Tdk Corporation · TSE:6762

Tdk — Investor Presentation (September 2022)

12 slides from Tdk's investor presentation, Sep 1, 2022

  1. Slide 1: Product presentation – ModCap MF

    Product presentation – ModCap MF DCR Modular | New Modular Standard Series TDK Electronics AG FILM ES PEC HP Málaga, Spain Sept 1st, 2022

  2. Slide 2: Introducing the New Modular Standard series Highlights

    Introducing the New Modular Standard series Highligths The most compact solution Product developed with highest energy density fire and smoke compliant Reduce time to market Low inductance (<14 nH) & lead time to avoid use of additional snubbers Cost saving solution Traction, industrial drives & ren

  3. Slide 3: ModCap series | B25645

    ModCap series | B25645 ~ AC FILTER = DC-LINK / DC FILTER MKK-HP ModCap / MKK-DCR / MKK-DCi-R / MKK-DCi-H © TDK Electronics AG 2020 Product presentation · ModCap MF B25645 FILM ES PEC HP  11/20  3

  4. Slide 4: ModCap series | B25645 DC-Link applications

    ModCap series | B25645 DC-Link applications Energy transmission Renewable energies Traction Industry Solar Loco & EMU LV Wind Light train MV © TDK Electronics AG 2020 Product presentation · ModCap MF B25645 FILM ES PEC HP  11/20  4

  5. Slide 5: General overview B25645 series

    General overview B25645 series = ModCap (dry-modular) Features ● Capacitance range from 335 µF up to 3900 µF and voltage from 900 V up to 2,300 V ● Low ESL <14 nH ● Temperature range up to 90 °C hotspot ● IEC 61071, IEC 61881-1, EN 45545-2 HL3 R23 (fire and smoke) ● Filled with polyurethane resin (d

  6. Slide 6: Construction A Simplified drawing & 3-D

    Construction A Simplified drawing & 3-D Main dimensions: 243 x 169.5 x 90 mm Terminal 3D © TDK Electronics AG 2020 Product presentation · ModCap MF B25645 FILM ES PEC HP  11/20  6

  7. Slide 7: Construction B Simplified drawing & 3-D

    Construction B Simplified drawing & 3-D Main dimensions: 258 x 215 x 115 mm Terminal 3D © TDK Electronics AG 2020 Product presentation · ModCap MF B25645 FILM ES PEC HP  11/20  7

  8. Slide 8: Highlights: Compactness, low ESL & higher operation temperature

    Highlights: Compactness, low ESL & higher operation temperature Compact power unit ● Capacitors can be mounted very close to the power modules to reduce loop inductance. → Ultra compact solution → Less investment on cooling ● Very short connection between capacitor and semi-conductor → Low inductanc

  9. Slide 9: Electromagnetic behavior of Modular Standard Series

    Electromagnetic behavior of Modular Standard Series Electromagnetic: modelling Customer benefits Customer Input Current-frequency spectrum ● Electromagnetic model available for specific simulation according to current-frequency spectrum defined by the TDK Input Capacitor design customer. Simulation

  10. Slide 10: Thermal behavior of Modular Standard Series

    Thermal behavior of Modular Standard Series Thermal: hot spot & temperature maping Customer benefits ● Thermal model available for specific simulation according to spectrum and boundary conditions defined by the customer. ● Thermal simulations to be integrated as part of the type test report. ● Ther

  11. Slide 11: ModCap Ordering Code System

    ModCap Ordering Code System Nominal Capacitance Nominal Surge current Repetitive peak Dimensions Construction Part Number voltage (V) ±10% (µF) current (A) (kA) current (kA) (LxWxH, mm) 2075 200 225 5 205x90x170 A B25645A9218K003 900 3900 155 250 5 220x115x215 B B25645A9398K003 1705 190 220 5 205x90

  12. Slide 12: Get more info here

    www.tdk-electronics.tdk.com · Get more info here

TDK — Investor Presentation (September 2022) on 6ix