Slide 1: XGS Image Sensor Family
FOR ENERGY EFFICIENT INNOVATIONS THINK ON. www.onsemi.com XGS Image Sensor Family Public Information @
Slide 2: XGS Image Sensor Family
XGS Image Sensor Family High bandwidth, low power architecture General Purpose Machine Vision One camera design supports multiple resolutions and configurations XGS Pixel • Advanced 3.2 µm Global Shutter CMOS design • High performance, low noise Compatible with 29 x 29 mm2 camera footprint ITS Broad
Slide 3: XGS Global Shutter Pixel
XGS Global Shutter Pixel High resolution at 3.2 µm size optical format Examine Sony Pregius Low noise, high shadow Advanced pixel design noise image quality Expose to highlight ON Semiconductor XGS Similar noise profile under low light Capture moving Global Shutter objects without motion artifacts 3
Slide 4: 3.2 µm Global Shutter Pixel (XGS)
3.2 µm Global Shutter Pixel (XGS) High performance from compact pixel 50 1/4 1/2 2/3 1 4/3 APS-H 45 XGS 3.2 µm 40 Scales to high resolution at large optical 35 formats PYTHON 4.5 µm Resolution (Mpix) 30 25 20 Enables small footprint camera to reduce 15 PYTHON 4.8 µm cost, simplify manufacturing flow
Slide 5: Advanced XGS Pixel Performance
Advanced XGS Pixel Performance Superior Image Quality with Reduced Pixel Size Parameter PYTHON 12k XGS 12000 Comments Pixel Size 4.5 µm 3.2 µm Small 2x increase in resolution at same optical node Pixel Optical Format 4/3” 1” Same resolution at reduced optical node QE (550 nm, mono, 50% 62% Improved
Slide 6: X-Class Platform Design Advantages
X-Class Platform Design Advantages Platform Feature Key Benefit Scalable to multiple resolution nodes Compatible with multiple pixel architectures Common frame throughout platform • Global Shutter / Rolling Shutter • Small pixel / Large pixel • High speed / Low noise High bandwidth for full utilizat
Slide 7: Matching Resolution, Features, Performance to Application Needs
Matching Resolution, Features, Performance to Application Needs 16 14 12 Bandwidth (Gbit/s) 10 GigE 10 USB 3.1/2 1x CXP12 8 XGS 8000 6 4096 x 2160 USB 3.0 4 2 GigE 0 XGS 9400 XGS 12000 6 port 12 port 24 port 3072 x 3072 4096 x 3072 XGS 12000 LS XGS 8000 LS XGS 8000 HS XGS 12000 HS Resolutions Mono /
Slide 8: Package Design
Package Design Compact Footprint 163-pin LGA 21 mm 20 mm Common package throughout family All resolutions support 29 x 29 mm2 camera design 8 June 2019
Slide 9: High Performance Advantage
High Performance Advantage Best-in-class Image Quality from Provides the performance needed for XGS Global Shutter pixel critical industrial applications Resolutions from 8 MP to 12 MP, with Match resolution, speed grades, and multiple configuration options more to specific application needs Energy
Slide 10: Key Specifications
Key Specifications Parameter Specification Pixel Size 3.2 µm x 3.2 µm Shutter Type Global Shutter Global Shutter Efficiency (550 nm) > 4000:1 Full Well Capacity (linear) 10.1 ke- Quantum Efficiency (peak) Mono (550 nm, 850 nm) 62%, 20% (incl. cover glass) Color (455 nm, 545 nm, 600 nm) 48%, 58%, 58%
Slide 11: Device Ordering Information
Device Ordering Information Production OPN Sampling OPN Device CFA LVDS Lanes Frame Rate (MOQ = 25) (MOQ = 4) 24 128 NOIX1SE8000B-LTI NOIX1SE8000B-LTI1 Color XGS 8000 12 75 NOIX2SE8000B-LTI NOIX2SE8000B-LTI1 (4096 x 2160) 24 128 NOIX1SN8000B-LTI NOIX1SN8000B-LTI1 Mono 12 75 NOIX2SN8000B-LTI NOIX2SN8
Slide 12: Evaluation Kit Ordering Information
Evaluation Kit Ordering Information Component OPN Comment Same Demo 3 headboard used for most ASD / CSD Imager Board AGB1N0CS-GEVK devices. Interfaces between eval system and computer Drives the sensor and includes local memory for image Frame Buffer Card AGBAN6CS-GEVK data storage Monochrome Headbo