Amkor Technology, Inc. · NASDAQ:AMKR
Amkor Technology — Investor Day (May 2026)
71 slides from Amkor Technology's investor day presentation, May 21, 2026
Slide 1: 2026 Investor Day
ADVANCING WHAT’S NEXT 2026 Investor Day New York City | May 21 © 2026 Amkor Technology, Inc.
Slide 2: Welcome & Opening Remarks
ADVANCING WHAT’S NEXT Welcome & Opening Remarks Jennifer Jue | VP, Investor Relations © 2026 Amkor Technology, Inc. 2
Slide 3: Safe Harbor Statements
Safe Harbor Statements Non-GAAP Measures This presentation contains certain measures that are not defined terms under U.S. generally accepted accounting principles (“GAAP”). These non-GAAP measures should not be considered in isolation or as a substitute for, or superior to, measures of liquidity or
Slide 4: 2026 Investor Day Agenda
2026 Investor Day Agenda 9:00 AM Welcome and Opening Remarks 10:15 AM Break Jennifer Jue | VP, Investor Relations 10:30 AM Expanding Geographic Footprint Leading the Next Era of Advanced Doug Scott | CVP, Advanced & Mainstream Packaging Business Units Kevin Engel | President & Chief Executive Office
Slide 5: Leading the Next Era of Advanced Packaging
ADVANCING WHAT’S NEXT Leading the Next Era of Advanced Packaging Differentiated Technology, Strategic Partnerships, and Scalable Global Execution Kevin Engel | President & Chief Executive Officer © 2026 Amkor Technology, Inc. 5
Slide 6: An Advanced Packaging-Led Era is Here
An Advanced Packaging-Led Era is Here 1 Structural shift Structural changes are reshaping the industry, and Advanced packaging is on the critical path 2 Amkor’s growth engine Advanced packaging is Amkor’s growth engine, and we are scaling our partnerships, technology, and footprint to deliver at sca
Slide 7: Forces Driving a Structural Shift
Forces Driving a Structural Shift Accelerated Technology Evolving Market Growth Transition Supply Chains Beyond $1 trillion Moore’s Law slowing Global to regional AI proliferation drives Advanced packaging Driven by geopolitics, expansion of HPC drives innovation trade, national security © 2026 Amko
Slide 8: Strategically Positioned to Capture Tailwinds from a New Era of Advanced Packaging
Strategically Positioned to Capture Tailwinds from a New Era of Advanced Packaging What an Advanced Amkor is Intentionally Packaging-Led Era Requires Aligned to this Shift Scalable, manufacturable Advanced Partnerships evolving with earlier packaging platforms design engagement and supply security E
Slide 9: Advanced Packaging Content Per End System is Structurally Increasing
Advanced Packaging Content Per End System is Structurally Increasing DRIVING FORCES BEHIND THE INCREASE Chiplet-based Architectures Complexity and Content Growth Packaging Scaling R I S I N G E C O N O M I C I M PA C T : 2 0 2 5 – 2 0 3 0 E >20% CAGR ~$0.5B TAM ~3x TAM Server market and gigawatt ins
Slide 10: Strategy to Deliver Shareholder Value
Strategy to Deliver Shareholder Value Enhance Strategic Elevate Expand Partnerships in Technology Geographic Key Markets Leadership Footprint Partnerships evolving with Early co-development drives An intentionally built footprint earlier design engagement earlier, deeper customer to support regional
Slide 11: Long-Term Financial Targets
Long-Term Financial Targets 2025 2028 2030 KEY ASSUMPTIONS Results Targets Targets (1) Mix shift towards higher- value packaging drives margin and earnings Revenue $6.7B $9.0B ~$11B+ expansion +/- $500M Initial ramp up costs in 2027 and 2028 with AZ Gross 14% 17.5% ~22%+ buildout Margin +/- 100bps R
Slide 12: Amkor End Market Model
Amkor End Market Model E S T I M AT E D M I X S H I F T W I T H O U T S I Z E D HPC/AI GROWTH ~10% Estimated End Market CAGRs 15% (2025–2030) ~24% Computing ~35% 2030 2025 ~35% 20% $6.7B 46% ~10% Automotive & Industrial ~$11B+ ~4% Communications 19% ~3% Consumer ~20% Sources: Gartner, management est
Slide 13: An Experienced Team Aligned to Execute & Deliver
An Experienced Team Aligned to Execute & Deliver Seasoned operators focused on shareholder value creation Today’s Speakers Kevin Engel Megan Faust Farshad Haghighi Doug Scott President, EVP, EVP, CVP, Advanced and Chief Executive Officer Chief Financial Officer Chief Sales Officer Mainstream Busines
Slide 14: Leading the Next Era Key Takeaways
Leading the Next Era Key Takeaways 1 2 3 Structural changes Advanced packaging is Amkor is on a multi- are reshaping the Amkor’s growth year value creation industry, and engine, and we are path, investing today Advanced packaging is scaling our to drive a materially on the critical path partnerships
Slide 15: Enhancing Strategic Partnerships in Key Markets
ADVANCING WHAT’S NEXT Enhancing Strategic Partnerships in Key Markets Farshad Haghighi | EVP, Chief Sales Officer © 2026 Amkor Technology, Inc. 15
Slide 16: Partnerships in an Advanced Packaging-Led Era
Partnerships in an Advanced Packaging-Led Era 1 Structural industry shift Evolving end markets driving deeper, more strategic engagement 2 Co-development and early engagement Roadmap alignment and planning horizons extend to ensure critical customer needs are met 3 Enhanced engagement enables financ
Slide 17: High Performance Computing
High Performance Computing M E G AT R E N D D R I V E R S Amkor’s Capabilities Support All Big Data Requirements GPU, CPU, NPU, AI accelerators ✓ Hyperscale cloud computing Massive AI workloads ✓ Artificial intelligence → Compute performance 100 10,000 ZFLOPS ✓ Training and inference → Rack densit
Slide 18: Automotive and Industrial
Automotive and Industrial M E G AT R E N D D R I V E R S Software Defined Vehicles and Electrification 1.5x increase in semiconductor value per vehicle ✓ ADAS → Content per vehicle towards $2,000+ ✓ Infotainment → ADAS content per vehicle towards $400+ ✓ Domain controllers Autonomous and software-de
Slide 19: Communications
Communications M E G AT R E N D D R I V E R S Amkor Supports Nearly All Smartphone Functions 1.2x avg semiconductor ✓ Baseband modem increase per phone ✓ AI apps processor → Premium tier smartphones higher: $225 $400 ✓ Sub-system modules On-device AI, 5G, and RF functionality ✓ RF front end → Adva
Slide 20: Consumer
Consumer M E G AT R E N D D R I V E R S Amkor is Enabling the Proliferation of IoT ✓ Connectivity / GPS Ultra small form factor with multiple functions ✓ System modules Hearables, wearables, ✓ PMIC and sensors fitness and health, smart homes ✓ Apps processor Smart edge-AI IoT devices ✓ Wireless char
Slide 21: End Markets: Where Technology & Scale Matter Most
End Markets: Where Technology & Scale Matter Most High Performance Automotive & Consumer Computing Industrial Communications Products HBM integration Long lifecycles High functional High functional integration integration Power delivery Zero defect reliability Seasonal cycles Seasonal cycles Thermal
Slide 22: Early Package Co-Development
Early Package Co-Development Device & Package Manufacturing Optimization Readiness Electrical / thermal / stress simulation Design-for-manufacturing discipline Materials selection (e.g., underfill, Yield learning loops thermal interface materials) Qualification and ramp planning Quality and reliabil
Slide 23: Engagement Evolution Driving Deeper Partnerships
Engagement Evolution Driving Deeper Partnerships Engagement is Planning horizons Capacity decisions Commitments moving earlier in are becoming are increasingly improve visibility and the design cycle multi-year pre-aligned predictability FROM TO Tactical Accessibility and Cost Strategic Partnerships
Slide 24: Innovation Enabled by Trusted Collaboration
Innovation Enabled by Trusted Collaboration “ Amkor is a critical partner in helping us build an end-to-end US silicon supply chain. For so many years, our partners at Amkor have helped us push the limits of innovation. They deliver the quality and scale our products demand and we can't wait until t
Slide 25: Why Deeper Engagements Improve the Economics
Why Deeper Engagements Improve the Economics ✓ Greater visibility enables disciplined capacity planning ✓ Planning improves utilization through ramps and cycles ✓ Risk is shared earlier in the investment curve ✓ Higher utilization supports more resilient returns over time © 2026 Amkor Technology, In
Slide 26: Deep & Trusted Partner to Global Semiconductor Leaders
Deep & Trusted Partner to Global Semiconductor Leaders 80% of Engagements >30 Years © 2026 Amkor Technology, Inc. 26
Slide 27: Enhancing Strategic Partnerships Key Takeaways
Enhancing Strategic Partnerships Key Takeaways 1 2 3 Evolving end markets Co-development and Enhanced engagement drive deeper, more early engagement reduces risk and strategic engagement drive roadmap improves capital alignment to ensure efficiency, utilization, critical customer and profitability n
Slide 28: Elevating Technology Leadership with Advanced Packaging
ADVANCING WHAT’S NEXT Elevating Technology Leadership with Advanced Packaging Doug Scott | CVP, Advanced & Mainstream Business Units © 2026 Amkor Technology, Inc. 28
Slide 29: AI Driving Growth of Integrated Products
AI Driving Growth of Integrated Products © 2026 Amkor Technology, Inc. 29
Slide 30: Technology for an Advanced Packaging-Led Era
Technology for an Advanced Packaging-Led Era 1 Co-development is critical to Advanced packaging Solving complex power, performance, and form factor requirements with Advanced packaging design and materials 2 Our Advanced packaging roadmap is built for scale Technology roadmap is in lock-step with st
Slide 31: From Chips to Systems of Chips
From Chips to Systems of Chips Advanced Packaging Unlocks Performance Performance “ It may prove to be more economical to (FLOPs) build large systems out of smaller Massive Scaling functions, which 1 ZFLOP More Than are separately Gen AI Moore packaged and interconnected.” Cloud Moore’s – Gordon E.
Slide 32: Packaging Complexity Evolution
Packaging Complexity Evolution Monolithic SoC Heterogeneous Integration Optimized single-die Modular system-level scaling performance PCB PCB PAC K AG E S I Z E 45x45mm2 85x85mm2 >100x100mm2 >150x150mm2 PAC K AG E S C A L I N G Monolithic SoC (System-on-Chip) : Components are integrated into a singl
Slide 33: Execution at Scale, Serving as Critical Bridge Between Advanced Silicon & Customers
Execution at Scale, Serving as Critical Bridge Between Advanced Silicon & Customers Providing Consistent Global Execution Across Footprint Advanced Customer Applications Silicon and Device Performance © 2026 Amkor Technology, Inc. 33
Slide 34: A Scalable Advanced Packaging Platform Roadmap
A Scalable Advanced Packaging Platform Roadmap Monolithic SoC Heterogeneous Integration Optimized single-die Modular system-level scaling performance High-Density Next-Gen Flip Chip 2.5D Platforms Fan-Out (HDFO) Engagement Direct die-to-substrate Si interposer +TSV Fine-line RDL interposer or Si Ear
Slide 35: Advanced Packaging Pipeline
Advanced Packaging Pipeline Package Type # of Customers # of Engagements 2.5D 11 18 Active Engagements | 4 in production in 2026 HDFO RDL 5 10 Active Engagements | 4 in production in 2026 HDFO Bridge 1 1 Active Engagement CPO 3 3 Active Engagements © 2026 Amkor Technology, Inc. 35
Slide 36: Powering Next-Generation Computing
Powering Next-Generation Computing “ NVIDIA’s pace of innovation depends on a strong ecosystem of partners. Amkor has contributed Advanced packaging solutions that support the performance and reliability of our products. As AI demand continues to grow, collaborations like this enable the development
Slide 37: Package Solutions Technology
Package HBM Chiplet Dummy Si Photonics Solutions Chiplet EIC + Chiplet2 Chiplet / IPD PHY PHY RDL Technology PIC Interposer DTC Bridge Toolboxes Substrate Technology RDL & Advanced Bond Head Thermal Heat Spreader Toolbox Bridge Chip Enhance- Metal Attach Laser Emission ment TIM TSV Si Bridge Reverse
Slide 38: Test Strategy
Test Strategy Final Test / System Wafer Probe Burn-in Level Test High value-add Realtime yield and process monitoring Turnkey support © 2026 Amkor Technology, Inc. 38
Slide 39: Amkor's Evolving Turnkey Service Model
Amkor’s Evolving Turnkey Service Model Reduce Cycle Time, Increase Value Design Materials Wafer Bump, Package Final Test Drop Innovation Management Probe, Dicing Assembly Burn-in, SLT Ship Leadframe, Power MEMS and Sensors Memory WLFO, WLCSP Flip Chip, PoP MCM SiP, Heterogeneous 2.5D, High-Density I
Slide 40: Advanced Packaging Solutions Video
Advanced Packaging Solutions Video © 2026 Amkor Technology, Inc. 40
Slide 41: Technology Leadership Translates into Earnings Power
Technology Leadership Translates into Earnings Power Technology Inputs Business Outcomes Financial Impact Early co-development with Higher content per package More favorable revenue mix strategic customers Longer program lifecycles Margin accretion as Scalable Advanced packaging programs scale platf
Slide 42: Elevating Technology Leadership Key Takeaways
Elevating Technology Leadership Key Takeaways 1 2 3 4 Co-development Technology Accelerating Higher-value is critical to roadmap is in Advanced product mix and solving complex lock-step with packaging and margin accretion power, strategic test investments drives Earnings performance, and customers t
Slide 43: Break
ADVANCING WHAT’S NEXT Break © 2026 Amkor Technology, Inc. 43
Slide 44: Expanding Geographic Footprint
ADVANCING WHAT’S NEXT Expanding Geographic Footprint Doug Scott | CVP, Advanced & Mainstream Business Units © 2026 Amkor Technology, Inc. 44
Slide 45: Intentional, Strategic Footprint
Intentional, Strategic Footprint 1 Intentionally built broad footprint Geographic flexibility addressing need for regional manufacturing optionality 2 Amkor Arizona enables U.S. supply chain We are a critical link enabling end-to-end U.S. semiconductor manufacturing 3 Leveraging global scale today,
Slide 46: Intentional & Strategic Global Footprint Providing Flexibility to Meet Customer Requirements
Intentional & Strategic Global Footprint Providing Flexibility to Meet Customer Requirements Factory network of 13M square feet, spanning 9 countries* Capacity is demand-led Portugal Footprint scaling is United States Japan 2028 South Korea intentionally built China United States Taiwan Vietnam Phil
Slide 47: Purpose-Built Scale Today, Bridging to U.S. Production Tomorrow
Purpose-Built Scale Today, Bridging to U.S. Production Tomorrow South Korea Taiwan → Advanced packaging center → Proximity to leading-edge foundry of excellence → Advanced wafer level technology → R&D center of excellence → Flip chip, probe, and final test → Expanding footprint 20% in 2025/26 Vietna
Slide 48: Arizona Advanced Packaging Facility Enables End-to-End U.S. Semiconductor Manufacturing
Arizona Advanced Packaging Facility Enables End-to-End U.S. Semiconductor Manufacturing Key Highlights: → Amkor is the only scaled Advanced packaging OSAT building in the U.S. → High-value Advanced packaging and test focus → Full turnkey (bump / probe / assembly / test) offering → Highest level of a
Slide 49: End-to-End Manufacturing Requires Ecosystem Alignment
End-to-End Manufacturing Requires Ecosystem Alignment Regional supply chains Advanced packaging Execution depends on require front-end and and test must scale in an intentionally built back-end coordination lockstep with fab footprint aligned to the ecosystem © 2026 Amkor Technology, Inc. 49
Slide 50: Strategic Alignment with the World's Leading Foundry
Strategic Alignment with the World’s Leading Foundry “ TSMC and Amkor have been long-standing, trusted partners in Asia, and our collaboration in Arizona extends this partnership to the United States. Together, we combine advanced front-end fabrication with Advanced packaging and test to support cus
Slide 51: Amkor's Manufacturing Footprint Video
Amkor’s Manufacturing Footprint Video © 2026 Amkor Technology, Inc. 51
Slide 52: Expanding Geographic Footprint Key Takeaways
Expanding Geographic Footprint Key Takeaways 1 2 3 4 Intentionally built Amkor’s Arizona Our Advanced Footprint broad footprint facility is a critical packaging expansion addressing need link that enables locations in Asia unlocks flexibility, for regional end-to-end U.S. and Europe are scale advant
Slide 53: Turning Strategy Into Earnings Power
ADVANCING WHAT’S NEXT Turning Strategy Into Earnings Power Megan Faust | EVP, Chief Financial Officer © 2026 Amkor Technology, Inc. 53
Slide 54: Turning Strategy into Stronger Earnings Power
Turning Strategy into Stronger Earnings Power Invest, ramp, and leverage to drive shareholder value 1 Multi-year value creation path Phase 1: 2025–2028 strategic investment and ramp Phase 2: 2028–2030 ramp and leverage; translating into more than 3x earnings power by 2030 2 Each strategic pillar has
Slide 55: Long-Term Financial Targets
Long-Term Financial Targets 2025 2028 2030 KEY ASSUMPTIONS Results Targets Targets (1) Mix shift towards higher- value packaging drives margin and earnings Revenue $6.7B $9.0B ~$11B+ expansion +/- $500M Initial ramp up costs in 2027 and 2028 with AZ Gross 14% 17.5% ~22%+ buildout Margin +/- 100bps R
Slide 56: Improved Operational & Financial Rigor are Driving Higher Highs & Higher Lows
Improved Operational & Financial Rigor are Driving Higher Highs & Higher Lows * Revenue ($B) Gross Profit ($M) Op. Income ($M) EBITDA ($M) EPS Peak to Peak $1,330 $897 $3.11 $7.1 $1,529 $4.3 $711 $837 $258 $0.53 (2) 2018 2022 2018 2022 2018 2022 2018 2022 2018 2022 Trough to Trough $933 $6.3 $438 $1
Slide 57: Financial Flexibility to Support Strategic Growth Investments
Financial Flexibility to Support Strategic Growth Investments (as of 3/31/2026 and proforma for $1.2B Convertible Senior Notes issued 5/5/2026**; $ in billions) Financial Flexibility $4.1 Available Credit $1.1B of availability on credit facilities and a net cash position $1.1 $2.6 Issued $1.2B of Co
Slide 58: Balanced & Disciplined Capital Allocation Strategy
Balanced & Disciplined Capital Allocation Strategy Maintain Balance Invest in Strategic Shareholder Sheet Strength & Organic Growth Investments Returns Flexibility Invest in Support regional Return 40-50% of manufacturing scale Long-term debt to semiconductor Free cash flow* and in diversifying EBIT
Slide 59: Arizona Overview
Arizona Overview KEY METRICS PHASE 1 ( AT F U L L S C A L E ) Revenue Contribution Gross Margin $7B 750K sq ft Multi-year ~$1B >30% contracts Total investment of cleanroom with top FUNDING SOURCES across 2 phases space customers ✓ $3.0B cash**, $1.1B credit facilities = $4.1B Phase 1 Phase 2 liquidi
Slide 60: Financial Framework: Arizona Advanced Packaging
Financial Framework: Arizona Advanced Packaging 2030 Estimated 2025–2027 Full Utilization Construction 2029 Estimated Break Even INVEST RAMP LEVERAGE 2025–2027 2028–2029 2030 & BEYOND Construction Utilization Sustained utilization and absorption Capacity online Mix Mix shift toward higher-value adva
Slide 61: Revenue Growth
Revenue Growth Arizona Facility Accelerates Growth in 2029–2030 KEY DRIVERS ~$11B+ Computing AI training and inference Data routing and networking XPU and ASIC solutions $9.0B Automotive & Industrial +/- $500M ADAS content increase ~11% Autonomous and software defined CAGR functionality 2028–2030 Co
Slide 62: Over 3X Earnings Power
Over 3X Earnings Power Key Drivers RAMP & LEVERAGE Operating 1 Mix ~$5.00+ 2 Leverage INVEST & RAMP 3 AZ Scaling Operating 2 Leverage $2.50 1 Mix +/- $0.25 3 AZ Ramp $1.50 2025 2028 2030 1 Mix 2 Operating Leverage 3 AZ Ramp & Scaling 2025–2028 Increasing contribution from Capacity deployment Tempora
Slide 63: Turning Strategy into Earnings Power Key Takeaways
Turning Strategy into Earnings Power Key Takeaways 1 2 3 Amkor is on a multi- Strong revenue growth Global supply chain year value creation and increasing increases supply path; strategic utilization, translating security and investment phase as into more than 3x partnerships reduce capacity comes o
Slide 64: Q&A
ADVANCING WHAT’S NEXT Q&A © 2026 Amkor Technology, Inc. 64
Slide 65: Closing Remarks
ADVANCING WHAT’S NEXT Closing Remarks Invest with Us Kevin Engel | President & Chief Executive Officer © 2026 Amkor Technology, Inc. 65
Slide 66: Invest with Us
Invest with Us 1 Structural shift Structural changes are reshaping the industry, and Advanced C L E A R P AT H T O : packaging is on the critical path ~$11B+ Revenue 2 Amkor’s growth engine Advanced packaging is Amkor’s growth engine, and we are scaling ~22%+ our partnerships, technology, and footpr
Slide 67: Thank You
ADVANCING WHAT’S NEXT Thank You amkor.com l
Slide 68: Appendix
ADVANCING WHAT’S NEXT Appendix © 2026 Amkor Technology, Inc. 68
Slide 69: Financial Reconciliation Tables
Financial Reconciliation Tables (2) (3), (4) (5) (6) (1) LTM ($ in millions) 2018 2019 2020 2021 2022 2023 2024 2025 Q126** Net Income $130 $123 $340 $646 $767 $362 $356 $376 $438 Plus: Interest Expense 79 72 64 52 59 59 65 75 76 Plus: Income Tax Expense 56 37 46 69 90 82 75 69 77 Plus: Depreciation
Slide 70: Non-GAAP Measures
Non-GAAP Measures Generally, a non-GAAP financial measure is a numerical measure of a company’s performance, financial position or cash flows that either excludes or includes amounts that are not normally excluded or included in the most directly comparable measure calculated and presented in accord
Slide 71: Endnotes
Endnotes 1. For the year ended December 31, 2025, our results include a $32 million net benefit to operating income and EBITDA due to a contingency payment related to our acquisition of Nanium in May 2017. Net income and earnings per diluted share also include a $16 million and $0.07 benefit, respec