Acm Research, Inc. · NASDAQ:ACMR
Acm Research — Investor Presentation (August 2025)
20 slides from Acm Research's investor presentation, August 2025
Slide 1: ACM Research, Inc. August 2025 Investor Presentation
ACM Research, Inc. August 2025 Investor Presentation 1
Slide 2: Disclosures
DISCLOSURES Forward-looking Statements. Certain statements contained in this presentation are not historical facts and may be forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Words such as “plans,” “expects,” “believes,” “anticipates,” “designed,
Slide 3: ACM Research at a Glance
ACM Research at a Glance • Multi-product supplier of semiconductor equipment Cleaning to leading global semiconductor manufacturers Flagship (SAPS, TEBO, Tahoe, Bevel Etch, SPM) Semi-critical • Differentiated technology improves customer production processes with better yields and reduced chemical c
Slide 4: Financial Highlights
Financial Highlights Total Revenue Product Mix Cleaning ECP, Furnace & Other $782 Advanced Packaging & Other 7% +49% $558 9% 19% $389 19% 10% $260 20% $157 73% 74% 70% 72% $108 FY22 FY23 FY24 FY19 FY20 FY21 FY22 FY23 FY24 $389M $558M $782M 1. Cleaning: Single wafer cleaning, Tahoe and semi-critical
Slide 5: History of Innovation and Customer Design Wins
History of Innovation and Customer Design Wins 4 evaluation agreements with Dr. Wang SK Hynix Launches SFP, major industry Launches Ultra establishes places first Opens 2nd Ships Tahoe & furnace and players, including a PmaxTM PECVD and ECP & Furnace Major ACM Research major Ships TEBO production fa
Slide 6: Global Semiconductor Capital Equipment Supplier
Global Semiconductor Capital Equipment Supplier ACM Research HQ Nasdaq: ACMR ACM Shanghai R&D and Manufacturing Center Europe Sales & Services Shanghai R&D Center (Zhangjiang) Hanguk ACM, ACM Korea Shanghai Asia-Pacific Manufacturing Center >200,000 ft2 (Chuansha) Research Institute & Manufacturing
Slide 7: Tier One Customer Base
Tier One Customer Base Back-End and Wafer Mfg Front-End Customers Customers • ACM 2024 Revenue %: 14% • ACM 2024 Revenue %: 12% • ACM 2024 Revenue %: 15% • Mainland China’s largest foundry • Major new entrant into NAND flash and DRAM • Leading advanced foundry in China industry • Tier-one customers
Slide 8: Innovative Product Introductions Expanding Serviceable Available Market
Innovative Product Introductions Expanding Serviceable Available Market (“SAM”)1 PECVD | $5.1B Introduced late 2022 Track | $2.9B Introduced late 2022 Estimated 2025 SAM of $20 billion addressed by 2020: Furnace, LPCVD, Furnace | $2.6B ACM Research’s current Vacuum Anneal, High- Temperature Oxidatio
Slide 9: Long-Term Target for $4B+ in Revenue
Long-Term Target for $4B+ in Revenue Advanced Packaging & Other Long-Term Target Composition > $4B* ECP, Furnace & Other ACM Research Cleaning Mainland China ACM Research SAM1 China SAM2 Share3 Revenue Cleaning $7.0B $2.4B 60% $1.45B ECP $1.4 $0.5 60% $298M Furnace $2.6 $0.9 15% $134 PECVD $5.1 $1.8
Slide 10: Growth Strategy
Growth Strategy Growth at Existing 111 111 New Products International Expansion New Capacity Customers • Continue winning share at existing • Expanding sales & services teams in • Shanghai Lingang production and R&D • Broad product portfolio covering 90%+ customers U.S., Europe, Korea and SE Asia ce
Slide 11: Q2 2025 Summary
Q2 2025 Summary Q2 2025 Financial Results • $215.4 million revenue (up 6.4% y/y); total shipments of $206.4 million (up 1.9% y/y) • 48.5% GAAP gross margin (versus 47.8% in Q2 2024) • 48.7% non-GAAP gross margin (versus 48.2% in Q2 2024) • $31.7 million GAAP operating income (down 15.7% y/y; 14.7% o
Slide 12: Q2 2025 Financial Results
Q2 2025 Financial Results Revenue Non-GAAP Gross Profit +6.4% +7.4% $215.4M $104.8M $202.5M $97.6M 48.2% 48.7% Q2‘24 Q2’25 Q2’24 Q2’25 EPS Balance Sheet Fi ni shed goods invent ory GAAP Non-GAAP Ending cash & cash equivalent s 1 $0.44 $0.55 $0.54 $498M $484M $367M $369M $442M $0.35 $279M $299M $293M
Slide 13: Q2 2025 Revenue Detail
Q2 2025 Revenue Detail Revenue by Product: Q2’25 vs Q2’24 Cleaning 6.4% • $155.0M revenue (up 1.1%) $215.4M $202.5M 6% Advanced Packaging & Other • Revenue mix 72% vs. 76% 5% 19% 22% ECP, Furnace & Other ECP, Furnace & Other • $48.0M revenue (up 23.2%) • Revenue mix 22% vs. 19% 76% 72% Cleaning Adva
Slide 14: Wafer Cleaning
Wafer Cleaning Flagship Cleaning Tools SAPS TEBO Ultra – C Tahoe Bevel Etch Single Wafer High Temp SPM Megasonic Cleaning for Bubble Oscillation Cleaning for Patterned Hybrid Wafer Cleaning With Significant Bevel Etching process for 3D NAND , Single High Temp SPM Cleaning for metal Flat and Patterne
Slide 15: Electroplating
Electroplating Ultra ECP ap Model Ultra ECP map Ultra ECP 3D Ultra ECP ap Ultra ECP GIII Ultra ECP ap-p (Cu-Ni-SnAg-Au) Pillar bump, Solder RF product Pillar bump, RDL Dual-damascene plating 3D/2.5D high aspect High-density Fan Out Application bump, RDL, Conformal 150mm wafer-level 510mmx515mm or (9
Slide 16: Vertical Furnace
Vertical Furnace Ox Ion Metal Mask Photo Exposure Develop Etch CVD ALD /Anneal Implantation Wire Furnace Tube Temperature Existing ACM In Film Type Process Classification Range Research Product Development Oxidation Wet oxygen/dry oxygen/nitrogen annealing 700~1200℃ ★ Normal Pressure Annealing Chemi
Slide 17: Advanced Packaging
Advanced Packaging Comprehensive solution for wafer and panel-level advanced packaging wet process Scrubber Coater Developer ECP SFP • Make use of ACM Research’s Cleaning Tape Frame Clean technology advantages to expand application in Asia, especially advanced packaging manufacturers in China • Dedi
Slide 18: Panel-level Packaging
Panel-level Packaging A comprehensive suite of wet processing and plating tools engineered for Panel-Level Packaging (PLP), supporting next-gen chiplet integration and advanced packaging nodes. Ultra C vac-p Flux Cleaning Ultra C bev-p Panel Bevel Etch & Clean Ultra ECP ap-p Horizontal Panel Plating
Slide 19: Track and PECVD
Track and PECVD Model Model Technical Features Offline/Inline Chamber Temperature Bake Range Development Phase ArF Model 23°C ±0.1°C 50~250°C Industry Evaluation ✓ Support 300mm wafers ✓ Four 12-inch load ports Inline ✓ 8 coating chambers Ultra LithTM Track ✓ 8 developing chambers Coater/Developer —
Slide 20: Q2 2025 GAAP to Non-GAAP Reconciliation
Q2 2025 GAAP TO NON-GAAP RECONCILIATION 20