Applied Materials, Inc. · NASDAQ:AMAT
Applied Materials — Technical Presentation (February 2025)
15 slides from Applied Materials's technical presentation, February 2025
Slide 1: SEMVision H20: Accelerating Defect Review
SEMVision H20 ACCELERATING DEFECT REVIEW February 2025
Slide 2: News Summary
News Summary ▪ Accelerating defect review for the "angstrom era" ▪ SEMVision H20 enables better and faster analysis of nanoscale defects in leading-edge chips ▪ Advancing the industry's most sensitive eBeam technology ▪ Second generation "cold field emission" technology delivers faster throughput at
Slide 3: Angstrom Era: Shrinking, More Complex Structures
Angstrom Era: Shrinking, More Complex Structures New Ways to Shrink New 3D Architectures N N+1 Advanced Planar FinFET GAA Nodes Smaller, more buried defects require nanometer resolution and depth imaging 3 | Applied Materials External
Slide 4: Process Control Flow: Optical Inspection and eBeam Review
Process Control Flow: Optical Inspection and eBeam Review Bin A Bin B Bin C Bin D Optical Inspection Defect Map eBeam Defect Review Defect Binning Control Chart Complementary Technologies light Optical provides faster speed at Resolution Speed lens lower resolution imaging Low High ~60° spot size ~1
Slide 5: Optical Inspection Limit Poses Angstrom Era Challenge
Optical Inspection Limit Poses Angstrom Era Challenge Defect Map Review and Binning Pattern roughness Manageable amount (~100) of defects Clear defect detection N, N+1 Pattern (top view) Difficult to differentiate Massive amount defects from non-defects, (~10k) of and accurately bin questionable “de
Slide 6: Optical Limitation Challenges Conventional Defect Review
Optical Limitation Challenges Conventional Defect Review Conventional eBeam defect review bins insufficient # of defects due to low sampling (100s of candidates) <0.5 hrs Defects Non-Defects Advanced Node Defect Map (~100k candidates from optical inspection) Need new technologies to review and bin m
Slide 7: Optical Limitation Challenges Conventional Defect Review
Optical Limitation Challenges Conventional Defect Review Conventional eBeam defect review bins insufficient # of defects due to low sampling (100s of candidates) <0.5 hrs Defects Non-Defects Conventional eBeam defect review takes hours to bin (with some uncertainty) due to high sampling (10,000s of
Slide 8: Introducing SEMVision H20 Defect Review and Analysis
Introducing SEMVision H20 Defect Review and Analysis 2nd generation CFE imaging and AI-based review technologies ✓ Sub-nm imaging resolution of smallest defects at high speed ✓ Boosting performance and productivity with AI-based review ✓ The industry’s benchmark for in-depth imaging of buried defect
Slide 9: SEMVision H20 Defect Review for Technology Inflections
SEMVision H20 Defect Review for Technology Inflections Gate-All-Around EUV Photoresist DRAM 50nm residue buried 250nm bridge 10nm particle defect top view top view top view 9 | Applied Materials External
Slide 10: Video available
Video available at https://www.youtube.com/watch?v=k_nE2taufD8 10 | Applied Materials External
Slide 11: Extending Capabilities with 2nd Generation CFE
Extending Capabilities with 2nd Generation CFE TFE CFE Gen 1 CFE Gen 2 Sub-nm resolution Better resolution at faster speed * Images with same scanning duration 11 | Applied Materials External
Slide 12: Introducing AI-based Review and Binning
Introducing AI-based Review and Binning - = Defect Grab Defects Non-Defects Reference Defect Grab Detection N, N+1 Low Sampling (100s of candidates) AI Defect Defects Non-Defects Advanced Nodes Defect Grab Detection Training Data High Sampling (10,000s of candidates) Image based Design based 12 | Ap
Slide 13: Training SEMVision's AI Model
Training SEMVision’s AI Model Design-based Image-based (optional) Training data Training data CAD-based annotated customer designs customer that are converted images that to simulated no- teach what is defect reference and what is images design simulated no-defect label label NOT a defect reference
Slide 14: SEMVision H20 Overcomes Optical Inspection Limit
SEMVision H20 Overcomes Optical Inspection Limit Conventional eBeam defect review bins insufficient # of defects due to low sampling (100s of candidates) <0.5 hrs Defects Non-Defects Conventional eBeam defect review takes hours to bin (with some uncertainty) due to high sampling (10,000s of candidat
Slide 15: News Summary
News Summary ▪ Accelerating defect review for the "angstrom era" ▪ SEMVision H20 enables better and faster analysis of nanoscale defects in leading-edge chips ▪ Advancing the industry's most sensitive eBeam technology ▪ Second generation "cold field emission" technology delivers faster throughput at
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