Dupont De Nemours, Inc. · NYSE:DD
Dupont De Nemours — Investor Presentation (September 2021)
13 slides from Dupont De Nemours's investor presentation, Sep 22, 2021
Slide 1: DuPont Semiconductor Technologies: A Global Innovation Leader
DuPont Semiconductor Technologies A Global Innovation Leader Investor Presentation September 22, 2021
Slide 2: Semiconductor Technologies: At a glance
Semiconductor Technologies: At a glance INDUSTRY-LEADING PORTFOLIO TARGETING ATTRACTIVE END-MARKETS BY PRODUCT LINE* BY GEOGRAPHY* CMP Technologies ~2,000 Lithography COLLEAGUES $1.8B* Advanced Cleans Advanced Packaging 15% 8% 77% Sales Mix: 90% Consumables, 10% Permanent Materials 7 MANUFACTURING B
Slide 3: Semiconductor Technologies: At a glance - Financial profile and growth strategy
Semiconductor Technologies: At a glance STRONG FINANCIAL PROFILE AND GROWTH STRATEGY NET SALES GROWTH STRATEGY Partner with customers to Expand addressable optimize product and market through technology process performance transitions Continue to invest in Build R&D, application leading-edge technol
Slide 4: Megatrends driving strong surge in semiconductor demand and investment
Megatrends driving strong surge in semiconductor demand and investment MEGATRENDS GROWING SEMICONDUCTOR DEMAND Silicon Shipments (MSI) Consistent market growth of 4-6% High- AI/Big Data/ Performance Machine Computing Learning 2010 2015 2020 2025 Capital Spending Fab investment supporting 5G Connecti
Slide 5: Technology roadmap creating high-value material challenges
Technology roadmap creating high-value material challenges DuPont’s portfolio uniquely positioned to enable both smaller nodes AND more complex packaging Leading-edge technologies require – › Better Performance Chip package complexity › Lower Power › Smaller Area Smaller,taller, Smaller, taller, and
Slide 6: Advanced chips driving higher growth for DuPont materials usage
Advanced chips driving higher growth for DuPont materials usage ADVANCED DEVICE TRANSITIONS TARGET LAYER GROWTH ~25% of ~50% of 300mm wafer total wafers total wafers Material content 100% capacity growth growing with in advanced increasing target devices driving 80% layers and process higher materia
Slide 7: DuPont materials enable critical semiconductor process steps at leading fabs
DuPont materials enable critical semiconductor process steps at leading fabs Deposition Patterning Photoresists, Functional sub- Planarization CMP Pad & Slurry layers, Advanced overcoats Building chips Ingot Blank Wafer Wafer Process Cycle Packaging & Assembly Final Product Etching Metallization, Di
Slide 8: Industry-leading portfolio, well-positioned for growth
Industry-leading portfolio, well-positioned for growth • Post-Etch • Post CMP Residue Cleaners • Pads • Slurries Removers CMP Advanced • Emerging Technologies Cleans • Strippers Cleans COMPREHENSIVE • Photoresists • Functional PORTFOLIO • Metallization • Thermal • Advanced Sublayers interface Advanc
Slide 9: Key takeaways
Key takeaways Proven track record of Robust market fundamentals market outperformance for semiconductor growth linked with key megatrends DuPont portfolio enables Strong market position and Innovation leader with long solutions for industry’s partnerships with leading history of operational and most
Slide 10: Appendix
Appendix <OUPONT » %
Slide 11: Upcoming Events
Tuesday, November 2, 2021 Upcoming • DuPont 3Q21 Earnings Call Events Wednesday, November 17, 2021 • Interconnect Solutions (E&I) Teach-In 11
Slide 12: Safe Harbor Statement
Safe Harbor Statement Presentation This presentation is meant to provide a deeper understanding of DuPont’s Semiconductor Technologies business, its underlying technologies and growth opportunities. DuPont is not, and nothing in the presentation should be interpreted as, affirming, updating or other
Slide 13: DuPont trademarks and rights notice
© 2021 DuPont de Nemours, Inc. All rights reserved. © 2021 DuPont. All rights reserved. DuPont™, the DuPont Oval Logo, and all trademarks and service marks denoted with ™, ℠ or ® are owned by affiliates of DuPont de Nemours, Inc. unless otherwise noted. Nothing contained herein shall be construed as
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