Asml Holding Nv · EURONEXT:ASML
Asml Holding Nv — Investor Day (September 2021)
29 slides from Asml Holding Nv's investor day presentation, Sep 29, 2021
Slide 1: Applications Products and Business Opportunity
Applications Products and Business Opportunity Jim Koonmen Executive Vice President Business Line Applications Public
Slide 2: Applications products and business opportunity: key messages
Applications products and business opportunity Key messages Slide 2 29 Sept. 2021 The Applications business is projected to grow at ~20% CAGR with strong gross margins over the period 2020 through 2025 The Applications product portfolio supports the ASML scanner business, driven by our unique capabi
Slide 3: Markets and product roadmap
• Markets and product roadmap Holistic lithography Driving improvements in EPE E-beam inspection Public
Slide 4: Growth opportunities in Applications arise from technology shifts in key market segments
Growth opportunities in Applications arise from technology shifts in key market segments Slide 4 29 Sept. 2021 Industry driver Technology shifts Resolution Throughput HighResolution Single Beam / Optical → Multibeam Inspection Parts per billion failure measurements Optical Overlay: Image-based to Ac
Slide 5: Metrology, Inspection & Patterning Control Roadmap
Metrology, Inspection & Patterning Control Roadmap Slide 5 29 Sept. 2021 Platform Application 2020 2021 2022 2023 2024 ≥ 2025 Scanner Interfaces Scanner Increasing Scanner Actuation (DUV and EUV), EPE Control and Control Software(Overlay Optimizer) Control (Imaging Optimizer) Overlay Metrology Align
Slide 6: Holistic lithography
Markets and product roadmap • Holistic lithography Driving improvements in EPE E-beam inspection Public
Slide 7: Our holistic portfolio is more important than ever
Our holistic portfolio is more important than ever Slide 7 Lithography scanner with 29 Sept. 2021 advanced control capability EUV: NXE and DUV: XT and Etch and EXE platforms NXT platforms deposition tools Process window Process window Prediction and Control Enhancement Overlay Optical proximity corr
Slide 8: Our holistic portfolio is more important than ever
Our holistic portfolio is more important than ever Slide 8 Lithography scanner with 29 Sept. 2021 advanced control capability EUV: NXE and DUV: XT and Etch and EXE platforms NXT platforms deposition tools Process window Process window Prediction and Control Enhancement Optical proximity correction Y
Slide 9: Our holistic portfolio is more important than ever
Our holistic portfolio is more important than ever Slide 9 Lithography scanner with 29 Sept. 2021 advanced control capability EUV: NXE and DUV: XT and Etch and EXE platforms NXT platforms deposition tools Process window Process window Prediction and Control Enhancement Optical proximity correction Y
Slide 10: All data available at every step in the flow
All data available at every step in the flow Use scanner metrology, YieldStar, HMI metrology and inspection to optimize Slide 10 29 Sept. 2021 sampling for scanner control, and as yield proxy for faster time-to-yield After-etch After-etch / CMP Computational After-litho After-etch Lithography Etch e
Slide 11: Driving improvements in EPE
Markets and product roadmap Holistic lithography • Driving improvements in EPE E-beam inspection Public
Slide 12: Reducing Edge Placement Error (EPE) is key to improve yield
Reducing Edge Placement Error (EPE) is key to improve yield Local CD errors, due to stochastics, become increasingly important Slide 12 29 Sept. 2021 250 nm Edge Placement Error (EPE): combined error of overlay and CD uniformity (global EPE is the best predictor of yield CDU, local CD errors and OPC
Slide 13: YieldStar overlay metrology – after litho and after etch
YieldStar overlay metrology – after litho and after etch Characterizing the process error and enabling accurate feature placement Slide 13 29 Sept. 2021 Optical overlay metrology – after Litho Optical overlay metrology – after Etch Litho Etch YS385 YS1385 Metrology Metrology Accurate overlay data Ac
Slide 14: Driving improvements in EPE scanner's correction capabilities
Driving improvements in EPE Requires high fidelity, fast and accurate metrology to maximize the Slide 14 29 Sept. 2021 scanner’s correction capabilities Metrology Monitoring Control Overlay YieldStar Layer B to Layer A Final Dual Layer EPE Pattern as designed >1,000 measurements/wafer <5 mins Single
Slide 15: ASML scanners to improve EPE and yield
ASML scanners to improve EPE and yield ASML scanners are uniquely able to find, measure and correct for Slide 15 29 Sept. 2021 patterning variations FlexRay illuminator Even Fingers Dose Odd Fingers Grey Filter Optical Centerline manipulator Y X Z Reticle stage Metrology stage Exposure stage 100% of
Slide 16: Tighter EPE requirements drive increased metrology
Tighter EPE requirements drive increased metrology ASML provides accurate, cost-effective overlay, EPE, and defect metrology Slide 16 29 Sept. 2021 Measurements per lot Overlay EPE Defects Billions EPE Requirement 14 Millions Measurements per lot 12 EPE requirement [nm] 10 Thousands 8 6 4 2015 2018
Slide 17: Need for part per billion control strategy
Need for part per billion control strategy Defect-aware monitoring and control in the age of EUV stochastics Slide 17 29 Sept. 2021 Today, server chips can be ~800mm2 in size Public
Slide 18: Need for part per billion control strategy
Need for part per billion control strategy Defect-aware monitoring and control in the age of EUV stochastics Slide 18 29 Sept. 2021 Missing contact hole: Finding defect in a haystack 1 mm 1 mm There can be >100M contact holes per mm2 and increasing by 1.5x per node Today, server chips can be ~800mm2
Slide 19: Need for part per billion control strategy
Need for part per billion control strategy Defect-aware monitoring and control in the age of EUV stochastics Slide 19 29 Sept. 2021 SEM image: example missing contact hole so ~80B of these need to function There can be >100M contact holes per mm2 and increasing by 1.5x per node Today, server chips c
Slide 20: E-beam inspection
Markets and product roadmap Holistic lithography Driving EPE improvements • E-beam inspection Public
Slide 21: High resolution E-beam versus Optical bright field inspection
High resolution E-beam versus Optical bright field inspection High resolution e-beam provides superior resolution to optical inspection, Slide 21 29 Sept. 2021 enabling detection of tiny pattern fidelity defects Customer design scaling Optical bright field E-beam capable of capturing part per billio
Slide 22: E-beam inspection has inherent resolution advantage
E-beam inspection has inherent resolution advantage Increasing throughput through increasing parallelism with multibeam Slide 22 29 Sept. 2021 1000000 Min defect size for 2 nm node and below 100000 Optical Bright Field Inspection 10000 1000 Gen 3 Multibeam (~2028) Throughput [mm²/hr] Increased 100 t
Slide 23: E-beam inspection: Voltage Contrast (VC) and physical defect
E-beam inspection: Voltage Contrast (VC) and physical defect Unique capability of electron beam inspection to find yield limiting defects Slide 23 29 Sept. 2021 VC inspection: detection of interlayer Physical inspection: detection of intralayer defects causing electric opens and shorts defects such
Slide 24: Multibeam addresses both VC and physical defect inspection
Multibeam addresses both VC and physical defect inspection Delivering cost-effective throughput gains at high resolution Slide 24 29 Sept. 2021 VC inspection: detection of interlayer Physical inspection: detection of intralayer defects causing electric opens and shorts defects such as design and pro
Slide 25: Multibeam leverages ASML core technologies
Multibeam leverages ASML core technologies Increasing e-beam inspection throughput for high-volume manufacturing Slide 25 29 Sept. 2021 P(-1,1) P(0,1) P(1,1) P(-1,0) P(0,0) P(1,0) P(-1,-1) P(0,-1) P(1,-1) Throughput 3 Brion’s computational technology: • Deep-learning-enabled image Single beam system
Slide 26: Multibeam: current status
Multibeam: current status Implementing learnings from eScan1000 (3x3) and driving eScan1100 Slide 26 29 Sept. 2021 (5x5) qualification for first shipment expected in Q4 2021 Key messages • Multibeam technology is challenging • We experienced some program delays: ended original development partnershi
Slide 27: Applications products and business opportunity: key messages
Applications products and business opportunity Key messages Slide 27 29 Sept. 2021 The Applications business is projected to grow at ~20% CAGR with strong gross margins over the period 2020 through 2025 The Applications product portfolio supports the ASML scanner business, driven by our unique capab
Slide 28: Forward Looking Statements
Forward Looking Statements Slide 28 29 Sept. 2021 This presentation contains statements that are forward-looking, including statements with respect to expected industry and business environment trends including expected growth, outlook and expected financial results, including expected net sales, gr
Slide 29: Public
Public