Elmos Semiconductor Se · XETR:ELG
Elmos Semiconductor — Investor Day (February 2026)
17 slides from Elmos Semiconductor's investor day presentation, Feb 24, 2026
Slide 1: Technology & Innovation
February 24, 2026 Technology & Innovation Jochen Vaihinger, CTO
Slide 2: R&D and Technology Power Sustained, Profitable Growth
R&D and Technology Power Sustained, Profitable Growth Scalable R&D Platform Delivering Customer Value, Execution Excellence and Differentiation High Product Value Strong Product Proven Innovation to Customers Roadmap Track Record Value Creation & Growth R&D Efficiency State-of-the-Art Global (up to
Slide 3: SDV Architecture Expands Elmos' Content and Value-Add
SDV Architecture Expands Elmos’ Content and Value-Add Share of Zonal E/E Architectures in New Cars Distributed ECU Domain Zonal Smarter Edge, Bigger Opportunity (as % of global car production) x global car production (in million units) ▪ The shift to central compute, zonal E/E and 48V is 74.9 92.9 9
Slide 4: R&D Pipeline to Dominate Existing Fields & New SDV Applications
Non-exhaustive | Selected examples R&D Pipeline to Dominate Existing Fields & New SDV Applications 2026 2027 2028 Key Takeaway USPA | Complex Device Driver Sensing for AUTOSAR Platform USPA | NextGen1 Sensor & USPA | NextGen2 Family Sensor & Ultrasonic: Continuous expansion of our sensor & USPA| Env
Slide 5: End-to-End Innovation across System, Architecture and IC Design
End-to-End Innovation across System, Architecture and IC Design Example 1 Example 2 Ultrasonic System Innovation Reinforces Quantum Randomness Establishes a Elmos’ ADAS Leadership Hardware Root of Trust for SDVs Example 3 Example 4 Smart eFuse Controllers Enable Zonal Next-Generation Sensor Architec
Slide 6: Ultrasonic System Innovation Reinforces Elmos' ADAS Leadership
Example 1 Ultrasonic System Innovation Reinforces Elmos’ ADAS Leadership Elmos as Partner at NVIDIA GTC Keynote Paris 2025 #1 in ultrasonic ICs with >2 billion devices deployed, spanning ultra-low-cost to ADAS-grade high-end solutions Advanced interfaces, high interference robustness and scalable ar
Slide 7: Quantum Randomness Enables a Hardware Root of Trust
Example 2 Quantum Randomness Enables a Hardware Root of Trust Lab Results Hardware-based true randomness for security-critical automo- tive systems robust against quantum computer-based attacks ▪ Samples show equal distribution of 1s and 0s ▪ Results conform to NIST SP 800-90A On-chip quantum entrop
Slide 8: Smart eFuse Controllers Enable Zonal Architectures and SDVs
Example 3 Smart eFuse Controllers Enable Zonal Architectures and SDVs Key enabler for next-gen E/E: intelligent eFuse controllers Bring up of Newest Smart Electronic Fuse Controller replace mechanical fuses in zonal and software-defined architectures (+20 ICs per vehicle) Faster, more precise fault
Slide 9: Next-Gen Ultrasonic Architecture Redefines Cost-Performance
Example 4 Next-Gen Ultrasonic Architecture Redefines Cost-Performance Higher performance at lower cost via a new master-sensor architecture with analog/digital partitioning Highest effective resolution enabled by proprietary low-loss data compression for advanced signal processing Lower cost and com
Slide 10: BCD Technology Breadth Reinforces Elmos' Fabless Advantage
BCD Technology Breadth Reinforces Elmos’ Fabless Advantage Leading foundry partnerships secure best-in-class BCD technologies at a competitive cost Actively managed node portfolio aligned to product requirements, performance and economics 12-inch manufacturing enablement across wafer testing and ass
Slide 11: Global R&D Network Enables Innovation without Borders
Global R&D Network Enables Innovation without Borders Global R&D Excellence Three Major Activities in 2025 to Strengthen our Elmos R&D Network ▪ Highly skilled experts in all areas to develop innovative, Opening a new R&D Ramp up of our new Acquisition of 100% competitive, and safe & site in Brno, C
Slide 12: Continuous Significant Progress in R&D Efficiency
Continuous Significant Progress in R&D Efficiency R&D Efficiency over the Past 12 Months Speed of Defining New Products Ø Runtime: Idea – Product Speed of R&D Execution Ø Runtime: Project Start - Sampling -31% -25% Jan-25 Jan-26 Jan-25 Jan-26 R&D Planning Accuracy Ø Cycle Time Ratio: Project Start –
Slide 13: Partners Scale the Value Chain for Faster, Cost-Efficient Innovation
Partners Scale the Value Chain for Faster, Cost-Efficient Innovation We Partner with Industry Leaders throughout the Entire Value Chain Hardware Product Design Electronic Design Automation (EDA) Software Product Design Silicon Foundry Operations (SiFo) Elmos accelerates innovation by partnering with
Slide 14: Elmos' IP Filing Power & Strategy Fuels Long-Term Value Creation
Elmos’ IP Filing Power & Strategy Fuels Long-Term Value Creation Number of Patent Filings per Year (in Absolute # of Filings) Share of Patents per Application in 2025 (in %) System/Application Integrated Circuits Technology +90% 180 9% 5% 22% 95 57% 73% 34% 2015 2025 2015 2025 ▪ Number of filings al
Slide 15: AI is Integral to How We Develop and What We Deliver
AI is Integral to How We Develop and What We Deliver Governed AI Knowledge Access Controlled, traceable, auditable results Engineering Productivity via Copilots Faster cycles without quality compromise AI Automates Design Workflows Accelerate EDA, verification, and optimization AI Elevates Ultrasoni
Slide 16: Key Takeaways | Technology and R&D
Key Takeaways | Technology and R&D Global R&D Network Enables Innovation without Borders Elmos R&D is moving from regional expertise to global excellence Systems Expertise Enables Fast, High-Quality Innovation and Adds Customer Value Integrated hardware, software & algorithms enable shift to system-
Slide 17: Disclaimer
Disclaimer This presentation contains forward-looking statements based on beliefs of Elmos‘ management. Such statements reflect the company‘s current views with respect to future events and are subject to risks and uncertainties. Many factors could cause the actual results to be materially different