Corning Incorporated · NYSE:GLW
Corning — Semicon Taiwan 2019
22 slides from Corning's conference presentation, Sep 19, 2019
Slide 1: Innovations in Glass-Based Solutions for Advanced Semicon Packaging & Consumer Electronics
Innovations in Glass-Based Solutions for Advanced Semicon Packaging & Consumer Electronics Rustom Desai Commercial Director, Corning Precision Glass Solutions September 19, 2019 © 2019 Corning Incorporated
Slide 2: Presentation Outline
Presentation Outline • Why glass in semicon packaging & CE? • Enabling glass adoption • Innovations in glass-based solutions: • Advanced Packaging Carriers • Wafer-Level Optics • Augmented Reality Precision Glass Solutions © 2019 Corning Incorporated © 2019 Corning Incorporated
Slide 3: Key megatrends are driving the need for glass in semiconductor processes
Key megatrends are driving the need for glass in semiconductor processes 1. More functional, 2. Highly accurate, 3. Faster, seamless 4. Engaging, immersive Trends compact chips miniaturized sensors connections interfaces Applications Advanced packaging Wafer-level optics Low-loss & high Waveguide di
Slide 4: Glass is an ideal enabling material for these applications
Glass is an ideal enabling material for these applications Applications 1. Advanced 2. Wafer-Level Optics 3. Low-loss, high 4. Waveguide-based Packaging linearity RF augmented reality Why Glass? Multiple CTEs & High purity Low dielectric loss across Multiple refractive indices high stiffness
Slide 5: Presentation Outline
Presentation Outline • Why glass in semicon packaging & CE? • Enabling glass adoption • Innovations in glass-based solutions: • Advanced Packaging Carriers • Wafer-Level Optics • Augmented Reality Precision Glass Solutions © 2019 Corning Incorporated © 2019 Corning Incorporated
Slide 6: Customer Requirement #1: Deep technical engagement tailored to every development stage
Customer Requirement #1 Deep technical engagement that’s tailored to every development stage Customer's Product Development Stages Phase 1 Phase 2 Create & refine hypothesis; Develop, pilot, & lock Phase 3 “Scale solution; Optimize Develop Manage assumptions solution Scale Up Grow advantage” product
Slide 7: Customer Requirement #2: Customized material science expertise
Customer Requirement #2 Customized material science expertise applied to specific applications Application Fan-Out Wafer-Level Wafer-Level Optics & Waveguide Eyepieces for Packaging Silicon on Glass Augmented Reality Examples: Customer Minimize in-process Use glass in front-end Maximize field of vie
Slide 8: Presentation Outline
Presentation Outline • Why glass in semicon packaging & CE? • Enabling glass adoption • Innovations in glass-based solutions: • Advanced Packaging Carriers • Wafer-Level Optics • Augmented Reality Precision Glass Solutions © 2019 Corning Incorporated © 2019 Corning Incorporated
Slide 9: Innovative Glass-Based Solution: Advanced Packaging Carriers
Innovative Glass-Based Solution: Advanced Packaging Carriers Precision Glass Solutions © 2019 Corning Incorporated © 2019 Corning Incorporated
Slide 10: Advanced packaging needed to deliver pace of performance improvement
Advanced packaging needed to deliver pace of performance improvement • The number of foundries investing in subsequent nodes is reducing • Time between nodes is increasing • Many believe that advanced packaging is needed to deliver pace of performance improvements • Example: Fan-out Packaging (FO) P
Slide 11: CTE mismatch causes in-process warp
CTE mismatch causes in-process warp Es , vs , t s , α s semi E g , vg , t g , α g glass Under typical fan-out conditions, in-process warp follows a simplified formula showing its dependence on: 1. CTE mismatch between glass & the composite semi material 2. Inverse of glass Young’s modulus 3. Inverse
Slide 12: Three glass-based levers to minimize in-process warp
Three glass-based levers to minimize in-process warp 1. Decrease ∆ CTE 2. Increase modulus 3. Increase thickness Es = 20GPa; =Eg 70GPa; = Es 20GPa; =Eg 70GPa; = Es 20GPa; =vg 0.22; = vs 0.35; =vg 0.22; = vs 0.35; =vg 0.22; = vs 0.35; =t g 1.1mm; = ts 0.15mm; ts = 0.15mm; =t g 1.1mm; = ts 0.15mm; ΔCT
Slide 13: Corning Advanced Packaging Carriers
Corning Advanced Packaging Carriers? Advanced Packaging Carriers 1. Fine granularity of CTE’s-minimize ∆ CTE 2. High Stiffness: Increased YM & optimized thickness 3. 4-6 week lead time for samples Precision Glass Solutions © 2019 Corning Incorporated © 2019 Corning Incorporated
Slide 14: Market reaction to Corning Advanced Packaging Carriers (APC)
Market reaction to Corning Advanced Packaging Carriers (APC) Currently being used in 20 customer Featured in July/Aug. issue projects of Chip Scale Review Customer: APC reduced in-process Awarded 3D Incites 2019 Material warp by 150 µm Supplier of the Year for APC Precision Glass Solutions © 2019 Co
Slide 15: Innovative Glass-Based Solution: Wafer-Level Optics
Innovative Glass-Based Solution: Wafer-Level Optics Precision Glass Solutions © 2019 Corning Incorporated © 2019 Corning Incorporated
Slide 16: Optical sensors need to get smaller and more accurate
Optical sensors need to get smaller and more accurate. Enter, wafer-based semicon processes… Miniaturization is driving changes in manufacturing of these sensors Front-end Back-end processes processes (FEOL) (BEOL) Each with a set of challenges • Contamination • Package stacking • TTV tolerance • Wa
Slide 17: Fused silica is FEOL-compatible
Fused silica is FEOL-compatible Corning HPFS® Fused Silica: Ultra-pure material: 100% SiO2 Extreme thermal durability: Near-zero CTE Track record of success: HPFS has enabled 300M+ devices to date Why HPFS is ideal for 3D 120 sensing 80 Distance Shift / mm 40 0 High thermal durability! Acrylic
Slide 18: BEOL applications require a wide range of optical glasses
BEOL applications require a wide range of optical glasses Top Challenges How Glass Addresses 1 Package stacking tolerance Tight glass geometric tolerances deliver lower stacking variance 2 Delamination Corning optical glasses have: 1.8x lower avg. thickness variation 1.5x lower average TTV 2
Slide 19: Innovative Glass-Based Solution: High-index glass and tools for Augmented Reality
Innovative Glass-Based Solution: High-index glass and tools for Augmented Reality Precision Glass Solutions © 2019 Corning Incorporated © 2019 Corning Incorporated
Slide 20: AR headset demand is coming; glass with semicon-like processing will enable it
AR headset demand is coming; Glass with semicon-like processing will enable engaging experiences with these devices 20.0 AR Headsets Waveguides require ultra-flat, high refractive index glass with gratings for a wide field of view 18.0 AR Headsets (M Units) 16.0 14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 20
Slide 21: Corning is enabling the emerging AR/MR supply chain
Corning is enabling the emerging AR/MR supply chain Reduced BoM cost Customer Wider field of view Higher equipment & Challenges Higher throughput & lighter device material utilization Larger-diameter wafers Corning High refractive-index glass Automated laser glass- Solutions & thinner form factors c
Slide 22: Thank you!
Thank you! To learn more, visit us at booth L0916 or visit our website here: Precision Glass Solutions © 2019 Corning Incorporated © 2019 Corning Incorporated