Ventec International Group Co., Ltd. · TWSE:6672

Ventec International — Investor Presentation (July 2017)

32 slides from Ventec International's investor presentation, Jul 10, 2017

  1. Slide 1: Option Technologies

    Option Technologies Ventec International Group Offshore Masslam Solutions From Prototype To Volume Drilled Masslam from Taiwan Version: 10/07/2017

  2. Slide 2: Manufacturing Capabilities

    Manufacturing Capabilities Capabilities Maximum Layer Count 34 Maximum Panel Size 760 x 610mm / 30” x 24” (Circuit Size: 710 x 558mm / 28" x 22") Minimum Panel Size 381 x 330mm / 15" x 13" Minimum Line and Space 2.5mil / 63μm Minimum Core Thickness 2mil / 50μm Finished Panel Thickness Min - 0.4mm -

  3. Slide 3: Quality and Approvals

    Quality and Approvals • ISO-9001 • ISO-14001 • UL • QA reports generated with all jobs • All inner-layers are 100% AOI • SPC is implemented throughout the manufacturing operation • Individual processes demonstrate detailed QA procedures • A detailed “Skills Matrix” is displayed in all departments Ve

  4. Slide 4: Planning Engineering in the UK

    Planning Engineering in the UK Polar Instruments Speedstack Software for precise build & impedance calculations Version: 10/07/2017

  5. Slide 5: CAM Department

    CAM Department Genesis & ParCam Software. Department runs 24-hrs per day 7 days a week, average throughputs 10 new parts per day. Data receiving from Option – TW CAM add etch compensation & apply scaling factors to data. Version: 10/07/2017

  6. Slide 6: Photography

    Photography Orbotech LP 9008 Photoplotter 8000DPI. Artwork inspection & Measuring. Artwork punching. Cleanroom garments are worn in this department Version: 10/07/2017

  7. Slide 7: Chemical Clean

    Chemical Clean Sulphuric Peroxide solution. Four stage cascade rinses with extensive drying section. Etch rate 0.6µm, etch rate samples are conducted every shift. Version: 10/07/2017

  8. Slide 8: Photomech – Dry Film Lamination

    Photomech – Dry Film Lamination Automatic cut sheet laminator with thin core capability. Pre-heat & hold station. Eternal dry film 20µm. Class 10,000 cleanroom. Version: 10/07/2017

  9. Slide 9: Photomech – Imaging (Bacher)

    Photomech – Imaging (Bacher) Fully automated Exposure unit throughput 130 panels per hour. Camera aligned registration accuracy < 15µm. Version: 10/07/2017

  10. Slide 10: Photomech – Imaging (ORC)

    Photomech – Imaging (ORC) Fully automated Exposure unit maximum throughput 135 per hour. Camera aligned registration accuracy < 15µm. Automated with load & unloading equipment. Version: 10/07/2017

  11. Slide 11: Photomech Imaging (Orbotech)

    Photomech Imaging (Orbotech) LDI for inner layers with tight registration features such as micro BGA’s and spaces <2.5 mil Version: 10/07/2017

  12. Slide 12: Develop Etch & Strip

    Develop Etch & Strip Cupric Etch solution. Average track width reduction is approximately 15%. All inner-layers are interleaved as they exit the stripper. First article inspection is conducted and repeated after every 50 panels. Version: 10/07/2017

  13. Slide 13: First Article Inspection

    First Article Inspection “First off” procedure at AOI, the inner-layer is measured for dimensional stability in X & Y, Line widths are checked for impedance using the Mach-vision gauge, Average line width reduction 15%. Version: 10/07/2017

  14. Slide 14: AOI Process Orbotech & Screen P18000

    AOI Process Orbotech & Screen P18000 A total of 7 AOI machines, 7 offline verification stations. Orbotech Discovery 8 is pictured below with load & unload facility. Inner layers are scanned, barcoded, interleaved and then sent for fault verification. Version: 10/07/2017

  15. Slide 15: AOI

    AOI All inner-layers are cleaned prior to AOI with a tacky roller. AOI machine is a P18000 Screen from Japan, minimum line width detection capability is 35µm. Version: 10/07/2017

  16. Slide 16: AOI Fault Verification

    AOI Fault Verification Inner-layers with faults are verified and repaired offline, all repairs are interleaved and re-scanned through AOI. Version: 10/07/2017

  17. Slide 17: Alternative Oxide

    Alternative Oxide Three converyorised lines, line speed 3 metres/minute. Cobra Bond Chemistry, Etch rate 1.5µm +/-0.3µm, cores interleaved before and after processing, exotic materials are baked at 120°C prior to lay up. Version: 10/07/2017

  18. Slide 18: Build Up

    Build Up All inner-layers are visually inspected at build up, layers are built up with small rivets and flattened, all multilayers are then 100% inspected on the x-ray machine, any panels showing mis-registration will be rejected, all operators wear cleanroom garments. Version: 10/07/2017

  19. Slide 19: Lay Up Stations

    Lay Up Stations All panels are built on large format stainless steel plates, panels are built free with oversize foil, for example a 24” x 21” panel would be built four panels per page. Version: 10/07/2017

  20. Slide 20: Presses & Press Capacity

    Presses & Press Capacity Large format presses with auto-load & unload facility, five presses all with 8-openings, capacity is 5,000 panels per day based on a 24 x 18" 1.6mm panel, 320 panels per press load. Version: 10/07/2017

  21. Slide 21: Presses Controls

    Presses Controls All presses have chart recorders for each individual press and platen, the data is available from each press cycle recording both platen & product temperature Buffering used is 140 gsm kraft paper this is not reused. Version: 10/07/2017

  22. Slide 22: Breakdown / De-stack

    Breakdown / De-stack Panels are trimmed down and then interleaved with a soft material, After each press cycle all press plates are then cleaned through the brushing machine. Version: 10/07/2017

  23. Slide 23: X-ray Drilling

    X-ray Drilling Four X-ray drill machines, one Seiko and three ADT. All four machines optimise in both X & Y. All panels are interleaved before and after drilling. Version: 10/07/2017

  24. Slide 24: Routing

    Routing Three route machines all with three spindles. Programs all ensure radius corners. Typical stack height is 5 high for a 1.6mm panel. Version: 10/07/2017

  25. Slide 25: Edge Milling

    Edge Milling All panels are edge milled, four individual “v” blades for cutting each edge, maximum panel thickness for edge milling is 3.2mm. Version: 10/07/2017

  26. Slide 26: Bonding Inspection

    Bonding Inspection All panels are 100% inspected for surface defects including pits, dents, resin spots or creases. A thickness check is also performed using deep throat micrometer. Tooling holes diameters are verified using a plug gauge. Outer copper is verified using a copper scope. All panels are

  27. Slide 27: Drilling

    Drilling 360 drill spindles, capacity is 15,000 panels per day. Process runs 24-hrs per day 7 days per week. Version: 10/07/2017

  28. Slide 28: Hitachi Multi-spindle Machines

    Hitachi Multi-spindle Machines Mechanical drilling minimum hole size 0.15mm Version: 10/07/2017

  29. Slide 29: Drilling

    Drilling A first off x-ray inspection is carried out prior to batch processing, for batch inspection the bottom panel off each stack is x-ray inspected. Version: 10/07/2017

  30. Slide 30: Spindle Accuracy Check

    Spindle Accuracy Check All spindles are checked for accuracy twice per week. Reports are available for drill accuracy, hole positional checks are verified by AOI inspection. Version: 10/07/2017

  31. Slide 31: Hole Checking

    Hole Checking After drilling all panels are processed through a high pressure rinse and then inspected through the automatic hole inspector, for missing/blocked holes. Version: 10/07/2017

  32. Slide 32: Option Technologies

    Option Technologies Ventec International Group Offshore Masslam Solutions From Prototype to Volume Version: 10/07/2017

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