoupling loop for both Vin and OUT 13
Slide 12: Reduces Solution Size Significantly
Innovative VRM on System-Level Application- Reduces Solution Size Significantly Discrete solution with 5x6mm DrMOS Discrete solution with 3x6mm DrMOS MPS’ Innovative VRM solution The Ultra-slim VRM solution requires much less space for system level board design 14
Slide 13: VRM Solution Efficiency in Typical Applications
Innovative VRM Solution Efficiency in Typical Applications • The proposed ultra-slim VRM in single phase operation 12Vin, 1.8Vout, 1MHz 12Vin, 0.8Vout, 500kHz 94 92 92 90 90 88 88 86 86 84 84 12Vin_0.8Vout_500kHz_With TIM 82 12Vin_1.8Vout_1MHz_Module 82 80 80 0 5 10 15 20 25 30 35 40 0 5 10 15 20 25
Slide 14: VRM Solution Efficiency in Typical Applications
Innovative VRM Solution Efficiency in Typical Applications • The proposed ultra-slim VRM in dual phase operation 12Vin, 1.8Vout, 1MHz, 2 Phase 12Vin, 0.8Vout, 500kHz, 2 Phase 94% 92% 91% 93% 90% 92% 89% 91% 88% 87% 90% 86% 89% 85% 88% 84% 83% 87% 82% 86% 81% 85% 80% 0 10 20 30 40 50 60 70 80 0 10 20
Slide 15: Enhanced Thermal Performance
Innovative VRM – Enhanced Thermal Performance • Significant reduction in junction temperature Simulation Boundary Conditions • 400CFM air flow is defined on the surface • 32m/s speed based on the defined area • Loss estimation based on 12Vin, 1.8Vout, 30A • Die, 2.4W • Inductor, 0.8W • A equivalent
Slide 16: Enhanced Thermal Performance
Innovative VRM- Enhanced Thermal Performance • Metal band design with TIM as heatsink Traditional L-on-Top design MPS’ Innovative VRM solution Tmax,L = 68.8oC Tmax,L = 70.6oC Cu band on Inductor greatly contributes heat transfer from IC to ambient 16
Slide 17: Enhanced Thermal Performance
Innovative VRM- Enhanced Thermal Performance • Bench verification on different TIMs for enhanced thermal performance Junction Temperature Rise with Different Thermal Interface Conditions Test condition, Forced Air Cooling, 190CFM 120 12Vin, 0.8Vout, 500kHz, 40A 100.3 12Vin, 1.8Vout, 1MHz, 40A 100 89
Slide 18: Conclusion
Conclusion • An innovative VRM solution is introduced with ultra-slim form factor and enhanced thermal performance • 3D Packaging with Cu band on inductor, and thermal interface material filled in the gap between Cu band and DrMOS IC, which significantly reduced the junction temperature of module •
Slide 19: Q&A Thanks
APC. Q&A Thanks