Sahasra Electronic Solutions Limited · NSE:SAHASRA
Sahasra Electronic Solutions — Investor Presentation (September 2026)
41 slides from Sahasra Electronic Solutions's investor presentation, Sep 19, 2026
Slide 1: Sahasra Electronics
SAHASRA ELECTRONICS “We Assemble Relationships”
Slide 2: Company Overview
COMPANY OVERVIEW Calgary Brussels Pennsylvania Cameron Park Florida 7 Noida Manufacturing Delhi Sales Office Sites Bhiwadi Manufacturing Sites Mumbai 9 Bangalore Sales offices Rwanda 20+ Export Destinations 650+ Workforce CONFIDENTIAL – SAHASRA GROUP
Slide 3: Key Milestones
KEY MILESTONES EMS operations commence 2001 at Free Trade Zone, NOIDA PCB Fabrication with Nano 2005 Electrotech Pvt. Ltd Acquisition of Nano Electrotech to Emerge as Infopower, NOIDA 2011 JV between MiTAC Holdings 2016 and IPTL (Sahasra Group) 2020 Sahasra Semiconductors is set up at Bhiwadi 3rd la
Slide 4: Quality Management - Certifications
QUALITY MANAGEMENT - CERTIFICATIONS ANSI ESD S20.20 Gained ESD certification in 2015. Certified by UL/DQS ISO9001 ISO9001 certified in ISO/TS16949_Automotive AS9100D_Aerospace 2004.Certified by TUV Automotive quality management ISO/TS 22163_IRIS Railways Aerospace quality management system certified
Slide 5: Product Lines
PRODUCT LINES Box Build Enterprise & Consumer IT Hardware EMS Design & Manufacturing Electronic Assemblies Testing & Programming Wire Harness Box Build Memory Solutions Printed Circuit Boards CONFIDENTIAL – SAHASRA GROUP
Slide 6: Electronic Manufacturing Services
ELECTRONIC MANUFACTURING SERVICES PRODUCT INTEGRATION LIFECYCLE Design Fabricate Assemble Test Program Wire Harness Box Build MANUFACTURING ENGINEERING MANUFACTURING INFRASTRUCTURE (4+8) Fully Automated High-Speed Fuji SMT Lines Faster | Cheaper | Better CONFIDENTIAL – SAHASRA GROUP
Slide 7: Product Portfolios | Capabilities
PRODUCT PORTFOLIOS | CAPABILITIES CONFIDENTIAL – SAHASRA GROUP
Slide 8: Product Lines
PRODUCT LINES Electronic Manufacturing Services Box Build Printed Circuit Boards Design Services Facilities Capabilities & Materials Enterprise & Consumer IT Hardware Memory Solutions CONFIDENTIAL – SAHASRA GROUP VER_1.2.1
Slide 9: PCB Design Services
PCB DESIGN SERVICES CAPABILITIES & TOOLSTACK DESIGN PROCESS & DELIVERABLES Design Capabilities & Standards Customer • Engineering Team: Well-qualified and highly experienced PCB design engineers. • Industry Standards: 100% IPC-2220 compliance for rigid PCB design and performance. • EDA Software: Alt
Slide 10: Fabrication Capabilities & Materials
FABRICATION CAPABILITIES & MATERIALS SUBSTRATES & SUPPLIERS PRECISION & DIMENSIONS PCB TYPES & FINISHES Materials Process Capability PCB Type & Finish • Substrates: FR-4, FR-4 High TG, Al Substrate, CEM- • Board Thickness: 0.2mm – 3.2mm • Board Structures: Single Side, Double Side, Multi 1 / CEM-3,
Slide 11: Product Lines
PRODUCT LINES Printed Circuit Boards Electronic Manufacturing Services Memory Solutions UFD & OTG mSD Card USB SSD DDR Box Build Enterprise & Consumer IT Hardware CONFIDENTIAL – SAHASRA GROUP
Slide 12: Overview
OVERVIEW KEY OEM CUSTOMERS & RETAILERS Sony HP SILICON POWER CENTON DELKIN AMAZON SSD (Solid State Drive) USB Flash Drive Micro SD Card DDR RAM CONSUMER GRADE • USB 2.0 Flash Drive • Class 4 Series • DDR3 1600 • USB 3.1 Flash Drive • Class 6 Series • DDR4 2666 / 3200 • 2.5” SATA III SSD Internal • U
Slide 13: Product Lines
PRODUCT LINES Memory Solutions Printed Circuit Boards Enterprise & IT Hardware Server MB Desktop MB Enterprise SSD Laptop Electronic Tablet Manufacturing Services Box Build CONFIDENTIAL – SAHASRA GROUP
Slide 14: Enterprise & Industrial IT Hardware
ENTERPRISE & INDUSTRIAL IT HARDWARE Product & Hardware Offerings Enterprise & Industrial Motherboards High-reliability Motherboards engineered specifically for servers, Key Milestones & Capabilities edge computing, and industrial applications. • Pioneer in Server MBs India’s first company to manufac
Slide 15: Product Lines
PRODUCT LINES Printed Circuit Boards Electronic Manufacturing Services Box Build Solutions POS Smart Helmet Motor Control Unit HSM Memory Solutions Enterprise & Consumer IT Hardware CONFIDENTIAL – SAHASRA GROUP
Slide 16: Box Build Solutions
BOX BUILD SOLUTIONS IoT-enabled Instant audio High-security protective payment physical computing headgear notification device device dedicated integrating engineered for to cryptographic communication merchant QR key management modules, sensors, transactions and and enterprise and worker safety tra
Slide 17: Industries Currently Served
INDUSTRIES CURRENTLY SERVED Aerospace Automotive Industrial Metering Defence Medical Fintech Railways CONFIDENTIAL – SAHASRA GROUP And Many more …..
Slide 18: Sahasra Semiconductors
SAHASRA SEMICONDUCTORS “Packaged in India, trusted by the world ” Sahasra Semiconductors INDIA’s First Operational OSAT Wafer Processing, IC Packaging & IC Test
Slide 19: Sahasra Group's Advanced OSAT/ATMP Facility
SAHASRA GROUP'S ADVANCED OSAT/ATMP FACILITY CONFIDENTIAL – SAHASRA GROUP
Slide 20: Clean Room Environment
CLEAN ROOM ENVIRONMENT MACHINES – CLASS10K (FRONT OF THE LINE) MACHINES – CLASS100K (END OF THE LINE) CONFIDENTIAL – SAHASRA GROUP
Slide 21: Machines - Testing
MACHINES - TESTING Quality is an integral part of the product at Sahasra Semiconductors, to ensure the same we have the latest state of the art equipment for the testing of the product before it is shipped. CONFIDENTIAL – SAHASRA GROUP
Slide 22: Machines – FA & Reliability
MACHINES – FA & RELIABILITY Robust FA and reliability processes uncover root causes of defects and validate long-term device performance, enabling higher yields and more dependable products. Sahasra Semiconductors has the latest technology so that each product meets the stringent industry standards.
Slide 23: Value Add Full Stack Services
SERVICES Full Stack Wafer Back Grinding Material sourcing Value Add Laser Grooving Inventory management Mechanical Dicing Die banking Die Bonding Tape & Reel, tube & tray packing Wire bonding Labelling & Marking Saw Singulation, Trim & form, Serialization & traceability systems Package Dicing Custom
Slide 24: Product Portfolios
PRODUCT PORTFOLIOS Package Type Production Started in MicroSD Oct 2024 eSIM IC Feb 2025 LED Driver IC Jun 2025 RFID IC Jan 2026 CONFIDENTIAL – SAHASRA GROUP
Slide 25: Memory Package Portfolio
MEMORY PACKAGE PORTFOLIO Package Type When Remarks Micro SD Memory In Production COB/UDP* Q1-2026 Trial Production COB/UDP* Q3-2026 Mass Production • All Substrate packages comply to ROHS/Green Mfg • Substrate Design In-house CONFIDENTIAL – SAHASRA GROUP
Slide 26: Memory Package Portfolio (Future Projections)
MEMORY PACKAGE PORTFOLIO (FUTURE PROJECTIONS) Package Type When Remarks Micro SD Memory In Production eMMC/eSSD* Q2/Q3-2027 Trial Production eMMC/eSSD* Q4-2027 Mass Production • All Substrate packages comply to ROHS/Green Mfg • Substrate Design In-House • Post Phase – II Equipment Upgradation • Embe
Slide 27: SOP & QFN/DFN Package Portfolio
SOP & QFN/DFN PACKAGE PORTFOLIO Package Type When Remarks ESOP – 7/8 Available Exposed Pad with Downset QFN/DFN Available 0.75mm Thickness UQFN/UDFN Q2-2026 0.40/0.50mm Thickness QFN/DFN/DSN/SON Q4-2026 0.90mm Thickness • All Lead-frame based packages comply to ROHS / Green • Multiple surface finish
Slide 28: Package Roadmap
PACKAGE ROADMAP TSSOP/ DFN/ MRAM/ Entry Level 2025- 2028 SOIC/ QFN/ BGA/Flip- Standard mSD/UDP DSN Chip Packaging 2.5D/3D TSV’s/ 2028- Silicon Advanced 2032 Multi Die Multi Chip Stacking Modules Interposer Packaging s Fan out Chiplets 2032- Hybrid Wafer SOC’s/ 2035 Bonding Level CPUs 3D/Hybrid Packa
Slide 29: High Skilled Manpower – Growing Direct Employment
HIGH SKILLED MANPOWER – GROWING DIRECT EMPLOYMENT Sahasra Semiconductors extends its facilities to train human capital: MoU with Universities for lab sessions as part of 2029 - 300 2027 - 150 Engineering curriculum 2025 - 50 On Job Training for hands on exposure Working with Universities on de
Slide 30: Certifications & Systems
CERTIFICATIONS & SYSTEMS ISO 9001:2015 SO 14001 & ISO 45001 certified IATF 16949 planned for June 2027 SAP S/4 HANA ERP Live since 1st September 2026 MES System onboarding in process Test Program Development & Testing Services Providing Failure Analysis & Reliability Test services CONFID
Slide 31: Financial Highlights
FINANCIAL HIGHLIGHTS
Slide 32: Performance update and management commentary
Business updates Majority focus towards NAND Flash Memory production with demand being at all time high due to the Memory Super Cycle as AI demand expands. Exports are driving growth with over 60% of revenue contribution Development of other packages such as 48TQFP1, 68QFN2 and UDP3 which will
Slide 33: Q1 FY27 Performance
Q1 FY27 Performance ₹ crore unless otherwise mentioned ₹ crore unless otherwise mentioned SESL Q1 FY27 Q1 FY26 Consolidated Q1 FY27 Q1 FY26 Q1 Financials Q1 Financials Revenue 32.96 20.42 Revenue 47.90 22.03 Other Income 2.10 1.00 Other Income 2.32 1.00 Total Income 35.06 21.42 Total Income 50.22 23
Slide 34: Revenue split across segments – FY26
Revenue split across segments – FY26 (Based on consolidated numbers) EMS1 Memory solutions Computer and IT Semiconductor accessories +110% +51% -62% 91.6 26.3 13.6 +71 % 15.7 60.5 12.5 9.2 5.2 FY25 FY26 FY25 FY26 FY25 FY26 FY25 FY26 Total Revenue contribution (%) +45% 9.6% 11.3% 138.8 3.8% EMS 14.2%
Slide 35: Export Vs Domestic Split
Export Vs Domestic Split Q1 FY27 (Standalone) Segment Amount (INR crs) Percentage of Total Export Sale 21.66 66% Domestic Sale 11.30 34% Total 32.96 Q1 FY27 (Consolidated) Segment Amount (INR crs) Percentage of Total Export Sale 32.01 66.83% Domestic Sale 15.89 33.17% Total 47.90 35
Slide 36: Order Book (consolidated numbers)
Order Book (consolidated numbers) Unit Projected Revenue Revenue Q1FY27 Open Order Book (INR crs) (INR crs) (INR crs) SESL 150 32.96 (22%) 75 (50%) SSPL 50 14.94 (30%) 18 (36%) Total 200 47.90 (24%) 93 (47%) 36
Slide 37: Advanced manufacturing infrastructure with scalable operations
Advanced manufacturing infrastructure with scalable operations UNIT 1 Area 2,100 sq.mtr. UNIT 2 Area 2,870 sq.mtr. UNIT 3 Area 6,000 sq.mtr. Noida Bhiwadi Bhiwadi(semicon) Capacity SMT lines Capacity SMT lines Capacity Clean rooms 6 million 4 18 million 4 60 million 10k and 100k Peak revenue 2026 re
Slide 38: Strategic priorities to drive scalable growth
Strategic priorities to drive scalable growth 01 02 03 04 05 Diversification across high- Strategic expansion into Market expansion and Capacity expansion and Inorganic growth and growth product segments semiconductor ecosystem geographic diversification technology investments strategic partnerships
Slide 39: Sahasra Group - Corporate structure and proposed merger
Sahasra Group - Corporate structure and proposed merger Group structure and business areas Share swap ratios Merger impact on SESL’s shareholding Pre-merger SEPL : SESL 226 : 100 Entity Role Business description Promoter 69.9% Public 30.1% ITPL : SESL 5 : 100 Manufacturing & assembly of electronic P
Slide 40: Safe harbor statement
Safe harbor statement This presentation and the accompanying slides (the “Presentation”), which have been prepared by Sahasra Electronic Solutions Limited (the “Company’), have been prepared solely for information purposes and do not constitute any offer, recommendation or invitation to purchase or
Slide 41: Thank you
Thank you For further information, please contact: COMPANY SAHASRA ELECTRONICS SOLUTIONS LIMITED Maneesh Tiwari Chief Financial Officer maneesh@sahasraelectronics.com INVESTOR RELATIONS CONSULTANT Meeting Request Link NEOATLAS CAPITAL ADVISORY LLP Research Team Rutul Shah +91 63549 47366 +91 82002 4
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