Formfactor, Inc. · NASDAQ:FORM
Formfactor — Technical Presentation (2019)
28 slides from Formfactor's technical presentation, 2019
Slide 1: COMPASS FormFactor Users' Group Conference
COMP’\SS a KormFaetor.@seérs’ Groupie@onference S FORMFACTOR™
Slide 2: Silicon Photonics - Challenges & Solutions for Wafer-Level Production Tests
Silicon Photonics - Challenges & Solutions for Wafer-Level Production Tests Choon Beng Sia Ph.D. Customer Applications & Production Solution Choonbeng.sia@cmicro.com 2 2
Slide 3: Agenda
Agenda • Market Trends & Driving Forces • Optical Transceivers in Data Centers • Why Silicon Photonics? • Why Wafer-level Photonics Test? • Measurement Challenges and Test Engineers’ pain points • FormFactor Wafer-Level Photonics Test Solution • Key Advantages & Value Propositions of FormFactor’s Ph
Slide 4: Communication Network for 4th Industrial Revolution
Communication Network for 4th Industrial Revolution Self-Driving IoT HealthCare 5G (10Gbps) Cars RF/mmW DataCenter 100/400Gbps Optical Interconnects Source: Keysight 4 4
Slide 5: The Need for High Performance Data Centers & Network
The Need for High Performance Data Centers & Network Big Data Analytics Artificial Intelligence Genomics Revolution Financial Acceleration Cyber Security Video Transcoding Photo Credits – FIU Honors College, Peshkova/Shutterstock.com, healthskouts.com, Gecko Governance, www.socionext.com, www.gsa.go
Slide 6: Facebook Invests US$1B HyperScale Data Center in Singapore
Facebook Invests US$1B HyperScale Data Center in Singapore • Facebook’s 1st Data Center in Asia. • 5000 servers • Each server supports 100 petabytes or 100,000 TB* *2015 Facebook Video, 1PB=1000TB 6 6
Slide 7: Requirements for Data Center – High Speed Data Rate
Requirements for Data Center – High Speed Data Rate • Wired communication network. • High Speed, High Data Rate, Low Latency requirements. • Key market players developing 100-400G optical transceivers. Source: Keysight 7 7
Slide 8: Requirements for Data Center – Energy Efficiency
Requirements for Data Center – Energy Efficiency • Biggest challenge for Data Centers – Not Speed but Reducing power consumption! • Power Usage • 40% - Server, Switch etc. • 40% - Cooling • *By 2025, Data Centers will consume 20% of Earth’s power? 8 *Data centres of the world will consume 1/5 of Ear
Slide 9: Requirements for Data Center – Energy Efficiency
Requirements for Data Center – Energy Efficiency • *Information Technology forecasted to consume about 21% of the earth’s power produced by 2030. • Data Centers and Wired Access are largest consumers. • †Global data centers used… about 3% of the total electricity (in 2016) and this consumption will
Slide 10: Requirements for Data Center – Energy Efficiency
Requirements for Data Center – Energy Efficiency • A combination of various technologies is needed. • The urgent need for Energy-Efficient Data Centers is making SiPh technology a rising star in high speed data transfer. 10 10
Slide 11: Why Silicon Photonics?
Why Silicon Photonics? • Improvements in Thin Film technologies • Ability to grow very High Quality Ge on Si • Overcoming lattice mismatch • SiGe Photodiodes (3dB BW >30GHz) • Exploiting Silicon Technologies • Low-Cost High-Volume Production • Low-Power Logic devices • High-Speed RFCMOS devices • Hi
Slide 12: SiPh Optical Transceivers for Data Centers
SiPh Optical Transceivers for Data Centers • Using light as carrier of information through optical fiber. • Components on SiPh Transceivers 1. CMOS Logic Chip • Data Encoding (also decoding) 2. Optical Transmitter • Optical Modulators - Varying voltage modulate Data onto Light • Lasers not implement
Slide 13: Why Wafer-Level Tests? Evolution of Optical Transceivers
Evolution of Optical Transceivers Why Wafer-Level Tests? • Copper wires → Optical Fibers Si Electronics- Die attach Si Photonics onto SiPh-Die IC (0.18μm?) Si Electronics (TSV) IC (7nm) Continuous Wave Laser Si Electronics Diode on IC SiPh-Die Laser Si Photonics IC Diode Fiber Array Electronics IC P
Slide 14: Integrated Photonics Transceivers
Integrated Photonics Transceivers • SiPh Optical Transceivers, US$2.3B market in 2022, CAGR >35%. SiP US$2.3B (US$1.6B) 14 14
Slide 15: General Devices for Photonics ICs
General Devices for Photonics ICs • Passives • Grating Couplers (3-6dB) • Low loss waveguides • Splitters • Wavelength selective combiners/splitters • Isolators/Circulators • Comb generators • Actives • Photodetectors (3dB bandwidth >30GHz) • Modulators • Lasers (single frequency, tunable, mode lock
Slide 16: Measurement Challenges faced by Our Photonics Customers
Measurement Challenges faced by Our Photonics Customers • Test Challenges • Fast & reliable fiber-to-device alignment • Highly accurate & repeatable data • Toggle easily between OO/OE/EE Test Setups. • DC, RF and Multi-contact probes • Manual & Motorized Positioners • Handle Single & Multiple Wafers
Slide 17: FFI SiPh Wafer-Level Measurement Solution
FFI SiPh Wafer-Level Measurement Solution FFI SIPH SOLUTION SiPh AUTONOMOUS ASSISTANT KEYSIGHT PHOTONIC APPLICATION SUITE PI 6-AXIS NANO POSITIONERS CM300XI PROBE SYSTEM WAFER-LEVEL RF TEST SOLUTION 17 17
Slide 18: FFI SiPh Wafer-Level Measurement Solution
FFI SiPh Wafer-Level Measurement Solution Integration Calibration Verification Flexibility Interoperability Custom designed mounts, FFI has developed a unique Using a defined set of Our interchangeable fiber FFI’s unique fiber holder fiber arms and holders set of calibration fixtures critical verifi
Slide 19: Calibration
Calibration • SiPh Calibration Kit, Tools and Fixtures • Custom Calibration Wafers for precision setting of Fiber height. • Fixture for easy of installation & adjustment of Fibers and Fiber Arrays. • Illumination positioner for Vision-based Optical Calibrations. • SiP-Tool Software automates… • Z Se
Slide 20: Calibration – Example θY & Z Displacement Sensor
Calibration – Example θY & Z Displacement Sensor • Measurements at different incident angles=Y±1° i.e. θY. • Quick Investigation of grating coupler’s performance. • θY rotation affects Fiber Height & Measurement Accuracy! • Z sensor must be calibrated at different θY to maintain Fiber Height accurat
Slide 21: Calibration – Example θY & Z Displacement Sensor
Calibration – Example θY & Z Displacement Sensor 21 21
Slide 22: Verification
Verification • Validates System Performance before Delivery & after Installation. • Verification Tests • Alignment Time • Power coupling repeatability • Input XY Alignment Repeatability • Output XY Alignment Repeatability • FFI is setting new standards in Wafer-level Photonics tests. 22 22
Slide 23: Flexibility
Flexibility • Unique fiber arm design provides Integrated Z flexibility displacement sensor • Engineering Tests Fiber tip Long Travel • Production Tests Angular Align* • Replaceable fiber holders support Precision XYZ piezo positioner (100x100µm travel, • Single Fiber 2nm resolution) • Fiber Array F
Slide 24: RF probes, Multi-contact Probes, Calibration Substrates
RF probes, Multi-contact Probes, Calibration Substrates Single/Dual Multi-contact RF Calibration RF Calibration RF Probes RF Probes Substrates Software • FFI is the Market Leader in Wafer-Level RF Test. • RF probes, calibration substrates and software provide a complete OE test solution for our phot
Slide 25: Interoperability
Interoperability • FFI’s Single Fiber & Array holders - Compatible with library of DC, RF and multi-contact probes & motorized positioners. • 1st to develop SiPh devices layout design rules • Min. distance for optical grating couplers & electrical test pads with different probes etc. • Leveraging on
Slide 26: Single Fiber Alignment & Measurement Demonstration
Single Fiber Alignment & Measurement Demonstration 26 26
Slide 27: Fiber Array Alignment Demonstration
Fiber Array Alignment Demonstration 27 27
Slide 28: Summary
Summary • Improving Data Center Power Efficiency is driving the Strong Demands for Silicon Photonics Integrated Circuits. • Total available market is still increasing for Integrated Photonics Transceivers, US$10B, CAGR 35% (up to 2022 forecast). • FormFactor provides a Market-Leading & Proven Photon