Formfactor, Inc. · NASDAQ:FORM
Formfactor — Technical Presentation (June 2008)
19 slides from Formfactor's technical presentation, Jun 8, 2008
Slide 1: MicroProbe Vx-MP Probe Card Technology
January Kister Stephen Hopkins MicroProbe, Inc. MicroProbe Vx-MP Probe Card Technology Company June 8-11, 2008 Logo San Diego, CA USA
Slide 2: Overview
Overview • Vx-MP Technology Key Features and Components • Probe Design Considerations • Key Performance Parameters • Probe to Probe No-interference Confidence at Aggressive Bump Pitches • Roadmaps • Summary June June 88 to to 11, 11, 2008 2008 IEEE IEEE SW SW Test Test Workshop Workshop 22
Slide 3: Vx-MP Technology Key Features
Vx-MP Technology Key Features • Combines Flexibility of MEMS probes installed in customer-specified x-y locations Photo of Test Head Patented June June 88 to to 11, 11, 2008 2008 IEEE IEEE SW SW Test Test Workshop Workshop 33
Slide 4: Vx-MP Technology Key Features
Vx-MP Technology Key Features • Probes are fabricated utilizing 3-D photolithography-metal plating techniques – Probe tip – “skate” shape/material provides ideal contactor – Probe body material provides optimal spring action Patented June June 88 to to 11, 11, 2008 2008 IEEE IEEE SW SW Test Test Wor
Slide 5: Vx-MP Technology Key Components
Vx-MP Technology Key Components LGA - PCB PCB – MLC Interconnect Probes Probe Head Space Transformer June June 88 to to 11, 11, 2008 2008 IEEE IEEE SW SW Test Test Workshop Workshop 55
Slide 6: Probe Design Key Features
Vx-MP Probe Design Key Features • Tip base provides stable target for prober alignment Patented Dual-Skate Probe Tip Single-Skate Probe Tip Tip Base (flat) June June 88 to to 11, 11, 2008 2008 IEEE IEEE SW SW Test Test Workshop Workshop 66
Slide 7: Key Performance Features
Vx-MP Key Performance Features • Vx-MP Probe Action Patented June June 88 to to 11, 11, 2008 2008 IEEE IEEE SW SW Test Test Workshop Workshop 77
Slide 8: Mechanical Performance
Vx-MP Mechanical Performance • Vx-MP Probe Scrub Motion Patented June June 88 to to 11, 11, 2008 2008 IEEE IEEE SW SW Test Test Workshop Workshop 88
Slide 9: Electrical Performance
Vx-MP Electrical Performance • Performance on Eutectic Flip-Chip Solder Balls, 400mA current prior to each measurement, 50 um Deflection • 2500 TD, On-line clean cycle every 250 TD Contact Resistance Change, Ohm June June 88 to to 11, 11, 2008 2008 IEEE IEEE SW SW Test Test Workshop Workshop 99
Slide 10: Electrical Performance
Vx-MP Electrical Performance • Post 100k Touch Down Performance on 130um pitch on Copper @ 50 um Deflection Contact Resistance Change, Ohm June June 88 to to 11, 11, 2008 2008 IEEE IEEE SW SW Test Test Workshop Workshop 10 10
Slide 11: Electrical Performance
Vx-MP Electrical Performance • Post 100k Touch Down Performance on 110um pitch on Copper @ 50 um Deflection June June 88 to to 11, 11, 2008 2008 IEEE IEEE SW SW Test Test Workshop Workshop 11 11
Slide 12: Electrical Performance
Vx-MP Electrical Performance • Contact Resistance Results on Copper – Cleaning performed prior to each wafer test 130um Pitch 110um Pitch June June 88 to to 11, 11, 2008 2008 IEEE IEEE SW SW Test Test Workshop Workshop 12 12
Slide 13: Electrical Performance
Vx-MP Electrical Performance • Effective Inductance June June 88 to to 11, 11, 2008 2008 IEEE IEEE SW SW Test Test Workshop Workshop 13 13
Slide 14: Electrical Performance
Vx-MP Electrical Performance • CCC based on 10% CF Reduction under Steady State Current 130 um Grid Array pitch Probe 40um OT June June 88 to to 11, 11, 2008 2008 IEEE IEEE SW SW Test Test Workshop Workshop 14 14
Slide 15: Mechanical Performance
Vx-MP Mechanical Performance • Probe to Probe no-interference CPk = 3.6 @ 150 um pitch – for extreme bump height and scrub variation Nominal Pitch 150 um Probe-Probe Angle = 0 deg June June 88 to to 11, 11, 2008 2008 IEEE IEEE SW SW Test Test Workshop Workshop 15 15
Slide 16: Tip-Bump Alignment Process Capability, CPU
Vx-MP Tip-Bump Alignment Process Capability, CPU • For 130um pitch & 90um nominal bump CPU= 1.74 Takes into account probe tip alignment and scrub motion U R=3*Stdev. Probe Tip location June June 88 to to 11, 11, 2008 2008 IEEE IEEE SW SW Test Test Workshop Workshop 16 16
Slide 17: Technology Pitch Capability Roadmap
Vx-MP Technology Pitch Capability Roadmap • Vx-MP June June 88 to to 11, 11, 2008 2008 IEEE IEEE SW SW Test Test Workshop Workshop 17 17
Slide 18: Summary/Next Steps
Summary/Next Steps • Vx-MP technology platform combines accuracy of MEMS with flexibility of pre-made probes placed into customer specified x-y locations • Addresses most aggressive wafer bump pitch roadmaps • Tightly controlled scrub action optimizes electrical performance • Next step: Larger footp
Slide 19: Acknowledgements
Acknowledgements • Miguel Enteria, R&D Manager , MicroProbe, Inc., Fremont, Ca • Alex Shtarker, R&D, MicroProbe, Inc. Fremont, Ca • Lich Tran, Sr. R&D Engineer, MicroProbe, Inc., Fremont, Ca June June 88 to to 11, 11, 2008 2008 IEEE IEEE SW SW Test Test Workshop Workshop 19 19