Asml Holding Nv · EURONEXT:ASML
Asml Holding Nv — Deutsche Bank conference 2009
19 slides from Asml Holding Nv's conference presentation, Sep 10, 2009
Slide 1: Deutsche Bank conference
Deutsche Bank conference Franki D'Hoore - Director of European Investor Relations London 10 September, 2009
Slide 2: Safe Harbor
Safe Harbor "Safe Harbor" Statement under the US Private Securities Litigation Reform Act of 1995: the matters discussed in this document may include forward-looking statements, including statements made about our outlook, realization of backlog, IC unit demand, financial results, average sales pric
Slide 3: Business update
Business update
Slide 4: Current rationale of investing in lithography
Current rationale of investing in lithography Shrinking of chip designs to lower cost per chip Technology conversions for introduction of new device architectures (e.g. DDR2 to DDR3) Expansion of semiconductor production capacity in leading edge at foundries to enable new applications at lower cost
Slide 5: Semiconductor industry indicators are improving
Semiconductor industry indicators are improving Semiconductor unit sales increases since Q1 2009 PC sales higher than previously forecasted Memory prices improving Semiconductor inventory levels well under control Growth drivers in 2010 in consumer products are expected to be personal computers and
Slide 6: Chip revenues and units rising
Chip revenues and units rising Source: WSTS, ASML Last data point: June 2009
Slide 7: Absolute inventory at healthy levels
Absolute inventory at healthy levels Inventory days went down, due to increased chip demand Source: VLSI Research, WSTS, ASML Last data point: July 2009
Slide 8: DRAM litho machine utilization at high level
DRAM litho machine utilization at high level 200 mm tool retirement Steady phase Source: ASML
Slide 9: DRAM price development
Source: DRAM Exchange (1/09/2009) DRAM price development 300 mm cash-costs for 5x nm 1 Gb DRAM between 0.8 & 0.9 USD 300 mm cash-costs for 7x nm 1 Gb DRAM between 1.4 & 1.6 USD 300 mm cash-costs for 6x nm 1 Gb DRAM between 1.0 & 1.2 USD
Slide 10: Operating margins of DRAM makers up due to improved chip prices
Operating margins of DRAM makers up due to improved chip prices Source: DRAMeXchange (8/09), ASML Most advanced prod. node in Q2/09: 5x nm 5x nm 5x nm 6x nm 7x nm
Slide 11: NAND utilizations close to all time high
NAND utilizations close to all time high Source: ASML
Slide 12: NAND prices and cash-costs
Source: DRAM Exchange (1/09/2009) 300 mm cash-costs for 4x nm 16 Gb MLC NAND between 1,9 and 2,4 USD NAND prices keep stable for almost 6 months in a row
Slide 13: Strong recovery of operating margins of NAND manufacturers
Strong recovery of operating margins of NAND manufacturers due to stable profitable prices Most advanced volume node in Q2/09: 3x nm SPT 3x nm SPT 3x nm SPT 4x nm SE Source: DRAMeXchange (8/09), ASML
Slide 14: ASML well positioned to benefit from 2010 business opportunities in immersion
ASML well positioned to benefit from 2010 business opportunities in immersion DRAM Manufacturers switching to advanced DDR3 memory chips and shrinking to the 4x nm node for chip performance and lower cost Only 3% of total manufacturing capacity is running at 4x nm node NAND Leading manufacturers mov
Slide 15: ASML well positioned to benefit from 2010 business opportunities (continued)
ASML well positioned to benefit from 2010 business opportunities in immersion (continued) Logic/Foundry Advanced graphics processors and wireless chips require a shift towards the 40/45 nm node Demand drives utilization at 40/45 nm to high levels A combination of XT and NXT products are needed for a
Slide 16: TWINSCAN NXT - Enabling cost effective sub nm imaging
TWINSCAN NXT - Enabling cost effective sub 40 nm imaging New platform for high productivity and extreme low overlay for printing 28 nm and below using double patterning technology First NXT system shipping in September 2009 NXT is an evolutionary successor of the XT product line re- using many prove
Slide 17: TWINSCAN NXT:1950i
Resolution 32 nm and beyond Productivity more than 175 wafers per hour Overlay less than 2.5 nm TWINSCAN NXT:1950i
Slide 18: Summary
Summary ASML used previous quarters with low sales volume to: Increase technological leadership EUV, NXT double patterning, holistic lithography Work on cost improvements Reduce manufacturing cycle time ASML new products XT:1950 and NXT:1950 will enable all technology transitions needed to support:
Slide 19: ASML
YY & ASML Commitment