Synopsys, Inc. · NASDAQ:SNPS

Synopsys — Technical Presentation (2021)

23 slides from Synopsys's technical presentation, 2021

  1. Slide 1: Enablement, Evaluation and Extension of a CDM ESD Verification Tool for IC Level

    2021 EOS/ESD Symposium Enablement, Evaluation and Extension of a CDM ESD Verification Tool for IC Level Christian Russ1, Kai Esmark1, Patrick Huff1, Jens Schneider1, Gernot Langguth1, Lena Zeitlhöfler2, Meruzhan Cadjan3, Yuri Feinberg3 1Infineon Technologies AG, Neubiberg, Germany 2Technical Univers

  2. Slide 2: Purpose of this Work

    Purpose of this Work n To share experiences in enabling a CDM verification tool for IC design n To evaluate this tool for its capability to confirm a detected physical failure n To extend the methodology of the tool for treatment of CDM-relevant inductances n To match pin-specific CDM-levels between

  3. Slide 3: Outline

    Outline n Introduction n Setup of CDM Verification Tool n CDM Case Study: Bus Line Inductance n Extended Tool Methodology: Automated Inductance Extraction n Comparison of CDM Levels: Tool vs. Experiments n Conclusions

  4. Slide 4: Introduction (1): CDM Fails but no Explanation

    Introduction (1): CDM Fails but no Explanation… L n 3-Million-transistor design, 130nm technology n Multiple gate oxide failures observed at core RX soon above target CDM level (500V, 6A) n Signals to RX do not cross domain border: intra-domain 24 n ESRA-CDM: uncritical differences in electric poten

  5. Slide 5: Introduction (2): Intra-Domain Interface, Aggressor vs. Victim

    Introduction (2): Intra-Domain Interface, Aggressor vs. Victim common vdd common gnd V gndd1v5 gndd1v5 digital core V gndd gndd bus vddd3v3 vddd1v5 A A V A sclk io io io io io io io ss si io io io io io io io gndd bus X-direction 2600um 1725um 1225um 0

  6. Slide 6: Outline

    Outline n Introduction n Setup of CDM Verification Tool n CDM Case Study: Bus Line Inductance n Extended Tool Methodology: Automated Inductance Extraction n Comparison of CDM Levels: Tool vs. Experiments n Conclusions

  7. Slide 7: Setup and Principle of ESRA-CDM Tool

    Setup and Principle of ESRA-CDM Tool n Technology base info Domain 1 Domain 2 n Layout (LVS-clean) R n Parasitic resistance extraction Aggressor n (vf)TLP curves of ESD elements ESD Victim ESD Vgs,max? n Distribution of initial CDM Icdm charges according to layout area n Circuit simulation of the ES

  8. Slide 8: ESD Gate Oxide Limits for Victim Devices

    ESD Gate Oxide Limits for Victim Devices 9.0 n Characterization by TLP and Vbd, positive vfTLP for tp=100ns à 1ns 8.5 power law fit 8.0 margin to 3-sigma margin n Focus on Gate-Source and actual Gate-Drain limits: Vgd=Vgs 7.5 CDM fail n Details on measurement Vbd (V) 7.0 levels techniques: see full

  9. Slide 9: Outline

    Outline n Introduction n Setup of CDM Verification Tool n CDM Case Study: Bus Line Inductance n Extended Tool Methodology: Automated Inductance Extraction n Comparison of CDM Levels: Tool vs. Experiments n Conclusions

  10. Slide 10: CDM Case Study

    CDM Case Study 6 500V FFT amplitude (a.u.) FFT 4 à current (A) 2 0 -2 -4 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 1.0x108 1.0x109 1.0x1010 time (ns) frequency (Hz) n CDM center frequency around 1 GHz n Input parameter for inductive contribution of bus line

  11. Slide 11: CDM Case Study - Bus Line Inductance

    CDM Case Study - Bus Line Inductance Ansys HFSS simulation of VSS bus L ZR=0.24Ω/mm 10 ZL=2πfL=3Ω/mm Impedance (Ω/mm) Mtop d L=0.48nH/mm Mtop-1 W i ve 1 u ct n Ohmic resistance of top metals i nd t has decreased with technology ZL e ffec skin advancement 0.1 ZR resistive n Bus lines became narrower

  12. Slide 12: CDM Case Study - Bus Line Inductance

    CDM Case Study - Bus Line Inductance vf-TLP pad 2 pad 1 L R impedance of bus line ∆Vpeak=10V n Experimental demonstration of Voltage (V) impact of bus line inductance: n L=2mm n 600ps risetime pulse, 7A current n Inductive voltage peak ∆Vpeak=10V much larger than resistive voltage drop of 3V n Volta

  13. Slide 13: Outline

    Outline n Introduction n Setup of CDM Verification Tool n CDM Case Study ─ Bus Line Inductance ─ Modified Tool Setup n Extended Tool Methodology: Automated Inductance Extraction n Comparison of CDM Levels: Tool vs. Experiments n Conclusions

  14. Slide 14: Extended Methodology: Automated Inductance Extraction

    Extended Methodology: Automated Inductance Extraction n Inductance of straight conductor [Kalantarov]: l 𝜇(𝑙 2𝑙 1 𝐿= ln + 𝑓𝑜𝑟 𝑙 ≫ 𝑑, 𝑤 2π 𝑑+𝑤 2 n Implementation in ESRA-CDM to account for d w inductive effects in addition to ohmic effects nt * + 𝑉 * 𝑤𝑖𝑡ℎ 𝑉 rre 𝑉= 𝑉$') +,- $') =…

  15. Slide 15: Localization of Highly Inductive Regions

    Localization of Highly Inductive Regions vddd1v5 and gndd1v5 bridges from pad to core power density (W/um2) core mesh n Power density plot most effective way of displaying results n Bottleneck in metallization from pad ring to digital core mesh detected only by automated inductance extraction

  16. Slide 16: Tool Enhancements for Treatment of Inductance

    Tool Enhancements for Treatment of Inductance 24 map of electric potential in digital ground nets gndd and 22 gndd1v5, Icdm=7A, positive resistive 20 ) V (l only a it n e t 18 o inductive, p ci rt selected c e l regions digital core with 16 e gndd1v5 mesh victim aggressor ?VGND=11.8V 14 digital IOs

  17. Slide 17: Analysis of Intra-Domain Issue on Chip Level (2)

    Analysis of Intra-Domain Issue on Chip Level (2) 2.2A vddd3v3 L R Driver + vddd1v5 mesh ESD vddd1v5 0.7A 7A 3v3 1v5 buffer ESD ESD signal line Victim Aggressor 2.1A 2.4V Vg Icdm 0.6A s 2.0A 1.4A 9.4V 2.6A 4.8A gndd1v5 mesh 2.7A 3.2A package 2.4V gndd bus connection 0.2A 9.4V

  18. Slide 18: Outline

    Outline n Introduction n Setup of CDM Verification Tool n CDM Case Study: Bus Line Inductance n Extended Tool Methodology: Automated Inductance Extraction n Comparison of CDM Levels: Tool vs. Experiments n Conclusions

  19. Slide 19: Comparison of CDM Levels: Tool vs. Experiments

    B C Comparison D of CDM Levels: Tool vs. Experiments n i n i n i a a a m o m o m o n Pad-specific ESD robustness d d d example of discharge pad n Correlation CCTLP vs ESRA X-direction aggressor location Xa 0 CCTLP-experiment pin Xa (um) 4A 5A 6A 7A 8A 9A 10A 11A sclk 1182 pass pass pass pass pass n/

  20. Slide 20: Comparison of CDM Levels: Tool vs. Experiments

    Comparison of CDM Levels: Tool vs. Experiments n Correlation between failure current and 90% Vgs violation n Why 90%? ─ 0% = design limit of 6.0V ─ 90% above limit = 11.4V ─ Actual failure level > design limit ─ Voltage at victim: RC delays, top portion of voltage pulse contributes to actual gox bre

  21. Slide 21: Design Improvements

    Design Improvements n Small local metal straps between map of electric potential in ─ vddd1v5: bus ßà core mesh digital ground nets gndd and gndd1v5, Icdm=7A, positive ─ gndd1v5: bus ßà core mesh n Local interface protection at the receivers n Metal reinforcements: reduce inductance prevailing over

  22. Slide 22: Outline

    Outline n Introduction n Setup of CDM Verification Tool n CDM Case Study: Bus Line Inductance n Extended Tool Methodology: Automated Inductance Extraction n Comparison of CDM Levels: Tool vs. Experiments n Conclusions

  23. Slide 23: Conclusions

    Conclusions n CDM failure observed despite adherence of existing design rules n Gate oxide characterization down to nano-second range: careful relaxation of limits possible n Accounting for inductances in the layout: ─ Focus on inductances which are part of CDM discharge path ─ Several relevant loca

Synopsys — Technical Presentation (2021) on 6ix